JPS61159743A - ワイヤボンディング方法および装置 - Google Patents

ワイヤボンディング方法および装置

Info

Publication number
JPS61159743A
JPS61159743A JP60000187A JP18785A JPS61159743A JP S61159743 A JPS61159743 A JP S61159743A JP 60000187 A JP60000187 A JP 60000187A JP 18785 A JP18785 A JP 18785A JP S61159743 A JPS61159743 A JP S61159743A
Authority
JP
Japan
Prior art keywords
wire
duct
bonding
capillary
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60000187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325020B2 (cg-RX-API-DMAC10.html
Inventor
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Mitsuo Kobayashi
三男 小林
Osamu Usuda
修 薄田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60000187A priority Critical patent/JPS61159743A/ja
Publication of JPS61159743A publication Critical patent/JPS61159743A/ja
Publication of JPH0325020B2 publication Critical patent/JPH0325020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07541—
    • H10W72/50—

Landscapes

  • Wire Bonding (AREA)
JP60000187A 1985-01-07 1985-01-07 ワイヤボンディング方法および装置 Granted JPS61159743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60000187A JPS61159743A (ja) 1985-01-07 1985-01-07 ワイヤボンディング方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60000187A JPS61159743A (ja) 1985-01-07 1985-01-07 ワイヤボンディング方法および装置

Publications (2)

Publication Number Publication Date
JPS61159743A true JPS61159743A (ja) 1986-07-19
JPH0325020B2 JPH0325020B2 (cg-RX-API-DMAC10.html) 1991-04-04

Family

ID=11466988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60000187A Granted JPS61159743A (ja) 1985-01-07 1985-01-07 ワイヤボンディング方法および装置

Country Status (1)

Country Link
JP (1) JPS61159743A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928871A (en) * 1988-02-23 1990-05-29 Emhart Deutschland Gmbh Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US4995552A (en) * 1988-06-02 1991-02-26 Samsung Electronics Co. Ltd. Anti-oxidation system of a wire bonder using a copper wire
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
US4928871A (en) * 1988-02-23 1990-05-29 Emhart Deutschland Gmbh Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US4995552A (en) * 1988-06-02 1991-02-26 Samsung Electronics Co. Ltd. Anti-oxidation system of a wire bonder using a copper wire

Also Published As

Publication number Publication date
JPH0325020B2 (cg-RX-API-DMAC10.html) 1991-04-04

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