JPS61157340U - - Google Patents
Info
- Publication number
- JPS61157340U JPS61157340U JP1985041289U JP4128985U JPS61157340U JP S61157340 U JPS61157340 U JP S61157340U JP 1985041289 U JP1985041289 U JP 1985041289U JP 4128985 U JP4128985 U JP 4128985U JP S61157340 U JPS61157340 U JP S61157340U
- Authority
- JP
- Japan
- Prior art keywords
- diode
- heat sink
- pellet
- lead
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985041289U JPS61157340U (US20110009641A1-20110113-C00185.png) | 1985-03-20 | 1985-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985041289U JPS61157340U (US20110009641A1-20110113-C00185.png) | 1985-03-20 | 1985-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61157340U true JPS61157340U (US20110009641A1-20110113-C00185.png) | 1986-09-30 |
Family
ID=30550970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985041289U Pending JPS61157340U (US20110009641A1-20110113-C00185.png) | 1985-03-20 | 1985-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61157340U (US20110009641A1-20110113-C00185.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558558A (en) * | 1978-10-24 | 1980-05-01 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6031257A (ja) * | 1983-08-01 | 1985-02-18 | Hitachi Ltd | 半導体整流装置 |
| JPS61139054A (ja) * | 1984-12-11 | 1986-06-26 | Toshiba Corp | 半導体装置 |
-
1985
- 1985-03-20 JP JP1985041289U patent/JPS61157340U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558558A (en) * | 1978-10-24 | 1980-05-01 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6031257A (ja) * | 1983-08-01 | 1985-02-18 | Hitachi Ltd | 半導体整流装置 |
| JPS61139054A (ja) * | 1984-12-11 | 1986-06-26 | Toshiba Corp | 半導体装置 |
