JPS61153371U - - Google Patents
Info
- Publication number
- JPS61153371U JPS61153371U JP3795985U JP3795985U JPS61153371U JP S61153371 U JPS61153371 U JP S61153371U JP 3795985 U JP3795985 U JP 3795985U JP 3795985 U JP3795985 U JP 3795985U JP S61153371 U JPS61153371 U JP S61153371U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- land portion
- hole
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3795985U JPS61153371U (fr) | 1985-03-15 | 1985-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3795985U JPS61153371U (fr) | 1985-03-15 | 1985-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153371U true JPS61153371U (fr) | 1986-09-22 |
Family
ID=30544520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3795985U Pending JPS61153371U (fr) | 1985-03-15 | 1985-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153371U (fr) |
-
1985
- 1985-03-15 JP JP3795985U patent/JPS61153371U/ja active Pending