JPH0195775U - - Google Patents
Info
- Publication number
- JPH0195775U JPH0195775U JP19239887U JP19239887U JPH0195775U JP H0195775 U JPH0195775 U JP H0195775U JP 19239887 U JP19239887 U JP 19239887U JP 19239887 U JP19239887 U JP 19239887U JP H0195775 U JPH0195775 U JP H0195775U
- Authority
- JP
- Japan
- Prior art keywords
- perforations
- wiring board
- printed wiring
- centers
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19239887U JPH0195775U (fr) | 1987-12-17 | 1987-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19239887U JPH0195775U (fr) | 1987-12-17 | 1987-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195775U true JPH0195775U (fr) | 1989-06-26 |
Family
ID=31483259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19239887U Pending JPH0195775U (fr) | 1987-12-17 | 1987-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195775U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216385A (ja) * | 2016-06-01 | 2017-12-07 | 三菱電機エンジニアリング株式会社 | プリント基板の製造方法 |
-
1987
- 1987-12-17 JP JP19239887U patent/JPH0195775U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216385A (ja) * | 2016-06-01 | 2017-12-07 | 三菱電機エンジニアリング株式会社 | プリント基板の製造方法 |