JPH0173944U - - Google Patents
Info
- Publication number
- JPH0173944U JPH0173944U JP1987170623U JP17062387U JPH0173944U JP H0173944 U JPH0173944 U JP H0173944U JP 1987170623 U JP1987170623 U JP 1987170623U JP 17062387 U JP17062387 U JP 17062387U JP H0173944 U JPH0173944 U JP H0173944U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor chip
- resin
- adhere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170623U JPH0173944U (fr) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170623U JPH0173944U (fr) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173944U true JPH0173944U (fr) | 1989-05-18 |
Family
ID=31461726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170623U Pending JPH0173944U (fr) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173944U (fr) |
-
1987
- 1987-11-06 JP JP1987170623U patent/JPH0173944U/ja active Pending