JPS6430878U - - Google Patents
Info
- Publication number
- JPS6430878U JPS6430878U JP12590287U JP12590287U JPS6430878U JP S6430878 U JPS6430878 U JP S6430878U JP 12590287 U JP12590287 U JP 12590287U JP 12590287 U JP12590287 U JP 12590287U JP S6430878 U JPS6430878 U JP S6430878U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- wiring board
- sealing resin
- insulating substrate
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590287U JPS6430878U (fr) | 1987-08-19 | 1987-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590287U JPS6430878U (fr) | 1987-08-19 | 1987-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430878U true JPS6430878U (fr) | 1989-02-27 |
Family
ID=31376919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12590287U Pending JPS6430878U (fr) | 1987-08-19 | 1987-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430878U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566996U (ja) * | 1992-02-07 | 1993-09-03 | ソニー株式会社 | 半導体装置 |
-
1987
- 1987-08-19 JP JP12590287U patent/JPS6430878U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566996U (ja) * | 1992-02-07 | 1993-09-03 | ソニー株式会社 | 半導体装置 |