JPS6262475U - - Google Patents
Info
- Publication number
- JPS6262475U JPS6262475U JP15385785U JP15385785U JPS6262475U JP S6262475 U JPS6262475 U JP S6262475U JP 15385785 U JP15385785 U JP 15385785U JP 15385785 U JP15385785 U JP 15385785U JP S6262475 U JPS6262475 U JP S6262475U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- wiring board
- printed wiring
- flexible printed
- soldering land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15385785U JPS6262475U (fr) | 1985-10-08 | 1985-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15385785U JPS6262475U (fr) | 1985-10-08 | 1985-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6262475U true JPS6262475U (fr) | 1987-04-17 |
Family
ID=31073118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15385785U Pending JPS6262475U (fr) | 1985-10-08 | 1985-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6262475U (fr) |
-
1985
- 1985-10-08 JP JP15385785U patent/JPS6262475U/ja active Pending