JPS6240869U - - Google Patents
Info
- Publication number
- JPS6240869U JPS6240869U JP13256385U JP13256385U JPS6240869U JP S6240869 U JPS6240869 U JP S6240869U JP 13256385 U JP13256385 U JP 13256385U JP 13256385 U JP13256385 U JP 13256385U JP S6240869 U JPS6240869 U JP S6240869U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- chip components
- shorts
- pattern structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13256385U JPS6240869U (fr) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13256385U JPS6240869U (fr) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240869U true JPS6240869U (fr) | 1987-03-11 |
Family
ID=31032067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13256385U Pending JPS6240869U (fr) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240869U (fr) |
-
1985
- 1985-08-30 JP JP13256385U patent/JPS6240869U/ja active Pending