JPS61152094A - Manufacture of printed circuit board by mechanical masking - Google Patents
Manufacture of printed circuit board by mechanical maskingInfo
- Publication number
- JPS61152094A JPS61152094A JP27332484A JP27332484A JPS61152094A JP S61152094 A JPS61152094 A JP S61152094A JP 27332484 A JP27332484 A JP 27332484A JP 27332484 A JP27332484 A JP 27332484A JP S61152094 A JPS61152094 A JP S61152094A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- circuit board
- printed circuit
- resist film
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は改良さｎた銅スルーホールめっきによるプリン
ト配線板の製造法に関する。さらにくわしくは、エツチ
ングレジストとしてゴム被膜を形成させることを特徴と
するプリント配線板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an improved method of manufacturing printed wiring boards by copper through-hole plating. More specifically, the present invention relates to a method for manufacturing a printed wiring board, which is characterized by forming a rubber film as an etching resist.
プリント配線板は半導体素子を実装する部品として不可
欠な部品でアシ、各種の方法が開発さｎている。Printed wiring boards are essential parts for mounting semiconductor elements, and various methods have been developed for the printed wiring boards.
（従来の技術）
スルーホールめっき配線板にはエツチングレジストに金
属を用いた金スルーホール、はんだスルーホール等が、
又有機レジストを用いてエツチングをした回路部が銅の
ま＼の銅スルーホール等がある。(Conventional technology) Through-hole plating wiring boards have gold through-holes using metal as etching resist, solder through-holes, etc.
There are also copper through-holes in which the circuit portion is made of copper and is etched using an organic resist.
一般的な銅張クプラスチックス製積層板プリント配線基
板の製造を次に例示する。The production of a typical copper-clad plastics laminate printed wiring board will be exemplified below.
（１） 穴あけ： （２）無電解銅めつき： （３） 一次鋼めつき： （４） レジスト膜形成： （５ン 二次銅めつき： （６）はんだめつき： （７） レジスト膜はくり； （８） エツチング： （９）はんだはく夛。(1) Drilling: (2) Electroless copper plating: (3) Primary steel plating: (4) Resist film formation: (5-n secondary copper plating: (6) Soldering: (7) Peeling off the resist film; (8) Etching: (9) Soldering.
この方法は実用上すぐｎでいるが、最近とくに公害問題
が発生し、その対策が強くのぞまｎている。Although this method is practical, pollution problems have recently occurred, and there is a strong demand for countermeasures.
本発明者はレジスト膜としてゴム被膜を形成させるメカ
ニカルマスキング方法によシ、従来技術の問題点を解消
することを知り本発明を完成した。The inventor of the present invention has completed the present invention knowing that the problems of the prior art can be solved by a mechanical masking method in which a rubber film is formed as a resist film.
（問題点を解決するための手段）
即ち本発明は
穴をあけらｎた銅張り積層板であって、無電解銅めっき
、一次鋼電解めっき、必要部分に対するレジスト膜形成
および二次銅電気めっき処理のさ几たプリント配線用基
板を製造する方法において、レジスト膜としてゴム皮膜
形成を行なわしめることを特徴とするメカニカルマスキ
ング法によるプリント基板の製造法に関する。(Means for Solving the Problems) That is, the present invention is a copper-clad laminate with holes, which is subjected to electroless copper plating, primary steel electrolytic plating, resist film formation on necessary parts, and secondary copper electroplating. The present invention relates to a method for manufacturing a printed wiring board using a mechanical masking method, which is characterized in that a rubber film is formed as a resist film in a method for manufacturing a printed wiring board that requires less processing.
即ちレジスト膜をゴム被膜によシ形成させるもので、膜
の形成やはくりが従来のレジスト膜に比し極めて容易に
行なえるという特徴がある。That is, the resist film is formed on a rubber film, and has the characteristic that the film can be formed and peeled off much more easily than conventional resist films.
（作 用）
本発明の方法は公知の方法に比して次のような利点を有
する。(Function) The method of the present invention has the following advantages over known methods.
（１］ はん雑な電気めっき工程の必要がない。(1) There is no need for a complicated electroplating process.
（２） レジスト皮膜は〈シのための公害のおそｎが
なく、公害防止対策が不要となる。(2) There is no risk of pollution due to the resist film, and no pollution prevention measures are required.
（３） ゴムレジスト皮膜はは〈シが容易である。(3) The rubber resist film is easy to peel off.
（４） ゴムレジスト皮膜は再生利用が可能であるの
で経済的に有利である。(4) Since the rubber resist film can be recycled, it is economically advantageous.
（実施例）
ゴムとしては天然ゴム、ネオプレン、ＳＢＲ等通常の合
成ゴムはすべて適用できる。(Example) As the rubber, all common synthetic rubbers such as natural rubber, neoprene, and SBR can be used.
皮膜形成は公知の手段で容易に行なえるが１次にその一
ガを示す。Film formation can be easily carried out by known means, but the first step is shown below.
天然ゴムヲ許剤にとかし、ノズルから噴出させながら、
印刷バタン上を移動させてゴムレジスト皮膜を形成した
。次に公知の手段により不用部分の銅を、エツチング液
により溶出除去して回路を形成させた。While dissolving natural rubber in a forgiving agent and squirting it from a nozzle,
A rubber resist film was formed by moving on the printing batten. Next, by known means, unnecessary portions of the copper were eluted and removed using an etching solution to form a circuit.
回路形成後はレジストとしてのゴム皮膜をはくシしてこ
のものは基び溶剤にとかして再利用した。After the circuit was formed, the rubber film as a resist was peeled off and this material was dissolved in a solvent and reused.
Claims (1)
、一次銅電解めつき、必要部分に対するレジスト膜形成
および二次銅電気めつき処理のされたプリント配線用基
板を製造する方法において、レジスト膜としてゴム皮膜
形成を行なわしめることを特徴とするメカニカルマスキ
ング法によるプリント基板の製造法。A method for producing a printed wiring board made of a copper-clad laminate with holes, which is subjected to electroless copper plating, primary copper electrolytic plating, resist film formation on necessary parts, and secondary copper electroplating. A method for manufacturing a printed circuit board using a mechanical masking method, characterized in that a rubber film is formed as a resist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27332484A JPS61152094A (en) | 1984-12-26 | 1984-12-26 | Manufacture of printed circuit board by mechanical masking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27332484A JPS61152094A (en) | 1984-12-26 | 1984-12-26 | Manufacture of printed circuit board by mechanical masking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61152094A true JPS61152094A (en) | 1986-07-10 |
Family
ID=17526291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27332484A Pending JPS61152094A (en) | 1984-12-26 | 1984-12-26 | Manufacture of printed circuit board by mechanical masking |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61152094A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124990A (en) * | 1974-08-24 | 1976-02-28 | Nippon Piston Ring Co Ltd | Kanjosozaio hankeihokoni setsudansuruhoho |
| JPS51126344A (en) * | 1975-04-28 | 1976-11-04 | Mitsubishi Electric Corp | Etching method |
-
1984
- 1984-12-26 JP JP27332484A patent/JPS61152094A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124990A (en) * | 1974-08-24 | 1976-02-28 | Nippon Piston Ring Co Ltd | Kanjosozaio hankeihokoni setsudansuruhoho |
| JPS51126344A (en) * | 1975-04-28 | 1976-11-04 | Mitsubishi Electric Corp | Etching method |
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