JPS61152032A - Artificial visual device - Google Patents

Artificial visual device

Info

Publication number
JPS61152032A
JPS61152032A JP59273086A JP27308684A JPS61152032A JP S61152032 A JPS61152032 A JP S61152032A JP 59273086 A JP59273086 A JP 59273086A JP 27308684 A JP27308684 A JP 27308684A JP S61152032 A JPS61152032 A JP S61152032A
Authority
JP
Japan
Prior art keywords
image input
input unit
pellet
optical system
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59273086A
Other languages
Japanese (ja)
Inventor
Kazuhisa Takashima
高島　一寿
Michio Tanimoto
道夫 谷本
Masakazu Ozawa
小沢　正和
Yuichi Komaba
駒場　裕一
Tetsuya Kono
哲也 河野
Ryuichi Kyomasu
隆一 京増
Nobuhiro Takasugi
高杉　信博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP59273086A priority Critical patent/JPS61152032A/en
Publication of JPS61152032A publication Critical patent/JPS61152032A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to set the optical distance from the image input unit to a visual object, which is located at a distance different from that between the image input unit and other visual object, by the same means as a means, by which the distance between the image input unit and the other visual object is set, by a method wherein an adjusting means, by which the optical distances between the first and second visual object parts and the image input unit are modified and adjusted, is provided. CONSTITUTION:A holder 4 is supported by a mechanical distance adjusting unit 10 in such a way as to be able to vertically move and the optical distances from visual objects to an image input unit 6 are modify-adjusted by making the holder 4 approach-move to an optical system 5 or by making it separation-move from the optical system 5. A pellet 23, which is used as the first visual object part, and leads 24, which are used as the second visual object part, are provided. There is some difference in the distances from the pellet 23 and the leads 24 to the optical system 5. When the focal length of the optical system 5 is set in such a state as to correspond to the distance from the image input unit 6 to the pellet 23, the image of the pellet 23 is distinctly recognized by the image input unit 6. When an image processing f the pellet 23 ends, a servomotor 14 is made to rotate and the holder 4 is made to approach-move to the optical system 5. Whereby as the focal point of the optical system 5 is brought in such a state as to coincide with the distance between the image input unit 6 and the leads 24 of an IC21, it follows that now the images of the leads 24 are distinctly recognized by the image input unit 6.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、人工視覚技術、特に、画像入力装置に対して
互いに異なる距離に位置する視覚対象部を鮮膚に認識す
る技術に関し、例えば、ワイヤボンディング装置におい
て、半導体装置（以下、ＩＣという。）おけるペレット
の電極パッドとり一ドのポンディングパッドとを認識す
るのに利用して有効な技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to artificial vision technology, particularly to a technology for clearly recognizing visual objects located at different distances from an image input device. The present invention relates to a technique that is effective for use in recognizing electrode pads on a pellet and bonding pads on a pellet in a semiconductor device (hereinafter referred to as an IC).

〔背景技術〕[Background technology]

ワイヤボンディング装置において、１系統の人工視覚装
置によりＩＣのペレットの電極パッドとリードのポンデ
ィングパッドとを認識することが、考えられる。In a wire bonding device, it is conceivable to recognize the electrode pads of the pellet of the IC and the bonding pads of the leads by one system of artificial vision devices.

しかし、ペレットとリードとの間に大きな段差が介在し
た場合には、画像入力装置に対する光学的距離がペレッ
トとリードとでは差異があるため、いずれか一方の画像
しか鮮明に認識することができないという問題点がある
ことが、本発明者によって明らかにされた。However, if there is a large step between the pellet and the lead, the optical distance to the image input device is different between the pellet and the lead, so only one image can be clearly recognized. The present inventor has revealed that there is a problem.

なお、ワイヤボンディング装置における人工視覚技術を
述べである例としては、日刊工業新聞社発行「電子部品
の自動組立入門」昭和５６年７月３０日発行、鵜澤高吉
著　Ｐ７６〜Ｐ８８、がある。An example of the artificial vision technology used in a wire bonding device is "Introduction to Automatic Assembly of Electronic Components," published by Nikkan Kogyo Shimbun, July 30, 1980, written by Takayoshi Uzawa, pages 76 to 88.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、異なる距離にある視覚対象部を鮮明に
認識することができる人工視覚技術を提供することにあ
る。An object of the present invention is to provide an artificial vision technique that allows visual objects located at different distances to be clearly recognized.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

〔発明の概要〕[Summary of the invention]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、視覚対象部と画像入力装置との光学的な距離
を変更調整する調整手段を設けることにより、異なる距
離に位置する視覚対象物に対する画像入力装置の光学的
な距離を同一に設定することができるようにしたもので
ある。That is, by providing an adjusting means for changing and adjusting the optical distance between the visual object and the image input device, it is possible to set the same optical distance of the image input device to the visual object located at different distances. It has been made possible.

〔実施例〕〔Example〕

第１図は本発明の一実施例である人工視覚装置を備えて
いるワイヤボンディング装置を示す系統図である。FIG. 1 is a system diagram showing a wire bonding apparatus equipped with an artificial vision device according to an embodiment of the present invention.

本実施例において、このワイヤボンディング装置は計測
ステージ四ンｌとボンデインダステーシッン２とを備え
ており、計測ステーション１には人工視覚装置３が設備
されている。In this embodiment, the wire bonding apparatus includes a measurement stage 4 and a bonding station 2, and the measurement station 1 is equipped with an artificial vision device 3.

すなわち、計測ステーションｌには、テレビカメラ、固
体撮像装置等からなる画像入力装置６が、視覚対象物と
してのＩＣを保持するためのホルダ４にレンズやプリズ
ム等を備えている光学系５を介して光学的に対向するよ
うに設備されており、光学系５には一定の焦点距離が設
定されている。That is, at the measurement station l, an image input device 6 consisting of a television camera, a solid-state imaging device, etc. is connected to a holder 4 for holding an IC as a visual object via an optical system 5 equipped with a lens, a prism, etc. The optical system 5 is equipped to optically face each other, and a fixed focal length is set in the optical system 5.

この画像人力装置６には、２値化処理部、平滑化処理部
等を備えている画像処理装置７が接続されており、この
画像処理装置７にはマイクロコンビエータ等からなる補
正信号発生装置８が接続されている。An image processing device 7 equipped with a binarization processing section, a smoothing processing section, etc. is connected to the image processing device 6, and a correction signal generation device consisting of a micro combinator and the like is connected to the image processing device 7. 8 are connected.

ホルダ４の上面には負圧供給手段（図示せず）に接続さ
れている吸引口９が開設されており、ホルダ４はこの吸
引口９の吸引力によりＩＣを吸着保持し得るように構成
されている。A suction port 9 connected to a negative pressure supply means (not shown) is provided on the top surface of the holder 4, and the holder 4 is configured so that the IC can be suctioned and held by the suction force of the suction port 9. ing.

ホルダ４は光学的距離調整手段としての機械的　　　　
　　　□距離調整装置１０により昇降可能に支持されて
おり、光学系５に対して接近、離反移動することにより
、画像入力装置６に対する光学的な距離を変更調整され
るようになっている。すなわち、ホルダ４の近傍にはフ
レーム１１が配設されており、このフレーム１１にはホ
ルダ４を固着されている昇降体１２がガイドレール１３
を介して昇降自在に支持されている。昇降体１２にはサ
ーボモータ１４により正逆回転駆動される送りねじ軸１
５が螺合されており、昇降体１２はサーボモータ１４の
回転にしたがって送りねじ軸１５により昇降し、ホルダ
４を昇降させて光学系５に接近、離反するように構成さ
れている。The holder 4 is a mechanical
□It is supported so as to be movable up and down by a distance adjustment device 10, and by moving toward and away from the optical system 5, the optical distance to the image input device 6 can be changed and adjusted. That is, a frame 11 is disposed near the holder 4, and the elevating body 12 to which the holder 4 is fixed is mounted on the guide rail 13.
It is supported so that it can be raised and lowered freely. The elevating body 12 has a feed screw shaft 1 which is driven to rotate forward and backward by a servo motor 14.
5 are screwed together, and the elevating body 12 is configured to be raised and lowered by a feed screw shaft 15 as the servo motor 14 rotates, and to raise and lower the holder 4 to approach and move away from the optical system 5.

一方、ボンデインダステーシッン２には、ワイヤボンデ
ィングを実施するためのボンディング工具としてのキャ
ピラリ１６を作動させるボンディングヘッド１７と、駆
動装置１８によりＸＹ方向に移動されるＸＹテーブル１
９とが設備されており、ボンディングヘッド１７と駆動
装置１９とは協働してワイヤボンディングを実施するよ
うにコントローラ２０により制御されるようになってい
る。このコントローラ２０の一入力端には計測スされて
いる。On the other hand, the bonding station 2 includes a bonding head 17 that operates a capillary 16 as a bonding tool for performing wire bonding, and an XY table 1 that is moved in the XY direction by a drive device 18.
9 is provided, and the bonding head 17 and drive device 19 are controlled by a controller 20 so as to cooperate to perform wire bonding. One input terminal of this controller 20 has a measurement terminal.

被ボンデイング物としてのＩＣ２１は絶縁基板等からな
るベース２２を備えており、ベース２２の上面には第１
視覚対象部としてのペレット２３と、第２視覚対象部と
してのリード２４とが設けられている。ペレット２３と
リード２４との間には段差があり、したがって、ＩＣ２
１が光学系５に対向する状態において、ペレット２３と
リード２４との光学系５までの距離には差異が生ずるこ
とになる。The IC 21 as an object to be bonded has a base 22 made of an insulating substrate or the like, and a first
A pellet 23 as a visual target part and a lead 24 as a second visual target part are provided. There is a step between the pellet 23 and the lead 24, so the IC2
1 faces the optical system 5, there will be a difference in the distances between the pellet 23 and the lead 24 to the optical system 5.

次に作用を説明する。Next, the action will be explained.

ＩＣ２１がホルダ４上に吸着保持され、照明装置（図示
せず）により所定の照明がなされると、画像入力装置６
は光学系５を通してペレット２３力）らの反射光を電極
パッドに関する情報として認識する。このとき、光学系
５の焦点距離がペレット２３までの距離に対応するよう
に設定されているため、画像入力装置６はペレット２３
における所定位置おける電極パッドの画像を鮮明に認識
すみことになふ− この画像人力袋ｒ８．６のペレット２３がらの反射光に
よる画像情報は画像処理装置７において処理され、補正
信号発生装置８にインプットされる。When the IC 21 is suctioned and held on the holder 4 and is illuminated in a predetermined manner by a lighting device (not shown), the image input device 6
passes through the optical system 5 and recognizes the reflected light from the pellets 23) as information regarding the electrode pads. At this time, since the focal length of the optical system 5 is set to correspond to the distance to the pellet 23, the image input device 6
The image information of the electrode pad at a predetermined position in the image is processed by the image processing device 7 and sent to the correction signal generating device 8. is input.

補正信号発生装置８はペレット２３における電極バンド
についてのこのようにして計測された実際の位置と、予
め記憶されている基準位置とを比較し、その差から補正
すべき値を求め、当該補正信号をボンディングステーシ
ョンｌにおけるコントローラ２０に転送する。The correction signal generator 8 compares the actual position of the electrode band on the pellet 23 measured in this manner with a reference position stored in advance, calculates a value to be corrected from the difference, and generates the correction signal. is transferred to the controller 20 at bonding station l.

ペレット２３についての画像処理が終了すると、サーボ
モータ１４が回転され、ホルダ４の上昇によってＩＣ２
１が光学系５に接近する方向に移動される。この接近移
動により、光学系５の焦点はＩＣ２１のリード２４に合
致することになるため、今度は画像入力装置６はリード
２４を鮮明に認識することになる。When the image processing for the pellet 23 is completed, the servo motor 14 is rotated, and the holder 4 is raised to
1 is moved in a direction approaching the optical system 5. Due to this approach movement, the focus of the optical system 5 will match the lead 24 of the IC 21, so that the image input device 6 will now clearly recognize the lead 24.

このリード２４犯ついての画像処理はペレット２３の場
合と同様に実行され、計測された画像と予め記憶された
基準値との比較演算に基づいて発生された所定の補正信
号がボンディングステーションｌにおけるコントローラ
２０に転送されるごとになる。Image processing for the lead 24 is performed in the same way as for the pellet 23, and a predetermined correction signal generated based on a comparison calculation between the measured image and a pre-stored reference value is sent to the controller at the bonding station l. Every time it is transferred to 20.

ＩＣ２１のペレット２３およびリード２４についての計
測が終了すると、ＩＣ２１はホルダ４から脱装され、ホ
ルダ４および画像入力装置６等は次のＩＣ２１について
の計測作業に待機する。When the measurement of the pellet 23 and lead 24 of the IC 21 is completed, the IC 21 is removed from the holder 4, and the holder 4, image input device 6, etc. stand by for measurement work for the next IC 21.

計測を完了したＩＣ２１がボンディングステーション１
におけるＸＹテーブル１９上に保持されアライメントさ
れると、コントローラ２ｏは記憶されている当該ＩＣ２
１に関する補正信号を読み出し、これに基づき所定の制
御信号をボンディングヘッド１７、ＸＹテーブル駆動装
置１８に指令する。この指令により、ボンディングヘッ
ド１７および駆動装置１８はキャピラリ１６およびＸＹ
テーブル１９を連携してそれぞれ作動させる。The IC21 that has completed the measurement is the bonding station 1.
When the controller 2o is held and aligned on the XY table 19 at
1 is read out, and based on this, a predetermined control signal is commanded to the bonding head 17 and the XY table driving device 18. With this command, the bonding head 17 and the drive device 18 are connected to the capillary 16 and the
The tables 19 are operated in conjunction with each other.

このようにして、キャピラリ１６およびＸＹテーブル１
９は協働してワイヤボンディング作業を実行するが、ペ
レット２３およびリード２４に位置ずれ等が存在してい
ても、前記補正信号により、キャピラリ１６とＸＹテー
ブル１９の作動が補正されているため、ワイヤボンディ
ング作業は正確に実行されることになる。In this way, capillary 16 and XY table 1
9 work together to perform the wire bonding work, but even if there is a positional deviation or the like in the pellet 23 and the lead 24, the operation of the capillary 16 and the XY table 19 is corrected by the correction signal. Wire bonding operations will be performed accurately.

〔効果〕〔effect〕

（１１視覚対象部と画像入力装置との光学的な距離を変
更調整する調整手段を設けることにより、異なる距離に
位置する視覚対象物に対する画像入力装置の光学的な距
離を同一に設定することができるため、画像入力装置に
対して異なる距離に位置する視覚対象部について、いず
れも鮮明な画像を得ることができる。(11 By providing an adjusting means for changing and adjusting the optical distance between the visual object and the image input device, it is possible to set the same optical distance of the image input device to the visual object located at different distances. Therefore, clear images can be obtained for visual target parts located at different distances with respect to the image input device.

（２１１Ｃのペレットとリードとについていずれも鮮明
な画像を得ることにより、ペレットとリードとの両方に
ついて位置ずれを補正することができるため、ワイヤボ
ンディングの精度を高めることができる。(By obtaining clear images for both the 211C pellet and the lead, it is possible to correct positional deviations for both the pellet and the lead, thereby increasing the accuracy of wire bonding.

（３）　　視覚対象部と画像入力装置との光学的な距離
を変更調整する調整手段として、視覚対象部と画像入力
装置との機械的距離を相対的に変更調整する装置を用い
ることにより、光学的距離調整手段の構成を簡単化する
ことができる。(3) By using a device that relatively changes and adjusts the mechanical distance between the visual target part and the image input device as an adjusting means for changing and adjusting the optical distance between the visual target part and the image input device, The configuration of the target distance adjustment means can be simplified.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

例えば、視覚対象部と画像入力装置との機械的距離を相
対的に変更調整する装置は、視覚対象部の方を移動させ
るように構成するに限らず、画像入力装置および光学系
の方を移動させるように構成してもよい。For example, a device that relatively changes and adjusts the mechanical distance between the visual target part and the image input device is configured not only to move the visual target part, but also to move the image input device and the optical system. It may also be configured to allow

視覚対象部と画像入力装置との光学的な距離を変更調整
する調整手段は、視覚対象部と画像入力装置との機械的
距離を相対的に変更調整する装置を用いるに限らず、光
学系の光路長を変更調整するように構成してもよい。Adjustment means for changing and adjusting the optical distance between the visual target part and the image input device are not limited to using a device that relatively changes and adjusting the mechanical distance between the visual target part and the image input device, but can also be used to adjust the optical distance between the visual target part and the image input device. It may be configured to change and adjust the optical path length.

〔利用分野〕[Application field]

以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるワイヤボンディング
装置における人工視覚装置に適用した場合について説明
したが、それに限定されるものではなく、ペレットボン
ディング装置における人工視覚装置等にも適用すること
ができる。In the above explanation, the invention made by the present inventor was mainly applied to an artificial vision device in a wire bonding machine, which is the background field of application. It can also be applied to artificial visual devices and the like.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例である人工視覚装置を備えて
いるワイヤボンディング装置を示す系統図である。 ｌ・・・計測ステーション、２・・・ボンディングステ
ーション、３・・・人工視覚装置、４・・・・ホルダ、
５・・・光学系、６・・・画像入力装置、７・・・画像
処理装置、８・・・補正信号発生装置、９・・・吸引口
、１０・・・機械的距離調整装置（光学的距離調整手段
）、１１・・・フレーム、１２・・・昇降体、１３・・
・ガイドレール、１４・・・サーボモータ、１５・・・
送りねじ軸、１６・・・キャピラリ（ボンディング工具
）、１７・・・ボンディングヘッド、１８・・・駆動装
置、１９・・・ＸＹテーブル、２０コントローラ、２１
・・・ＩＣ（被ボンデイング物）、２２・・・ベース、
２３・・・ペレット（第１視覚対象部）、２４・・・リ
ード（第２視覚′、１〜FIG. 1 is a system diagram showing a wire bonding apparatus equipped with an artificial vision device according to an embodiment of the present invention. l...Measuring station, 2...Bonding station, 3...Artificial vision device, 4...Holder,
5... Optical system, 6... Image input device, 7... Image processing device, 8... Correction signal generator, 9... Suction port, 10... Mechanical distance adjustment device (optical target distance adjustment means), 11...frame, 12...elevating body, 13...
・Guide rail, 14... Servo motor, 15...
Feed screw shaft, 16... Capillary (bonding tool), 17... Bonding head, 18... Drive device, 19... XY table, 20 Controller, 21
...IC (object to be bonded), 22...Base,
23... Pellet (first visual target part), 24... Lead (second visual target', 1~

Claims (1)

【特許請求の範囲】 １、視覚対象部と画像入力装置との光学的な距離を変更
調整する調整手段を備えていることを特徴とする人工視
覚装置。 ２、光学的距離調整手段が、視覚対象部と画像入力装置
との機械的距離を相対的に変更調整するように構成され
ていることを特徴とする特許請求の範囲第１項記載の人
工視覚装置。 ３、光学的距離調整手段が、光学系の光路長を変更調整
するように構成されていることを特徴とする特許請求の
範囲第１項記載の人工視覚装置。[Scope of Claims] 1. An artificial vision device characterized by comprising an adjustment means for changing and adjusting an optical distance between a visual target part and an image input device. 2. The artificial vision according to claim 1, wherein the optical distance adjustment means is configured to relatively change and adjust the mechanical distance between the visual target part and the image input device. Device. 3. The artificial vision device according to claim 1, wherein the optical distance adjustment means is configured to change and adjust the optical path length of the optical system.
JP59273086A 1984-12-26 1984-12-26 Artificial visual device Pending JPS61152032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273086A JPS61152032A (en) 1984-12-26 1984-12-26 Artificial visual device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273086A JPS61152032A (en) 1984-12-26 1984-12-26 Artificial visual device

Publications (1)

Publication Number Publication Date
JPS61152032A true JPS61152032A (en) 1986-07-10

Family

ID=17522946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273086A Pending JPS61152032A (en) 1984-12-26 1984-12-26 Artificial visual device

Country Status (1)

Country Link
JP (1) JPS61152032A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161720A (en) * 1993-12-10 1995-06-23 Nec Corp Semiconductor device and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161720A (en) * 1993-12-10 1995-06-23 Nec Corp Semiconductor device and its manufacture

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