CN211088205U - Laser bonding equipment of tearing open - Google Patents
Laser bonding equipment of tearing open Download PDFInfo
- Publication number
- CN211088205U CN211088205U CN201922441703.9U CN201922441703U CN211088205U CN 211088205 U CN211088205 U CN 211088205U CN 201922441703 U CN201922441703 U CN 201922441703U CN 211088205 U CN211088205 U CN 211088205U
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- laser
- processing device
- laser processing
- controlling
- bonding
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- 238000012545 processing Methods 0.000 claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 25
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
The utility model discloses a bonding equipment is torn open to laser, include: the fixing frame is used for fixing the laser processing device; the laser processing device is arranged on the fixing frame and is used for carrying out photoresist removing treatment on the bonding photoresist; the optical ranging device is arranged on a processing part of the laser processing device and used for measuring the distance between the processing part and the wafer bonding glue; the clamping device is arranged on the fixing frame and used for positioning the wafer; and the control system is connected with the laser processing device and the clamping device and is used for controlling the laser processing device and the clamping device. The utility model discloses a laser "cold" processing characteristic is through handling the laser beam plastic on the bonding glue film for the bonding glue is lost and is glued.
Description
Technical Field
The utility model relates to a break and bond technical field, specifically relate to a laser breaks and bonds equipment.
Background
Wafer debonding techniques have been proposed for many years, but are still not well-established in their selection. At present, the main technical modes comprise mechanical bonding removal, thermal sliding bonding removal, high-power laser bonding removal and chemical bonding removal.
(1) Mechanical break-and-bond joint
The mechanical bond-breaking method mainly utilizes the means of mechanical tray and air flow to strip the adhesive layer, and is characterized in that the method can be carried out at room temperature, the thickness of the wafer can be below 50 mu m, but the yield is low, the equipment is expensive, and the requirement on temporary bonding materials is high.
(2) Thermal sliding debonding bond
The thermal slip stripping mainly utilizes a heating stripping mode, the equipment price is relatively low, but the manufacturing of ultrathin wafers with the thickness of less than 100 microns is difficult to realize, the damage to products is large due to continuous high temperature, the yield is low, the comprehensive physical property requirement of materials is high, and the comprehensive physical property requirement of temporary bonding materials is high.
(3) High power laser debonding bond
The high-power laser bond breaking principle is that laser irradiates the bonding adhesive, the peeling of the adhesive layer is realized by utilizing a photo-thermal conversion mechanism, the current main process is to realize the bonding peeling by applying ultraviolet laser, and the high-power ultraviolet laser is expensive.
(4) Chemical debonding of bonds
The chemical solvent bonding and debonding mainly adopts a chemical solvent dissolving mode to remove the glue layer, and has the characteristics of small dependence on equipment, low cost, low production efficiency, low yield, limited product in process application and high design requirement of the perforated substrate.
In summary, the above conventional debonding methods all have a relatively large disadvantage.
SUMMERY OF THE UTILITY MODEL
The utility model provides a bonding equipment is torn open to laser has solved traditional method yield of tearing open bonding lower, and equipment is expensive, and the shortcoming such as rerum natura and technological property requirement height are synthesized to interim bonding material.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a laser debonding apparatus including: the fixing frame is used for fixing the laser processing device; the laser processing device is arranged on the fixing frame and is used for carrying out photoresist removing treatment on the bonding photoresist; the optical ranging device is arranged on a processing part of the laser processing device and used for measuring the distance between the processing part and the wafer bonding glue; the clamping device is arranged on the fixing frame and used for positioning the wafer; and the control system is connected with the laser processing device and the clamping device and is used for controlling the laser processing device and the clamping device.
Preferably, the fixing frame comprises a base frame, an upright post arranged on the base frame, and a cross beam arranged on the upright post; wherein the control system is mounted below the base frame.
Preferably, the laser processing device comprises a laser for emitting a laser beam, an adjustable beam expander for changing the diameter and the divergence angle of the laser beam, a deformable mirror for shaping and controlling the optical parameters of the laser beam, a reflecting mirror for changing the size of the laser processing device, a galvanometer component for controlling the path of the laser beam and a focusing mirror for processing.
Preferably, the galvanometer component comprises a galvanometer drive for controlling the galvanometer, a deformable mirror drive for controlling the deformable mirror, a controller for controlling the galvanometer drive and the deformable mirror drive, and upper software for controlling the controller.
Preferably, the device further comprises a Z-axis driving mechanism for controlling the focusing mirror to move up and down, and the Z-axis driving mechanism is connected with the control system.
Preferably, the optical distance measuring device can also be used for measuring the thickness of the bonding glue.
Preferably, the clamping device comprises a base plate arranged on the base frame, and an X/Y axis driving mechanism arranged on the base plate;
The wafer is placed on an X/Y axis driving mechanism, and the Z/Y axis driving mechanism is connected with a control system.
Preferably, the device further comprises a camera for photographing and positioning the wafer, wherein the camera is mounted on the processing head of the laser processing device.
Preferably, the laser processing apparatus further comprises a cooling device for dissipating heat from the laser processing apparatus.
The utility model discloses another purpose is: a method of separating a laser debonding apparatus, comprising the steps of:
S1, manually placing the wafer on a clamp on an X/Y axis driving mechanism and positioning the wafer, wherein the X/Y axis driving mechanism moves to move the wafer to a position right below a processing part of the laser processing device;
S2, photographing and positioning the wafer by using a camera, measuring the distance of the bonding glue on the wafer by using an optical distance measuring device, and calculating the thickness of the bonding glue;
S3, driving the focusing mirror to move up and down by the Z-axis driving structure, and determining a focusing point of the focusing mirror;
S4, the control system sends a signal to the laser, the laser emits a laser beam, the laser beam is well adjusted by the beam expander, the reflector and the deformable mirror, and then the bonding glue is subjected to glue removing treatment by the vibrating mirror assembly and the focusing mirror;
Wherein, the heat generated when the laser processing device works is cooled and taken away by the cooling device.
Compared with the prior art, the utility model discloses a laser "cold" processing characteristic is through handling the laser beam plastic on the bonded glue film of using for the bonded glue is lost and is glued.
Because the focusing capacity of the ultrafast laser is strong, the optical diffraction limit can be broken through, the focusing accuracy is strong, the wafer and the glass substrate cannot be damaged in the processing process, and the glass substrate can be recycled.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of one embodiment of the present invention.
Fig. 2 is a schematic view of an optical path of a laser processing apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic view of a galvanometer adjustment structure according to one embodiment of the present invention.
Fig. 4 is a control system topology diagram according to an embodiment of the present invention.
Fig. 5 is a schematic view of an optical distance measuring device according to an embodiment of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
The utility model provides a bonding equipment is torn open to laser, include: the fixing frame is used for fixing the laser processing device; the laser processing device is arranged on the fixing frame and is used for carrying out photoresist removing treatment on the bonding photoresist; the optical ranging device is arranged on a processing part of the laser processing device and used for measuring the distance between the processing part and the wafer bonding glue; the clamping device is arranged on the fixing frame and used for positioning the wafer; and the control system is connected with the laser processing device and the clamping device and is used for controlling the laser processing device and the clamping device. The utility model discloses a research light beam plastic technique, light parameter control, multiaxis motion cooperative control technique, the key technique is closed in the key technique is torn open to laser such as the technique of tearing open the bonding, solves the key problem in the laser tears open the bonding.
The laser bonding apparatus provided by the present invention is described in detail with reference to the accompanying drawings by specific embodiments and applications.
As shown in fig. 1, the utility model provides a pair of laser bonding equipment of tearing open, include: the fixing frame is used for fixing the laser processing device; the laser processing device is arranged on the fixing frame and is used for carrying out photoresist removing treatment on the bonding photoresist; the optical ranging device 11 is installed on a processing part of the laser processing device and is used for measuring the distance between the processing part and the wafer bonding glue; the clamping device is arranged on the fixing frame and used for positioning the wafer; and the control system 2 is connected with the laser processing device and the clamping device and is used for controlling the laser processing device and the clamping device.
It can be understood that, in the embodiment of the present invention, the fixing frame includes a base frame 1, a column 3 disposed on the base frame 1, and a beam 5 disposed on the column 3;
Optionally, in the embodiment of the present invention, the control system 2 is installed below the base frame 1.
It can be understood that, as shown in fig. 2, an embodiment of the present invention provides a schematic optical path diagram of a laser processing apparatus, which includes a laser 6 for emitting a laser beam, a beam adjusting assembly 7, a reflecting mirror 9 for changing the size of the laser processing apparatus, and a focusing mirror 19 for processing. The beam expander 17 and the deformable mirror 18 are used for shaping and adjusting the quality of the laser beam, so that the laser beam meets the processing requirement.
The beam conditioning assembly 7 includes an adjustable beam expander 17 for changing the diameter and divergence angle of the laser beam, and a deformable mirror 18 for shaping and parameter control of the laser beam.
Optionally, as shown in fig. 3, the embodiment of the present invention provides a structure diagram for adjusting a galvanometer, wherein the path of the laser beam needs to be controlled in order to enable the laser processing device to remove the bonding glue from all sides, and therefore, in the embodiment of the present invention, the laser processing device further includes a galvanometer assembly 10 for controlling the path of the laser beam.
It can be understood that in the embodiment of the present invention, the mirror vibration assembly includes a mirror vibration drive for controlling the mirror vibration, a controller for controlling the mirror vibration drive and the mirror deformation drive, and upper software for controlling the controller.
As shown in fig. 3, in the schematic diagram of the galvanometer adjusting structure provided by the embodiment of the present invention, the galvanometer is moved by software to change the change of the optical path.
Under the control of software, reshaping the incident laser beam according to actual requirements, adjusting the deformable mirror 18, acquiring position information of the deformable mirror by the driving of the deformable mirror, sending the position information to the controller, and driving the deformable mirror by the driving of the deformable mirror under the control of the controller; when the galvanometer needs to be changed, the X/Y axis information of the galvanometer is obtained and fed back to the controller through the galvanometer drive, and the galvanometer is adjusted through the galvanometer drive under the control of the controller.
It can be understood, in order to guarantee the accurate nature of laser beam machining, need adjust the processing position, make laser beam's focus point treat the processing position, consequently, the utility model discloses an embodiment, laser beam machining device is still including being used for controlling the Z axle actuating mechanism 8 that the focus mirror reciprocated, Z axle actuating mechanism 8 is connected with control system 2.
Optionally, the optical distance measuring device 11 may also be used to measure the thickness of the bonding paste.
The utility model discloses an optical ranging device adopted the sensor that can discern the upper and lower face reverberation of glass, solved and lead to the unsafe problem of measuring distance because of the multilayer reverberation. The height information of the lower surface of the glass can be accurately measured by software according to the reflected light of the surface of the glass by increasing the light quantity control in the measuring program, and the reflected light of the upper surface and the lower surface of the glass can be displayed on different positions on the measuring target surface. As shown in fig. 5, the effect diagram of the optical ranging of the present invention is shown.
It can be understood that in order to ensure that the wafer is manually placed in the clamping device and moved to the position to be processed, the clamping device needs to be movable, and therefore, in the embodiment provided by the present invention, the clamping device comprises a bottom plate 15 set on the base frame 1, an X/Y axis driving mechanism 13 set on the bottom plate 15, and a glass substrate 14 set on the X/Y axis driving mechanism 13;
It will be appreciated that the wafer is placed on an X/Y axis drive mechanism, which is connected to a control system.
Optionally, the system further comprises a camera 12 for photographing and positioning the wafer, wherein the camera 12 is installed on the processing position of the laser processing device.
Optionally, the laser instrument can produce a large amount of heats at the during operation, if do not cool down for a long time and come out, laser instrument 6 works in high temperature environment, long-term in the past, can harm the laser instrument, consequently, the utility model discloses an in the embodiment, still including being used for the radiating cooling device of laser beam machining device.
As shown in fig. 1 to 4, the present invention further provides a separation method of a laser debonding and bonding apparatus, comprising the following steps:
S1, manually placing the wafer on a clamp on the X/Y axis driving mechanism 13 and positioning the wafer, and moving the X/Y axis driving mechanism 13 to move the wafer to be right below the processing part of the laser processing device;
S2, photographing and positioning the wafer by using a camera, measuring the distance of the bonding glue on the wafer by using an optical distance measuring device 11, and calculating the thickness of the bonding glue;
S3, the Z-axis driving structure 14 drives the focusing mirror 19 to move up and down, and the focusing point of the focusing mirror 19 is determined;
S4, the control system 2 sends a signal to the laser 6, the laser 6 emits a laser beam, the laser beam is well adjusted by the beam expander 17, the reflector 9 and the deformable mirror 18, and then the bonding glue is subjected to glue removing treatment by the vibrating mirror assembly 10 and the focusing mirror 19;
Wherein, the heat generated when the laser processing device works is cooled and taken away by the cooling device 4.
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments. It can be applicable to various and be fit for the utility model discloses a field completely. Additional modifications will readily occur to those skilled in the art. The invention is therefore not to be limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (9)
1. A laser debonding apparatus comprising:
The fixing frame is used for fixing the laser processing device;
The laser processing device is arranged on the fixing frame and is used for carrying out photoresist removing treatment on the bonding photoresist;
The optical ranging device is arranged on a processing part of the laser processing device and used for measuring the distance between the processing part and the wafer bonding glue;
The clamping device is arranged on the fixing frame and used for positioning the wafer;
And the control system is connected with the laser processing device and the clamping device and is used for controlling the laser processing device and the clamping device.
2. The laser key-removing device according to claim 1, wherein the fixing frame comprises a base frame, a column provided on the base frame, a beam provided on the column;
Wherein the control system is mounted below the base frame.
3. The laser debonding apparatus of claim 1, wherein the laser processing device comprises a laser for emitting a laser beam, a beam adjustment assembly, a mirror for changing the size of the laser processing device, and a focusing mirror for processing;
The light beam adjusting assembly comprises an adjustable beam expanding lens and a deformable lens, wherein the adjustable beam expanding lens is used for changing the diameter and the divergence angle of the laser beam, and the deformable lens is used for shaping the laser beam and controlling the optical parameter.
4. The laser debonding apparatus of claim 3, wherein the laser processing device further comprises a galvanometer assembly for controlling the path of the laser beam, the galvanometer assembly comprising a galvanometer drive for controlling the galvanometer, a deformable mirror drive for controlling the deformable mirror, a controller for controlling the galvanometer drive and the deformable mirror drive, and software installed in the controller.
5. The laser bonding apparatus according to claim 3 or 4, wherein the laser processing device further comprises a Z-axis driving mechanism for controlling the focusing mirror to move up and down, and the Z-axis driving mechanism is connected with the control system.
6. The laser debonding apparatus of claim 1 wherein the optical ranging device may also be used to measure the thickness of the bonding paste.
7. The laser debonding apparatus of claim 1 or 2, wherein the clamping device comprises a base plate established on the base frame, an X/Y axis driving mechanism established on the base plate, a glass substrate established on the X/Y axis driving mechanism;
The wafer is placed on the X/Y axis driving mechanism, and the Z/Y axis driving mechanism is connected with the control system.
8. The laser debonding apparatus of claim 1 further comprising a camera for positioning a photograph of a wafer, said camera being mounted on the processing head of the laser processing device.
9. The laser debonding apparatus of claim 1 further comprising a cooling device for dissipating heat from the laser processing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441703.9U CN211088205U (en) | 2019-12-28 | 2019-12-28 | Laser bonding equipment of tearing open |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441703.9U CN211088205U (en) | 2019-12-28 | 2019-12-28 | Laser bonding equipment of tearing open |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211088205U true CN211088205U (en) | 2020-07-24 |
Family
ID=71632175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922441703.9U Expired - Fee Related CN211088205U (en) | 2019-12-28 | 2019-12-28 | Laser bonding equipment of tearing open |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211088205U (en) |
-
2019
- 2019-12-28 CN CN201922441703.9U patent/CN211088205U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200724 |