JPS61150382A - 触覚センサと基板との接続方法 - Google Patents

触覚センサと基板との接続方法

Info

Publication number
JPS61150382A
JPS61150382A JP59272026A JP27202684A JPS61150382A JP S61150382 A JPS61150382 A JP S61150382A JP 59272026 A JP59272026 A JP 59272026A JP 27202684 A JP27202684 A JP 27202684A JP S61150382 A JPS61150382 A JP S61150382A
Authority
JP
Japan
Prior art keywords
cell
substrate
groove
wiring
tactile sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59272026A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446466B2 (enrdf_load_stackoverflow
Inventor
Tsuneki Shinokura
篠倉　恒樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP59272026A priority Critical patent/JPS61150382A/ja
Publication of JPS61150382A publication Critical patent/JPS61150382A/ja
Publication of JPH0446466B2 publication Critical patent/JPH0446466B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP59272026A 1984-12-25 1984-12-25 触覚センサと基板との接続方法 Granted JPS61150382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59272026A JPS61150382A (ja) 1984-12-25 1984-12-25 触覚センサと基板との接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59272026A JPS61150382A (ja) 1984-12-25 1984-12-25 触覚センサと基板との接続方法

Publications (2)

Publication Number Publication Date
JPS61150382A true JPS61150382A (ja) 1986-07-09
JPH0446466B2 JPH0446466B2 (enrdf_load_stackoverflow) 1992-07-30

Family

ID=17508091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59272026A Granted JPS61150382A (ja) 1984-12-25 1984-12-25 触覚センサと基板との接続方法

Country Status (1)

Country Link
JP (1) JPS61150382A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04204025A (ja) * 1990-11-30 1992-07-24 Agency Of Ind Science & Technol 触覚センサの受圧部接合方法
WO2005068958A1 (en) * 2004-01-05 2005-07-28 Case Western Reserve University Structure and method for packaging micro strain sensors
JP4750131B2 (ja) * 2004-12-22 2011-08-17 ハネウェル・インターナショナル・インコーポレーテッド ３軸磁気センサのための単一パッケージの設計

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04204025A (ja) * 1990-11-30 1992-07-24 Agency Of Ind Science & Technol 触覚センサの受圧部接合方法
WO2005068958A1 (en) * 2004-01-05 2005-07-28 Case Western Reserve University Structure and method for packaging micro strain sensors
JP4750131B2 (ja) * 2004-12-22 2011-08-17 ハネウェル・インターナショナル・インコーポレーテッド ３軸磁気センサのための単一パッケージの設計
KR101167490B1 (ko) 2004-12-22 2012-07-19 허니웰 인터내셔널 인코포레이티드 3축 자기 센서를 위한 단일 패키지 디자인

Also Published As

Publication number Publication date
JPH0446466B2 (enrdf_load_stackoverflow) 1992-07-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term