JPS61150346A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPS61150346A JPS61150346A JP27842384A JP27842384A JPS61150346A JP S61150346 A JPS61150346 A JP S61150346A JP 27842384 A JP27842384 A JP 27842384A JP 27842384 A JP27842384 A JP 27842384A JP S61150346 A JPS61150346 A JP S61150346A
- Authority
- JP
- Japan
- Prior art keywords
- probes
- probe card
- board
- probe
- electrical characteristics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、プローブカードに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a probe card.
従来、半導体素子の電気特性を測定するプローブカード
として、第４図（４）の）に示す構造のものが使用され
ている。このプローブカードは、円板形のプローブ基板
１０片面に環状の樹脂封止層２を形成し、この樹脂封止
層２によって複数本の検出針３を所定の放射状の配置に
して固定している。この検出針３の配置は、測定する半
導体素子の被測定部に対応して正確に設定されている。Conventionally, a probe card having the structure shown in FIG. 4 (4) has been used as a probe card for measuring the electrical characteristics of a semiconductor element. In this probe card, an annular resin sealing layer 2 is formed on one side of a disk-shaped probe substrate 10, and a plurality of detection needles 3 are fixed in a predetermined radial arrangement by the resin sealing layer 2. . The arrangement of the detection needle 3 is set accurately in accordance with the part to be measured of the semiconductor element to be measured.
検出針３には、図示しない信号移送手段が接続されてい
る。A signal transfer means (not shown) is connected to the detection needle 3.
このように構成されたプローブカード互では、測定の際
に検出針３に熱が加わると、自然放散によりて除去され
るだけであるため、検出針３は熱歪を受けてその固定位
置を変化してしまう。With probe cards configured in this way, if heat is applied to the detection needle 3 during measurement, it will simply be removed by natural dissipation, so the detection needle 3 will undergo thermal strain and change its fixed position. Resulting in.
その結果、素子の電気特性上正確に測定できない問題が
あった。この間＠を解消するために、樹脂封止層２の種
類を創建時に検出針３に加わる熱を円滑に除去し得るも
のに設定することが考えられている。しかしながら、検
出針３の位置変化が生じない程度に熱を十分に除去し得
る樹脂封止層２を作ることは不可能であった。As a result, there was a problem in that it was not possible to accurately measure the electrical characteristics of the element. In order to eliminate this problem, it has been considered to set the type of resin sealing layer 2 to one that can smoothly remove the heat applied to the detection needle 3 during construction. However, it has been impossible to create a resin sealing layer 2 that can remove enough heat to prevent the position of the detection needle 3 from changing.
本発明は、素子の電気特性を測定する検出針の固定位置
が熱歪によりて変化をするのを防止して、高い精度で電
気特性の測定を行うことができるプローブカードを提供
することをその目的とするものである。An object of the present invention is to provide a probe card that can prevent the fixed position of a detection needle for measuring the electrical characteristics of an element from changing due to thermal strain, and can measure the electrical characteristics with high precision. This is the purpose.
本発明は、検出針に伝わる熱を検出針から除去する熱除
去手段を設けたことによシ、検出針の固定位置が熱歪に
よって変化するのを防止して、高い精度で素子の電気特
性を測定することができるプローブカードである。By providing a heat removal means for removing the heat transmitted to the detection needle from the detection needle, the present invention prevents the fixing position of the detection needle from changing due to thermal distortion and accurately characterizes the electrical characteristics of the element. It is a probe card that can measure
以下、本発明の実施例について図面を参照して説明する
。第１図（８）は、本発明の一実施例の平面図、同図（
Ｂ）は、同実施例の正面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 (8) is a plan view of one embodiment of the present invention, and FIG.
B) is a front view of the same embodiment.
図中１０は、円板からなるプローブ基板である。In the figure, numeral 10 is a probe board made of a disk.
プローブ基板１０の片面の中央部には、環状の樹脂封止
層１１が形成されている。樹脂封止層１１には、これを
貫挿してプローブ基板１０の中心部分から所定の放射状
の配置になるようにして、複数本の検出針１２が取付け
られている。An annular resin sealing layer 11 is formed in the center of one side of the probe substrate 10 . A plurality of detection needles 12 are attached to the resin sealing layer 11 so as to penetrate through the resin sealing layer 11 and to be arranged radially in a predetermined manner from the center of the probe substrate 10 .
この検出針１２の配置は、特性を測定する素子の被測定
領域の配置に応じて設定されている。The arrangement of the detection needles 12 is set according to the arrangement of the region to be measured of the element whose characteristics are to be measured.
検出針１２には図示しない信号移送手段が接続されてい
る。樹脂封止層１１には、検出針１２の熱除去手段であ
る冷却管１３が埋設されている。冷却管１３には冷媒の
供給管１４及び排出管１５が接続されている。供給管１
４及び排出管１５は、プローブ基板ｌＯの他面側から外
部に導出している。供給管１４及び排出管１５には、第
２図に示す如く、冷却水、冷却ガス等の冷媒供給排出機
構１６が接続されるようになっている。A signal transfer means (not shown) is connected to the detection needle 12. A cooling pipe 13 serving as a heat removal means for the detection needle 12 is embedded in the resin sealing layer 11 . A refrigerant supply pipe 14 and a refrigerant discharge pipe 15 are connected to the cooling pipe 13 . Supply pipe 1
4 and the exhaust pipe 15 are led out from the other surface side of the probe board IO. As shown in FIG. 2, a refrigerant supply and discharge mechanism 16 for cooling water, cooling gas, etc. is connected to the supply pipe 14 and the discharge pipe 15.
このように構成されたプローブカード２０によれば、冷
却管１３に冷媒供給・排出機１１１１６より所定の冷媒
を循環させながら検出針１２ＶＣ測定時〈加わる熱を除
去しつつ、素子の電気特性を測定することができる。こ
のため、測定時に検出針１２が熱歪を受けて固定位置を
変化する現象を防止することができる。その結果、検出
針１２の固定位置を所定のものく正しく設定した状態で
測定が可能となり、測定精度を著しく向上させることが
できる。According to the probe card 20 configured in this way, when measuring the VC of the detection needle 12 while circulating a predetermined refrigerant through the cooling pipe 13 from the refrigerant supply/discharge device 11116, the electrical characteristics of the element can be measured while removing the applied heat. can do. Therefore, it is possible to prevent the detection needle 12 from changing its fixed position due to thermal strain during measurement. As a result, measurement can be performed with the detection needle 12 fixed at a predetermined and accurately set position, and measurement accuracy can be significantly improved.
なお、本発明の他の実施例どして第３図■の）〈示す如
く、検出針１２の熱除去手段をプローブ基板１０の他面
く取付けた放熱体１２で形成し、この放熱体１７を検出
針１２に接続して放熱体１７の放熱作用によシ検出針１
２に熱歪が発生するのを防止するようにし九ものとして
も良い。In another embodiment of the present invention, as shown in FIG. is connected to the detection needle 12 and the detection needle 1
2. It is also possible to use 9 types to prevent thermal distortion from occurring.
以上説明し九如く、本発明に係るプローブカードによれ
ば、検出針の固定位置が熱歪によって変化するのを防止
して、素子の電気特性を高い精度で測定することができ
るもので、ある。As explained above, according to the probe card according to the present invention, it is possible to prevent the fixed position of the detection needle from changing due to thermal strain and to measure the electrical characteristics of the element with high precision. .
第１図（６）は、本発明の一実施例の平面図、同図（Ｂ
）は同実施例の正面図、第２図は、実施例のプローブカ
ードの冷却媒体の供給手段を示す説明図、第３図（４）
は、本発明の他の実施例の斜視図、同図体）は、同地の
実施例の正面図、第４図（４）は、従来のプローブカー
ドの平面図、同図（Ｂ）は、同実施例の正面図である。
１０・・・プローブ基板、１１・・・樹脂封止層、１３
・・・冷却管、１４・・・供給管、１５・・・排出管、
１６・・・冷媒供給排出機構、１２・・・放熱体、２０
・・・プローブカード。
出願人代理人 弁理士 鈴 江 武 彦第３図
第 ４図
（Ａ）FIG. 1(6) is a plan view of one embodiment of the present invention, and FIG.
) is a front view of the same embodiment, FIG. 2 is an explanatory diagram showing the cooling medium supply means of the probe card of the embodiment, and FIG. 3 (4)
4(4) is a perspective view of another embodiment of the present invention, FIG. It is a front view of the same Example. 10... Probe board, 11... Resin sealing layer, 13
... cooling pipe, 14 ... supply pipe, 15 ... discharge pipe,
16... Refrigerant supply and discharge mechanism, 12... Heat radiator, 20
...probe card. Applicant's representative Patent attorney Takehiko Suzue Figure 3 Figure 4 (A)
Claims (3)
配置で取付けられた複数本の検出針と、該検出針に接続
された信号移送手段と、前記プローブ基板に取付けられ
た前記検出針の熱除去手段とを具備することを特徴とす
るプローブカード。(1) A plurality of detection needles attached in a predetermined arrangement to one side of a probe board via a resin sealing layer, a signal transfer means connected to the detection needles, and the detection needle attached to the probe board. A probe card comprising a needle heat removal means.
、該冷却管に接続する冷却供給手段で構成されている特
許請求の範囲第１項記載のプローブカード。(2) The probe card according to claim 1, wherein the heat removal means comprises a cooling pipe attached to the resin sealing layer and a cooling supply means connected to the cooling pipe.
取付けられた放熱体である特許請求の範囲第１項記載の
プローブカード。(3) The probe card according to claim 1, wherein the heat removal means is a heat radiator connected to the detection needle and attached to the probe board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27842384A JPS61150346A (en) | 1984-12-25 | 1984-12-25 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27842384A JPS61150346A (en) | 1984-12-25 | 1984-12-25 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61150346A true JPS61150346A (en) | 1986-07-09 |
Family
ID=17597132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27842384A Pending JPS61150346A (en) | 1984-12-25 | 1984-12-25 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61150346A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003040734A3 (en) * | 2001-11-02 | 2004-03-11 | Formfactor Inc | Method and system for compensating thermally induced motion of probe cards |
| US7002363B2 (en) | 2001-11-02 | 2006-02-21 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| KR100955636B1 (en) | 2001-11-02 | 2010-05-06 | 폼팩터, 인크. | Method and system for compensating thermally induced motion of probe cards |
-
1984
- 1984-12-25 JP JP27842384A patent/JPS61150346A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003040734A3 (en) * | 2001-11-02 | 2004-03-11 | Formfactor Inc | Method and system for compensating thermally induced motion of probe cards |
| US6972578B2 (en) | 2001-11-02 | 2005-12-06 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| US7002363B2 (en) | 2001-11-02 | 2006-02-21 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
| US7119564B2 (en) | 2001-11-02 | 2006-10-10 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| CN1301409C (en) * | 2001-11-02 | 2007-02-21 | 佛姆费克托公司 | Method and system for compensating thermally induced motion of probe cards |
| US7312618B2 (en) | 2001-11-02 | 2007-12-25 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| US7560941B2 (en) | 2001-11-02 | 2009-07-14 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| US7642794B2 (en) | 2001-11-02 | 2010-01-05 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| KR100955636B1 (en) | 2001-11-02 | 2010-05-06 | 폼팩터, 인크. | Method and system for compensating thermally induced motion of probe cards |
| KR101015484B1 (en) * | 2001-11-02 | 2011-02-22 | 폼팩터, 인크. | Method and system for compensating thermally induced motion of probe cards |
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