JPS5689004A - Method of measuring thickness of multilayered epitaxial growth layer - Google Patents
Method of measuring thickness of multilayered epitaxial growth layerInfo
- Publication number
- JPS5689004A JPS5689004A JP16721479A JP16721479A JPS5689004A JP S5689004 A JPS5689004 A JP S5689004A JP 16721479 A JP16721479 A JP 16721479A JP 16721479 A JP16721479 A JP 16721479A JP S5689004 A JPS5689004 A JP S5689004A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- etching
- liquid
- tip
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
PURPOSE: To facilitate measurement by measuring the thickness of a layer from the falling speed of an etching liquid in a probe which can flow back the etching liquid through two thin pipes having their openings a tip etching-liquid reserve groove, by flowing the etching liquid with the probe in close contact with the surface of an epitaxial layer to be measured.
CONSTITUTION: Epitaxial wafer 4 is mounted on supporting base 6, the tip of probe 1 is brought into close contact with the surface of epitaxial layer 5 on substrate 4, and constant pressure is applied from above to press it with probe fixing jig 7. To probe fixing jig 7, electric micrometer 8 is connected. Through thin pipes 2 of probe 1, an etching liquid is flowed at a constant flow speed by way of etching-liquid reserve groove 3 at the tip and the falling speed of the liquid in probe 2 is detected by electric micrometer 8 to measure the thickness of epitaxial layer 5. The measurement can be taken easily without cleaving the wafer and the etching area is extremely small, so that the wafer can be used effectively.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16721479A JPS5689004A (en) | 1979-12-22 | 1979-12-22 | Method of measuring thickness of multilayered epitaxial growth layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16721479A JPS5689004A (en) | 1979-12-22 | 1979-12-22 | Method of measuring thickness of multilayered epitaxial growth layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5689004A true JPS5689004A (en) | 1981-07-20 |
Family
ID=15845535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16721479A Pending JPS5689004A (en) | 1979-12-22 | 1979-12-22 | Method of measuring thickness of multilayered epitaxial growth layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5689004A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61290317A (en) * | 1985-06-18 | 1986-12-20 | Mitsubishi Electric Corp | Measurement for thickness of thin film |
-
1979
- 1979-12-22 JP JP16721479A patent/JPS5689004A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61290317A (en) * | 1985-06-18 | 1986-12-20 | Mitsubishi Electric Corp | Measurement for thickness of thin film |
| JPH0431321B2 (en) * | 1985-06-18 | 1992-05-26 |
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