JPS61150256A - Jig for aligning and supporting object to be soldered - Google Patents

Abstract

PURPOSE:To contrive the facilitation of the production of the titled jig and the holding of gaps between both of the following guide members, by a method wherein this jig is so constructed as to support the main bodies of objects to be soldered lying across the side parts by the side parts of adjacent lower guide members, and as to guide the main bodies of objects to be soldered by the side parts of adjacent upper guide members. CONSTITUTION:The titled jig 3 is engaged from above with the inner frame 2 of a carrier holder 1 which is carried along the soldering line. The carrier holder 1 has rotary wheels 5 supported by a pair of guide rails 4 located along the soldering line and a check plate 8 spread by engaging to pins 7 projecting out of a carrier chain 6 rotated in end-free form along the soldering line. The jig 3 is provided with the upper guide member 13 and the lower guide member 14 for fitting objects to be soldered by bridging in the frame 12 having a pair of knobs 11. One-ends of these members 13, 14 are closed by projections 15 formed integral with the frame 12, and the other end surfaces are opened, thus providing insertion ports 16 for objects to be soldered. This construction can replay to changes in thickness of main bodies of objects to be soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a soldering line for soldering to a lead frame of an integrated circuit component and forming a solder film on the surface of the lead frame. This invention relates to a jig for aligning and supporting soldering objects.

(Prior art) Generally, before the lead frames of integrated circuit components are supplied to users, the lead frames are soldered and covered with a solder film to prevent oxidation of the lead frames. I'm trying to prevent it.

When soldering a lead frame like this, a large number of integrated circuit components (hereinafter referred to as ICs) must be soldered.
is loaded into a special jig and sent to the soldering line.

In the conventional jig, as proposed by the applicant of the present invention in Utility Application No. 1981-1981'''O, an IC is placed inside a frame conveyed along a soldering line. An upper guide member made of a plurality of round steel wires located above the IC and a lower guide member made of a long member with a concave cross section located below the IC are provided so as to span the upper and lower sides. While closing one end of the guide member, the above-mentioned IC is closed between the other end.
An insertion opening is provided, and a gate body is provided in the insertion opening so as to be openable and closable.

Then, the gate body is opened, a number of ICs are inserted between the upper guide member and the lower guide member, and the gate body is closed to hold the ICs in the guide portion. .

[Problem that the invention seeks to solve]

In the above-mentioned conventional jig, the upper guide member for guiding one row of ICs is made of four round steel wires. However, there is a need for a jig that can be manufactured more easily.

In addition, since the round steel wire mentioned above is relatively easily deformed and bends downward, there is a part where the gap between the upper guide member and the lower guide member narrows, and the IC gets stuck in this part, making it difficult to repair. There is a possibility that the IC cannot be smoothly attached and detached from the tool.

An object of the present invention is to improve the upper guide member of a jig for aligning and supporting objects to be soldered, to facilitate the manufacture of this jig, and to reduce the distance between the upper guide member and the lower guide member. The purpose is to maintain it constant over the entire length.

[Means for solving problems]

The present invention provides a frame body 1 transported along a soldering line.
2, a lower guide member 13 for inserting an object to be soldered.
and a lower guide member 14 are provided in a manner to span the guide members 13 and 14, and one end of the guide member 13 and 14 is closed (I!).
In the jig for aligning and supporting objects to be soldered, the gate body 21 is provided so as to be freely openable and closable, and the upper guide member 13 horizontally moves a large number of elongated members each having a substantially inverted concave cross section into the frame body 12. The lower guide member 14 has a large number of elongated members/members each having a concave cross section arranged in parallel to the upper guide member 13.
They are arranged in parallel in the horizontal direction in one-to-one correspondence with the lower side of. The corresponding upper guide member 13 and lower guide member 1
4 are fixed to each other via a spacer 41. The side part of the adjacent lower guide member 14 supports the main body of the object 34 to be soldered over the adjacent side part, and the main body of the object 34 to be soldered is supported by the side part of the adjacent upper guide member 13. invite.

[Effect]

In the present invention, the gate body 21 is opened and the upper guide member 13 is opened.
A large number of objects 3 to be soldered are placed between the lower guide member 14 and the lower guide member 14.
4 is inserted, the gate body 21 is closed, and the object to be soldered 34 is held between the guide members 13 and 14.

At that time, the corresponding upper guide member 13 and lower guide member 1
4, the main body of the object to be soldered 34 is supported by the side part 47 of the adjacent lower guide member 14, and the main body of the object to be soldered 34 is supported by the side part of the adjacent upper guide member 13. to prevent the object 34 to be soldered from hitting the spacer 41.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1, a jig 3 for aligning and supporting objects to be soldered according to the present invention is attached from above to an inner frame 2 of a transport holder 1 that is transported along a soldering line. As shown in FIG. 2, the transport holder 1 has a pair of guides L/-/L/4c along the soldering line. I□ya, oh, 1 yoe 2. □1. It has an engagement plate 8 that engages with and is pulled by a bin 7 protruding from a conveying cinch 6 which is driven to rotate endlessly along a line.

The jig 3 has a pair of handles 11 as shown in FIG.
An upper guide member 13 and a lower guide member 14 for inserting the numbered solder-to-be-soldered object are provided in a frame 12, which is provided with an upper guide member 13 and a lower guide member 14, extending between one ends of the guide members 13 and 14. It is closed by a convex portion 15 integral with the body 12, and the other ends of this guide member 13 and 14 are opened as shown in FIG. 3, and an insertion opening 16 for the wave soldering is provided between the other ends. .

As shown in FIG. 3, a gate body 21 is provided in this insertion port 16 so as to be openable and closable. This gate body 21 includes an insertion port side plate 12a of the frame body 12, and this insertion port side plate 12a.
It fits vertically movably between the gate guide plate 22 fixed to the inner surface of the side plate 12b located on both left and right sides of the gate, and
The gate body 21 is raised by lifting the engagement plate 23 fixed to the center of the gate body 21, and the lower end pressing portion of the lock body 25 is rotatably provided on the inner surface of the left and right side plates 12b by a shaft 24. 26, this gate body 2
1 is pressed against the upper guide member 13 and fixed.

In this gate body fixed state, the gate convex portion 27 formed in a comb-like shape on the lower side of the gate body 21 is connected to each upper guide member 13.
The insertion port 16 between the guide members 13 and 14 is closed by inserting the guide member 13 into the vicinity of the lower guide member 14 between the guide members 13 and 14.
．． This prevents the soldering object inserted between the holes 14 and 14 from being pulled out.

Further, as shown in FIG. 2, the lower guide member 13 is formed by arranging a large number of elongated members each having a semicircular cross-section in parallel in the horizontal direction within the frame body 12. This upper guide member 13 is
As shown in FIG.
A guide plate part 33 is welded to the inner surface of the part 2.
(called) 340 Kikyu's presser surface 35 to prevent it from floating, etc.
A guide surface 36 is formed to guide the side surface of the main body of the IC 34.

The lower guide member 14 is formed by arranging a large number of elongated members each having a concave cross section in parallel in the horizontal direction in one-to-one correspondence with the lower side of the upper guide member 13. 014
As shown in FIG. 1, a large number of holes 37 are bored in the bottom surface of the holder. This hole 37 is provided so that flux, melted solder, cleaning liquid, etc. of the soldering line can effectively act on the soldered portion in the concave lower guide member 14.

The above corresponding upper guide member 13 and lower guide member 1
4. First, attach the upper guide member 13 to the frame 12.
After fixing the upper guide member 13 by welding or the like, the lower guide member 1 is attached via the spacer 41 with respect to the upper guide member 13.
Fix 4. As shown in FIG. 4, this spacer 41 is positioned and welded to the mounting hole 42 of the lower guide member 14, and has a threaded portion 43 at its upper part.
Since the threaded portion 43 is integrally molded, the threaded portion 43 is inserted into the mounting hole 44 of the upper guide member 13, and the nut 45 screwed into the threaded portion 43 is tightened to fix it to the upper guide member 13.

Note that the spacer 41 may be attached to the lower guide member 14 with screws instead of being welded. Further, the fixing reference may be such that after the lower guide member 14 is fixed between the frames 12, the upper guide member 13 is fixed via the spacer 41 based on this reference.

Then, open the gate body 21 and open the upper guide member 13.
A large number of ICs 34 are inserted between the and the lower guide member 14,
The gate body 21 is closed and the IC 34 is held between the guide members 13 and 14 to prevent it from coming out.

At that time, the corresponding upper guide member 13 and lower guide member 1
Since there is a spacer 41 between the adjacent upper guide member 14, the side portion 47 of the adjacent lower guide member 14 supports the main body of the IC 34 inserted so as to span over the adjacent side portion 47, and the adjacent upper guide member 14 The main body of the IC 34 is guided by the side portion 32 and the guide plate portion 33 of the member 13 to prevent the main body of the IC 34 and the lead frame 48 from colliding with the spacer 41.

The jig 3 in which a large number of ICs 34 are aligned and supported in this way is transported on the soldering line by the transport holder, and, for example, foamed flux jetted from a foamed fluxer is applied to the lead frame 48 of the IC 34, The lead frame 48 is preheated with a pre-heater, and as shown in FIG. By applying /V on the entire surface, this lead frame 48 is protected by a solder film, and the lead frame 48 is
Take steps to prevent oxidation, etc.

〔Effect of the invention〕

According to the present invention, since the upper guide member is formed of an elongated member with a substantially inverted concave cross section, the upper guide member corresponding to one row of objects to be soldered can be easily formed with one member.
It is possible to easily manufacture a jig that requires a large number of upper guide members.

Further, the upper guide member with the reverse gate-shaped cross section has a strong resistance to deformation such as deflection, and in particular, the upper guide member and the lower guide member are fixed to each other via a spacer, and the spacer is provided. The problem of sticking is solved by supporting the main body of the soldering object by the side of the adjacent lower guide member and guiding the main body of the soldering object by the side of the adjacent upper guide member. Therefore, due to the cross-sectional shape and the spacer, the distance between the upper guide member and the lower guide member does not narrow due to deflection, etc., and it is possible to maintain this distance constant over the entire length. , objects to be soldered can be smoothly attached and detached from the jig of the present invention. At the same time, partial expansion of the gap between the upper guide member and the lower guide member can be similarly prevented, and it is possible to effectively prevent objects to be soldered from falling off between the guide members.

Furthermore, since the upper guide member and the lower guide member are fixed to each other via the spacer, by replacing this spacer with one of a different height, the upper guide member and the lower guide member can be fixed to each other. Even if the distance between the upper and lower guide members is changed, and therefore the thickness of the body of the soldering object inserted between the upper guide member and the lower guide member is changed,
It has the advantage of being able to accommodate changes in thickness.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway plan view showing an embodiment of the jig according to the present invention together with a transport holder, FIG. 2 is a partially cutaway front view of the jig, and FIG. FIG. 4 is an enlarged view of the main parts of the jig of the present invention, and FIG. 5 is an explanatory diagram of the soldering process. 12... Frame body, 13... Upper guide member, 14... Lower guide member, 1G... Insertion port, 21... Gate body, 34...
The cover is lυ, the IC as a thing, 41...space. ρ

Claims (1)

[Claims] (1) An upper guide member and a lower guide member for inserting objects to be soldered are provided in a frame body to be transported along a soldering line, and one end of this guide member is closed, and the other end is closed. An insertion port for objects to be soldered is provided between the ends, a gate body is provided in the insertion port so as to be openable and closable, and a large number of objects to be soldered are inserted between the upper guide member and the lower guide member by opening the gate body. In the jig for aligning and supporting soldered objects, the upper guide member has a plurality of lengths each having an approximately inverted concave cross section. Long members are arranged horizontally in parallel within the frame, and the lower guide member has a plurality of long members each having a concave cross section in one-to-one correspondence with the lower side of the upper guide member. The corresponding upper guide member and lower guide member are fixed to each other via a spacer, and the adjacent lower guide member is provided with a soldered material arranged in parallel to the direction of the solder. A jig for aligning and supporting an object to be soldered, characterized in that it supports the main body of the object and guides the main body of the object to be soldered by the side portion of an adjacent upper guide member.