JP3272455B2 - Lead frame-shaped parts heating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for heating a lead frame-shaped part to a set temperature without oxidizing the lead frame-shaped part. When solder is supplied to the substrate, the substrate is heated in advance in an inert atmosphere to facilitate the supply of solder and to improve the fixation of the semiconductor pellet on the lead frame. The present invention relates to a heating device for components.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing a semiconductor device, when a semiconductor pellet is mounted on a substrate of a lead frame,
In advance, it is easy to place solder by heating the substrate,
Due to the heating of the substrate, the upper surface of the substrate was oxidized, and the surface of the molten solder was oxidized, so that the semiconductor pellet could not be mounted well on the substrate of the lead frame in some cases. Therefore, from the heating of the substrate to the supply of solder,
All processes up to the mounting of the semiconductor pellet are performed in an inert atmosphere. A specific device for that purpose is, as shown in FIG.
Is guided by the heater rail (2) and the guide rail (3) from both sides so as to be transportable in the front and back directions of the drawing, and the upper lid (5) is placed on the upper surface via the intermediate plate (4). And a heating chamber (6) surrounding the lead frame-like component (1) almost in a sealed state. The heating chamber (6) has a gas supply passage formed in communication with the heater rail (2) and the upper lid (5). (2a) An inert gas is supplied through (5a). A communication hole (4a) is appropriately formed in the intermediate plate (4), and a heater insertion hole () for inserting an appropriate heater core such as a pipe heater is formed in the heater rail (2). 2b) are installed at equal intervals. A solder supply hole, a solder stirring hole, and a pellet supply hole are sequentially installed in the upper lid (5), and a feed claw for intermittently transporting the lead frame-shaped component (1) at a constant pitch is inserted. Since the insertion hole is formed with a length corresponding to the pitch feed stroke in the transport direction, a slide cover is provided. Insertion holes are formed. Further, the inlet and outlet of the heating chamber (6) are covered with a lid plate having a through hole for the lead frame-shaped component (1) formed at the center.

[0003]

In the above-mentioned conventional apparatus,
The overlapping portion of the heater rail (2) and the guide rail (3), the overlapping portion of the intermediate plate (4) and the upper lid (5), the overlapping portion of the heater rail (2), the guide rail (3), and the like.
Since there are many places where the outside air enters the heating chamber (6), and the supply passages (2a) and (5a) for the inert gas are formed through the overlapping portions of the members, the flow from here is started. The outside air enters the heating chamber (6) together with the inert gas,
The oxygen concentration in the heating chamber (6) is high, and the surface of the substrate and the surface of the molten solder of the lead frame-like component (1) are oxidized, so that the supplied semiconductor pellets are compatible with the solder and the lead frame-like component (1). Poor performance, voids (bubbles) and the like are generated at the solder joint, and there is a defect that leads to deterioration of product quality such as deterioration of heat radiation and decrease of bonding strength.

Moreover, conventionally, as shown in FIG. 3B, the heater rail (2) is attached to the attachment base (7) by dividing the heater rail (2) into three parts in the direction of transport of the lead frame-shaped part (1). External air invades from these divisions, and the sealing performance is poor. In addition, a heat-dissipating hole (2c) is provided for warping deformation due to thermal expansion of the heater rail (2). Due to insufficient deformation countermeasures, it was not possible to prevent a problem in transporting the lead frame part (1).

Further, in the conventional apparatus, it is necessary to design and process the entire heating device for each lead frame-shaped component (1) of a different type according to the shape of the lead frame-shaped component (1). Due to the lack of flexibility in the shape and the large number of constituent parts, there are drawbacks in that the design and processing time for these parts is lengthened, the cost is high, and the delivery date tends to be delayed.

The present invention has been proposed in view of the above-mentioned drawbacks of the conventional heating device, and has as its object to improve the sealing performance of the device, prevent oxidation of the lead frame-like component, and reduce the size of the pellet. Improves compatibility with bonding materials, reduces the rate of voids, improves product quality, reduces costs,
An object of the present invention is to provide a lead frame-shaped component heating device capable of simultaneously shortening a delivery time and improving flexibility performance.

[0007]

In order to achieve the above object, the present invention has a concave groove extending on the upper surface in the transport direction of a lead frame-like component, a built-in heater, and a lead frame for each type. A single heater rail that can be shared for parts and housed in a concave groove of the heater rail, corresponding to lead frame-shaped parts for each type,
An adapter rail for supporting the lead frame-shaped component so as to be transportable while positioning and guiding the lead frame-like component from both sides; and an inert gas supply passage of the adapter rail by surrounding the recessed groove of the heater rail containing the adapter rail in a sealed state. An upper lid mounted and fixed on the concave groove of the heater rail to form a heating chamber of an inert gas atmosphere via
The adapter rail can be exchangeably mounted in a heating chamber formed by a heater rail and an upper lid corresponding to a lead frame-shaped part for each type.

The present invention also provides an adapter having a concave groove extending on the upper surface in the direction of transport of a lead frame-shaped component, a heater rail having a built-in heater, and a heater rail enclosing the heater rail in a sealed state. An upper lid mounted and fixed on the concave groove of the heater rail so as to form a heating chamber of an inert gas atmosphere via an inert gas supply passage of the rail, and an overlapping portion of the concave groove of the heater rail and the upper lid. A sealing material having elasticity and heat resistance installed over the entire length of the lead frame-shaped component in the conveying direction, and a supply path of an inert gas to the heating chamber on a heater rail,
It is formed without passing through the overlapping portion of the members.

Further, the present invention has a concave groove extending along the transport direction of the lead frame-shaped component on the upper surface,
A single heater rail that has a built-in heater and can be shared for each type of lead frame-shaped component, and is housed in the concave groove of the heater rail, corresponding to each type of lead frame-shaped component, An adapter rail for supporting the lead frame-shaped component so as to be transportable while positioning and guiding the lead frame-like component from both sides; and an inert gas supply passage of the adapter rail by surrounding the recessed groove of the heater rail containing the adapter rail in a sealed state. And transporting the lead frame-shaped part to an overlapping portion of the upper lid placed and fixed on the concave groove of the heater rail so as to form a heating chamber of an inert gas atmosphere via the upper surface and the upper lid of the concave groove of the heater rail. A sealing material having elasticity and heat resistance installed over the entire length in the direction, and adapting the adapter rail to a lead frame-shaped part for each type. The heater rail can be exchangeably mounted in the heating chamber formed by the heater rail and the upper lid, and the supply passage of the inert gas to the heating chamber is formed on the heater rail without passing through the overlapping portion of the members. is there.

[0010]

According to the present invention, since the heater rail is not divided and has a one-piece structure and the conventional intermediate plate is omitted, the overlapping portion between the members can be reduced and the sealing performance can be improved. Then, a sealing material having elasticity and heat resistance is disposed at the overlapping portion of the heater rail and the upper lid forming the heating chamber, and furthermore, the supply path of the inert gas to the heating chamber is provided on the heater rail, and the members between the members are connected to each other. Since the heating chamber is formed without passing through the overlapping portion, the sealing performance of the heating chamber is further improved, the oxidation of components is prevented, and the rate of occurrence of voids can be reduced.

Further, the present invention provides that a heater rail can be shared with a lead frame-shaped component of each type, and that an adapter rail is manufactured corresponding to a lead frame-shaped component of each type. By unifying the outer shape to an outer shape that can be stored in the groove of the heater rail, and by directly placing and fixing the upper lid on the groove of the heater rail to form a heating chamber, Since it is only necessary to prepare an adapter rail and an upper lid for each lead frame-shaped part, the number of parts is reduced, the design and processing of this type of equipment is easy, cost and delivery time are reduced, and flexibility is improved. improves.

[0012]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.
2A is a schematic plan view of the apparatus of the present invention, FIG. 2B is a schematic plan view of the upper lid, and FIG. 2C is a schematic front view of the lid plate at the entrance and exit of the heating chamber. ) Is a lead frame-shaped part, (12) is a heater rail, (13) is an adapter rail, (14) is a top lid, (15) is a sealing material,
(16) indicates a supporter, and (17) indicates a mounting base.

The lead frame-like component (11) is formed by stamping a substrate portion on which a semiconductor pellet is mounted and a lead portion into a long strip-shaped metal plate by press working. It is manufactured in a continuous shape. In addition, a recess for engaging with a feeding claw for conveyance is formed in a part of the frame in a feeding piece shape.

The heater rail (12) has on its upper surface a concave groove (12a) extending in the transport direction of the lead frame-shaped part (11), and supplies an inert gas such as N2 to the concave groove (12a). A gas supply passage (12b),
It has a heater insertion hole (12c) for inserting a heater core, and is configured to be commonly used for a lead frame-shaped component (11) for each type. The gas supply passage (12
b) is formed without passing through the overlapping portion of the members.

The adapter rail (13) has an outer shape that can be accommodated in the concave groove (12a) of the heater rail (12), and corresponds to the lead frame-shaped component (11) for each type. It is manufactured so as to be able to transport and support the part-like part (11) by the width adjusting rail (13a) and the side wall (13b) while positioning and guiding the same from both sides, and to supply the inert gas to the heater rail (12). Passage (1
2b) communicating with the tank chamber (13c) gas communication passage (13
d).

The upper lid (14) is manufactured corresponding to the lead frame-shaped part (11) for each type, and seals the inside of the concave groove (12a) of the heater rail (12) containing the adapter rail (13). A concave groove (12a) of the heater rail (12) so as to surround and form a heating chamber (18).
It is placed on top and fastened and fixed by bolts (19). This upper lid (14) has a structure shown in FIG.
As shown in (b), a solder supply hole (21) into which a solder supply nozzle (20) is inserted, an insertion hole (23) of a stirring rod (22) for stirring the supplied solder, and a semiconductor pellet (24). The supply holes (25) are formed at predetermined intervals at positions corresponding to the pellet mount portions of the substrate portion of the lead frame-shaped component (11) for each type, and
A slit-like insertion hole (27) into which a feed claw (26) for intermittently transporting the lead frame-like component (11) at a constant pitch is formed, and a slide cover (27) is formed in the insertion hole (27). 28) is installed. The slide cover (28) has a minimum hole (29) into which the feed claw (26) can be inserted.

The sealing material (15) is made of a heater rail (1).
It is installed over the entire length of the lead frame-like component (11) in the transport direction at the overlapping portion of the upper surface of the concave groove (12a) and the upper lid (14), and is made of a material having elasticity and heat resistance. For example, a thin cylindrical stainless steel pipe which has been subjected to silver plating is used.

The supporter (16) has a heater rail (1).
2) for mounting the heater rail (12) on the mounting base (17), as shown in FIG. 2 (a), in order to prevent warpage and the like due to thermal expansion and contraction of the heater rail (12). Two places near both ends are supported so that thermal deformation can be absorbed. The heater rail (12) in the present invention is a lead frame-shaped part (1).
It is configured to be continuous and integrated over the entire length in the transport direction of 1).

The groove (12a) of the heater rail (12)
The inlet and outlet of the heating chamber (18) located at both ends of
A cover plate (30) as shown in FIG. 2 (c) is attached, and the cover plate (30) has a through hole (31) for a lead frame-shaped component (11) at the center thereof.

The embodiment of the present invention has the above configuration, and the operation will be described next. First, the lead frame-shaped component (11) having a long strip shape is supplied into the heating chamber (18) from the passage hole (31) of the cover plate (30) on the entrance side of the heating chamber (18). The lead frame-shaped part (11) supplied into the heating chamber (18) is provided in the groove (1) of the heater rail (12).
In 2a), the sheet is intermittently conveyed at a constant pitch by a feed claw (26) while being guided by the adapter rail (13), and during this time, the heating action from the heater rail (12) is transmitted via the adapter rail (13). It is transmitted to the lead frame-shaped component (11) and heated to around the melting temperature of the solder, for example, about 400 ° C. Then, at the position of the solder supply hole (21), the solder is supplied onto the substrate, and at the next position, the stirring rod (22) is inserted from the insertion hole (23), and the supplied solder is stirred, and the next position. Then, the semiconductor pellets (24) are supplied onto the solder agitated from the pellet supply holes (25) and joined. The above operation is sequentially repeated on each substrate of the lead frame part (11). During the above operation, the heating rail (1) is placed in the heating chamber (18).
2) Gas supply passage (12b) and adapter rail (1)
An inert gas such as N2 is supplied through the gas communication passage (13d) of 3), and the heated lead frame-like component (1) is heated.
Oxidation of 1) and molten solder is prevented.

In the embodiment of the present invention described above, the heating chamber (1
8) The oxygen concentration in the inside is reduced to 1/4 as compared with the conventional one, and the oxidation of the lead frame-shaped part (11) and the molten solder is prevented, so that the pellet supplied to the heated part becomes familiar with the bonding material. As a result, the rate of occurrence of voids could be reduced from 10% to 3%.

[0022]

According to the present invention, the sealing performance in the heating chamber of the heating device can be improved, the oxidation of the parts to be heated can be prevented, the compatibility with the semiconductor pellets can be improved, and the joining material such as solder can be improved. The generation of voids can be reduced, and the quality of products can be improved. Also,
According to the present invention, for each type of lead frame-shaped part, the adapter rail and the top cover are replaced and replaced, and the heater rail is shared. Flexibility between them is increased.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of the apparatus of the present invention.

2A is a schematic plan view of the apparatus of the present invention, FIG. 2B is a schematic plan view of an upper lid, and FIG. 2C is a schematic front view of a lid plate at an entrance and exit of the heating chamber.

3A is a longitudinal sectional view of a conventional device, and FIG. 3B is a schematic plan view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Lead frame-like part 12 Heater rail 12a Depression groove 12b Gas supply passage 12c Heater insertion hole 13 Adapter rail 13d Gas communication passage 14 Top lid 15 Seal material 18 Heating chamber

Claims (3)

(57) [Claims] An upper surface having a concave groove extending along a transport direction of a lead frame-like component, a heater built therein,
A single heater rail that can be shared for each type of lead frame-shaped component, and a lead frame-shaped component that is housed in the groove of the heater rail and corresponds to the lead frame-shaped component for each type. And an adapter rail that supports the adapter rail so that it can be conveyed while positioning and guiding the adapter rail from both sides. An upper lid mounted and fixed on the concave groove of the heater rail to form a heating chamber of a gas atmosphere, wherein the adapter rail is formed by the heater rail and the upper lid corresponding to a lead frame-shaped component for each type. A lead frame-shaped component heating device, which can be exchangeably mounted in a heating chamber to be replaced. 2. A heater rail having a concave groove extending on a top surface thereof in a conveying direction of a lead frame-shaped component and having a built-in heater, and a heater rail inactively enclosing the inside of the concave groove of the heater rail. An upper lid mounted and fixed on the groove of the heater rail so as to form a heating chamber of an inert gas atmosphere via a gas supply passage; and a lead frame shape formed on an overlapping portion of the groove and the upper lid of the heater rail. A sealing material having elasticity and heat resistance installed over the entire length of the component in the transport direction, and a supply path of the inert gas to the heating chamber is made to pass through the overlapping portion of the members to the heater rail. A lead frame-shaped part heating device characterized by being formed without any. 3. A single heater rail having a concave groove extending on a top surface thereof in a conveying direction of a lead frame-shaped component, incorporating a heater, and being commonly used for a lead frame-shaped component of each type. An adapter rail that is housed in a concave groove of the heater rail and supports the lead frame-shaped component so that it can be transported while positioning and guiding the lead frame-shaped component from both sides in accordance with the lead frame-shaped component of each type; It was placed and fixed on the groove of the heater rail so as to form a heating chamber of an inert gas atmosphere through the inert gas supply passage of the adapter rail by surrounding the inside of the groove of the stored heater rail in a sealed state. The upper lid has elasticity and heat resistance installed over the entire length in the transport direction of the lead frame-shaped component at the overlapping portion between the upper surface of the concave groove of the heater rail and the upper lid. The adapter rail is replaceable in a heating chamber formed by a heater rail and an upper lid corresponding to a lead frame-shaped part for each type, and is inert to the heating chamber. A lead frame-shaped component heating device, wherein a gas supply passage is formed in a heater rail without passing through an overlapping portion of members.