JPS61150119A - Electrode manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To improve the reliability by providing a process filling a high polymer resin to a lower part of an overhang of a conductor layer formed by the electrolytic plating method so as to improve the corrosion proof of the like. CONSTITUTION:A background metallic film 13 for conductor plating is formed to an electrode lead conductor film 12 formed as a pattern to a base 11. Then a positive photo resist film 14 if formed as a pattern on the film 13 so that the surface of the middle part of the film 13 is exposed. Then a conductor layer is formed to the exposed part of the film 13 by using the photo resist film 14 as a mask by the elecrtrolytic plating. The over hang part 16 formed around the bottom of the conductor layer 15 in this case is filled by the photo resist film 14. Then the photo resist film 14 is removed by using oxygen ions by the ion etching method,the photo resist film 14 beneath the conductor layer 15 is left, the other exposed part is eliminated by a self-alignment, the oxide film on the surface of the plating background metallic film 13 and the conductor layer 15 is removed by ion milling, and the protection film is covered to the surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing an electrode for an a-film magnetic head, and more particularly to a method for manufacturing an electrode that is formed simultaneously with the formation of a thin-film magnetic head.

[Technical background of the invention and its problems] Generally, a thin film magnetic head formed by thin film technology consists of a wafer 1 as a base and a wafer 1 as shown in FIG.
It is composed of a magnetic head element 10 and an electrode 20 provided in the magnetic head element 10 and the electrode 20. i#II! at the same time when the magnetic head element 10 is formed. It is formed by technology and is used to establish continuity between external terminals.

A method of manufacturing the electrode 20 according to the prior art will be explained with reference to FIG. FIGS. 3(a) to 3(C) are cross-sectional views of an electrode showing the manufacturing process of the electrode according to the prior art. In this manufacturing method, first, a conductor 2 for leading out an electrode from a magnetic head element is formed on a wafer 1, as shown in FIG. 3(a). Next, to protect the magnetic head element from acidic or alkaline chemicals used during electroforming,
Protection Il! form 3. Next, after forming copper 114, which will serve as a base for current conduction during electroforming, by vacuum evaporation or sputtering, photoresist 5 is applied for 2 to 1 minutes.
It is formed to a film thickness of 0 μm and patterned to a predetermined dimension. Next, a metal conductor 6 having a thickness of 20 to 40 μm WA is formed by electroforming using a copper or nickel plating solution that can stably form a thick film. In this case, conductor 6
The shape of the conductor 6 is formed following the patterning shape of the photoresist 5 until the film thickness of the conductor 6 is approximately the same as the film thickness of the photoresist 5. However, when the film thickness of the conductor 6 is formed to be thicker than the film thickness of the photoresist 5, the conductor 6 is deposited not only in the film thickness direction but also as a characteristic of electroplating.
The conductor 6 is also deposited in the lateral direction perpendicular to the film thickness direction as shown in Figure 3 (a).
) occurs as shown in

This precipitation in the lateral direction is approximately 1:1 with the precipitation in the film thickness direction.
If the conductor 6 is formed by electroforming with a thickness of 20 to 40 μm, an overhang of 10 to 50 μm will occur.

When the photoresist 5 is removed, a gap equivalent to the thickness of the photoresist film will be created under the overhang portion. As shown in FIG. 3(b), if the inorganic protective film 7 is subsequently formed by vacuum evaporation or sputtering, the gap under the overhang cannot be filled, and the inorganic protective film 7 around the conductor 6 has a space 8. and frebas 9 occur. This defect appears around the electrode section when the surface of the inorganic protective film 7 is machined to expose the conductor 6 as shown in FIG. It is the cause of the invitation.

[Object of the Invention] It is an object of the present invention to provide a method for manufacturing an electrode for a thin film magnetic head that eliminates the problems of the prior art, prevents the occurrence of cavities or freckles, and has excellent corrosion resistance. be.

[Summary of the Invention [1] A summary of the present invention for achieving the above object is characterized in that it includes a step of filling and forming a polymer resin in the lower part of an overhang portion of a conductor layer formed by an electrolytic plating method. It is something.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 1(a) to 1(e) showing the steps in the order of steps.

First, a base metal II (C
u/T i (1000^/200^)) 13 is formed (FIG. 1(a)).

Next, a positive photoresist film 14 is placed on the base metal 1113.
1 so that the intermediate surface of the base metal film 13 is exposed.
Form a pattern with a thickness of ~10 μm (see Figure 1(b)
)).

Using the patterned photoresist film 14 as a mask, a conductor layer (copper) 15 is formed on the exposed portion of the underlying metal film 13 to a thickness of 20 to 40 μm by electrolytic plating.

At this time, an overhang portion 16 is formed around the bottom of the conductor layer 15, and this portion is filled with photoresist 1114 (see FIG. 1(C)).
).

Next, the photoresist film 14 is removed using monooxygen ions using a reactive ion etching method. In this etching method, etching is possible by applying an appropriate voltage between the substrate film [N electrode and the counter electrode, so the photoresist film 14 located directly under the conductor layer 15 remains and other exposed areas are The portion that is located on the surface is removed by self-alignment (FIG. 1(d)). Note that the same effect can also be obtained by performing milling with oxygen ions using a reactive ion milling method in this step.

Thereafter, by performing heat treatment, the 7 photoresist films directly under the bottom overhang portion 16 of the conductor layer 15 are thermally cured, and the overhang portion is filled with polymer resin.

Next, the plating base metal film 13 is removed by ion milling. At this time, the oxide film formed on the surface of the conductor 115 in the heat treatment step is also removed at the same time (first
Figure (e)).

Finally, the surface is covered with a protective film.

The present invention is not limited to the embodiments described above, and various modifications are possible.

For example, in the above embodiments, a positive photoresist film was used as the polymer resin, but other materials such as negative photoresist, polyimide, etc. may also be used.

[Effects of the Invention] According to the present invention described in detail above, the overhang portion of the conductor layer can be filled with the molecular resin. It is possible to improve reliability such as corrosion resistance of the magnetic head. In addition, there is no need to increase the number of steps in order to achieve this objective, and precision in mask alignment is not required, so there is an excellent effect that a degree of latitude in pattern design can be ensured.

[Brief explanation of the drawing]

FIGS. 1(a) to (e) are cross-sectional views showing an embodiment of the present invention in the order of steps, FIG. 2 is a perspective view showing the structure of a thin film magnetic head, and FIGS. 3(a) to (C) are conventional FIG. 3 is a cross-sectional view showing the manufacturing method of the technology in the order of steps. 11...Base body, 12...Leader conductor layer, 13...
Base metal layer, 14...Resist layer, 15...Conductor ■
, 16...overhang part. Agent Patent Attorney Masayoshi Misawai)
- Figure 1 Procedural Amendment Document July 23, 1985 Patent Application No. 280816 of 1988 2 Title of Invention Method for Manufacturing Electrodes for Thin Film Magnetic Heads 3 Person Who Makes Amendment Relationship with the Case Patent Applicant 5 Amendment Date of order Voluntary action 6. Insert "anisotropy" after the column heading of the detailed description of the invention in the specification subject to amendment. that's all

Claims (2)

[Claims] (1) In an electrode manufacturing method for a thin-film magnetic head in which a magnetic head element and an electrode for connecting signals of the magnetic head element to the outside are formed on a substrate by thin-film technology, an overhang portion of a conductor layer formed by electrolytic plating is used. 1. A method for manufacturing an electrode for a thin-film magnetic head, the method comprising the step of filling and forming a polymer resin in the lower part. (2) The polymer resin layer is formed by etching away the mask layer used when electroplating the conductor layer by self-aligned anisotropic etching, leaving the lower part of the overhang of the conductor layer. A method for manufacturing an electrode for a thin film magnetic head according to claim 1.