JPS61243915A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To produce easily and inexpensively a magnetic head by the constitution consisting in removing an overcoat film of a magnetic head pad part by using a polyimide resin having <=15% rate of imide formation. CONSTITUTION:The photosensitive resin 3 is patterned to the pad part formed by laminating an electrode 1 on a substrate 2 and after the overcoat film 4 is formed thereon, the polyimide resin is dissolved away by a liftoff treatment to expose the pad part. Since the polyimide resin of <=15% rate of imide formation is used, the pad part is easily exposed and the easy production of the magnetic head is made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for removing an overcoat film on a pad portion in a method for manufacturing an LA magnetic head.

[Summary of the invention]

The present invention provides a method for manufacturing a magnetic head in which a lift-off method is used to remove an overcoat film from a pad portion, and the material used in the lift-off method is a polyimide resin having an imidization rate of 15 or less.

This simplifies the manufacturing method of magnetic heads.

[Conventional technology]

The conventional method for manufacturing the pad portion of a thin-film magnetic head is to first coat the pad portion with a conductive material using a method such as plating, deposit an overcoat film on top of the conductive material, and then polish the overcoat film using a polishing technique. A method was used in which the pad portion was exposed by

[Problems and objectives to be solved by the invention] However, the above-mentioned conventional technology requires precision in the technique of raising and polishing the pad portion, making it difficult to manufacture and requiring a large number of steps. However, it also has the problem of being expensive.

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and its purpose is to provide a magnetic head that is easy to manufacture and inexpensive.

Means for Solving Problem C] The method for manufacturing a magnetic head of the present invention uses a lift-off method to remove the overcoat film on the pad portion, and the material used for lift-off is a polyimide resin with an imidization rate of 15 or less. characterized by something.

[Effect]

According to the above structure of the present invention, a polyimide resin with an imidization rate of 15% or less is patterned on the electrode pad portion for lift-off, an insulating film for overcoat is deposited on top of the polyimide resin, and after the deposition, an alkaline solution, Electrode pads can be easily made by immersing it in a solution of hydrazine, ethylenediamine, diethyltriamine, or the like.

[Embodiment u11] FIG. 1 shows the manufacturing process of the pad part of a magnetic head in an embodiment of the present invention, and FIG. 1-(d) is a cross-sectional view of one manufacturing step of the pad part. -(6) is a cross-sectional view of a pad portion patterned with a photosensitive polyimide resin, and the imidization rate of the polyimide resin at this time is 12%. Furthermore, the thickness of this polyimide resin is μm. FIG. 1-(c) shows an overcoat film of alumina, silicon dioxide, or tantalum pentoxide deposited on the patterned polyimide resin.

Figure 1 - (This is the state of Figure 1 - (c) after being treated with the lift-off method. At this time, the liquid used to dissolve the polyimide resin in the lift-off method was hydrazine. Although the overcoat thickness l-1 was 30 μm, lift-off was easily possible.

[Example 2] A thin film magnetic head before being overcoated.

A non-photosensitive polyimide resin was applied with a spinner to a thickness of ωμm. The pad portion is shown in FIG. 2-(b) VC.

Next, when using a positive resist and developing it with an alkaline developer so as to leave only the resist on the pads, the polyimide resin at the bottom of the resist will be dissolved at the same time, and the resist will become more and more exposed as shown in Figure 2-(b). VC was able to remove only the resist by simply immersing it in an acetone solution. This state is shown in Figure 2-(c).Alumina was further deposited on top of this to a thickness of 25 μm by sputtering, resulting in the state shown in Figure 2-(c).After this, the alkaline solution for positive resist was applied again. When immersed, lift-off was easily achieved, resulting in the state shown in Figure 2-(g).

〔Effect of the invention〕

As described above, according to the invention, by using a polyimide resin with an imidization rate of 15% or less as the lift-off material, it is possible to easily remove the pad without requiring the technique of raising the pad part or the polishing technique of exposing it as in the past. This allows the pad portion to be exposed.

In particular, the overcoat of this thin film magnetic head, unlike the overcoat film of a normal element, is effective in cutting, polishing, etc., and therefore requires a thickness of several tens of micrometers. In such cases, it is difficult to pattern the photoresist, which is commonly used as a lift-off material, to a thickness on the order of several tens of micrometers, and the resist may deteriorate due to the effects of heat during overcoat film deposition. , deterioration occurs and lift-off becomes impossible. Therefore, polyimide resin is the most suitable material because it can be easily patterned to a thickness of about 100 μm and has excellent heat resistance. Therefore, the present invention has the advantage that the manufacturing method of the magnetic head is easy and an inexpensive magnetic head can be provided.

[Brief explanation of drawings]

@1 Figures (a) to (-) are main cross-sectional views of the manufacturing process showing one implementation-1 of the pad portion of the magnetic head of the present invention. Figures 2 (b) to (-) are used in implementation %l The holes in the pad section are cross-sectional views of the manufacturing process. 1. Electrode 2-. Substrate 8. Photosensitive polyimide resin 4. Overcoat film 5. Non-photosensitive polyimide resin 6. Resist or higher

Claims (1)

[Claims] (1) (a) In a magnetic head obtained by sequentially laminating thin films, (b) lift-off method is used to remove the overcoat film from the magnetic head pad portion (c) material used in lift-off method is imidized. A method for manufacturing a magnetic head, characterized in that it is a polyimide resin (a compound that becomes completely polyimide when heated) with a polyimide resin of 15% or less.