JPS6114913B2 - - Google Patents

Info

Publication number
JPS6114913B2
JPS6114913B2 JP52154021A JP15402177A JPS6114913B2 JP S6114913 B2 JPS6114913 B2 JP S6114913B2 JP 52154021 A JP52154021 A JP 52154021A JP 15402177 A JP15402177 A JP 15402177A JP S6114913 B2 JPS6114913 B2 JP S6114913B2
Authority
JP
Japan
Prior art keywords
solder
layer
solder layer
spherical
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52154021A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5485155A (en
Inventor
Shuichi Murakami
Kazuhide Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15402177A priority Critical patent/JPS5485155A/ja
Publication of JPS5485155A publication Critical patent/JPS5485155A/ja
Publication of JPS6114913B2 publication Critical patent/JPS6114913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15402177A 1977-12-20 1977-12-20 Forming method for solder layer Granted JPS5485155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15402177A JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15402177A JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Publications (2)

Publication Number Publication Date
JPS5485155A JPS5485155A (en) 1979-07-06
JPS6114913B2 true JPS6114913B2 (en, 2012) 1986-04-21

Family

ID=15575164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15402177A Granted JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Country Status (1)

Country Link
JP (1) JPS5485155A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998009328A1 (fr) * 1996-08-27 1998-03-05 Nippon Steel Corporation Procede de placage partiel d'une carte de composants electroniques

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263221A1 (en) * 1986-10-08 1988-04-13 International Business Machines Corporation Method of forming solder bumps on metal contact pads of a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho
JPS51121772A (en) * 1975-04-18 1976-10-25 Hitachi Ltd Method of soldering wiring

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998009328A1 (fr) * 1996-08-27 1998-03-05 Nippon Steel Corporation Procede de placage partiel d'une carte de composants electroniques

Also Published As

Publication number Publication date
JPS5485155A (en) 1979-07-06

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