JPS61148848A - 半導体冷却装置 - Google Patents
半導体冷却装置Info
- Publication number
- JPS61148848A JPS61148848A JP27040784A JP27040784A JPS61148848A JP S61148848 A JPS61148848 A JP S61148848A JP 27040784 A JP27040784 A JP 27040784A JP 27040784 A JP27040784 A JP 27040784A JP S61148848 A JPS61148848 A JP S61148848A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- hollow
- container
- gate circuit
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27040784A JPS61148848A (ja) | 1984-12-21 | 1984-12-21 | 半導体冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27040784A JPS61148848A (ja) | 1984-12-21 | 1984-12-21 | 半導体冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61148848A true JPS61148848A (ja) | 1986-07-07 |
| JPH0471339B2 JPH0471339B2 (enrdf_load_stackoverflow) | 1992-11-13 |
Family
ID=17485831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27040784A Granted JPS61148848A (ja) | 1984-12-21 | 1984-12-21 | 半導体冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148848A (enrdf_load_stackoverflow) |
-
1984
- 1984-12-21 JP JP27040784A patent/JPS61148848A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0471339B2 (enrdf_load_stackoverflow) | 1992-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1768478A2 (en) | Electronics assembly and heat pipe device | |
| JP3597798B2 (ja) | フィルムコンデンサ | |
| CN112289761A (zh) | 一种功率模块封装结构及其制造方法 | |
| JPS5749787A (en) | Boiling cooler | |
| JPS61148848A (ja) | 半導体冷却装置 | |
| JP2993286B2 (ja) | 半導体装置 | |
| JP2006041314A (ja) | インダクタ素子及び電子機器 | |
| JPS5910248A (ja) | 半導体沸騰冷却装置 | |
| JP2791270B2 (ja) | 半導体冷却器 | |
| JPH0714029B2 (ja) | 電力用半導体素子 | |
| JPH0364950A (ja) | 電気絶縁ヒートパイプ | |
| JPH04196154A (ja) | 半導体冷却装置 | |
| JPH06507044A (ja) | 液冷式装置内の発熱器の配列構造 | |
| JPH11108571A (ja) | ヒートパイプ式半導体冷却器 | |
| JPS61168249A (ja) | 沸騰冷却装置 | |
| JPS59945A (ja) | 半導体沸騰冷却装置 | |
| JPH022700A (ja) | 絶縁型ヒートパイプ放熱器 | |
| JPS6320101Y2 (enrdf_load_stackoverflow) | ||
| JPS59151479A (ja) | 超電導磁石装置 | |
| JPH02161758A (ja) | 密封端子装置 | |
| JPH05267647A (ja) | 半導体装置 | |
| JPS63255947A (ja) | 半導体沸騰冷却装置 | |
| JPS58135657A (ja) | 半導体装置 | |
| JPS61102099A (ja) | 半導体冷却装置 | |
| JPH01192153A (ja) | 電気発熱体の冷却装置 |