JPS61147988A - Laser beam processing device - Google Patents
Laser beam processing deviceInfo
- Publication number
- JPS61147988A JPS61147988A JP59266352A JP26635284A JPS61147988A JP S61147988 A JPS61147988 A JP S61147988A JP 59266352 A JP59266352 A JP 59266352A JP 26635284 A JP26635284 A JP 26635284A JP S61147988 A JPS61147988 A JP S61147988A
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- guide cylinder
- laser
- reflecting mirror
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0025—Means for supplying energy to the end effector
- B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
- B25J19/0037—Means for supplying energy to the end effector arranged within the different robot elements comprising a light beam pathway, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
- B25J19/022—Optical sensing devices using lasers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、レーザ加工装置に係り、特に自由曲面を有す
る大形の被加工物を加工するのに適した三次元のレーザ
加工装置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a laser processing device, and more particularly to a three-dimensional laser processing device suitable for processing a large workpiece having a free-form surface. be.
[発明の技術的背景とその問題点]
例えば自動車のボディなどのように、自由曲面を持った
被加工物の三次元レーザ加工は、工業的には重要な技術
課題となっている。[Technical background of the invention and its problems] Three-dimensional laser processing of workpieces with free-form surfaces, such as automobile bodies, has become an important technical issue from an industrial perspective.
三次元的に複雑な形状をした被加工物のレーザ加工の場
合、被加工部分をレーザ光の照射方向に向けるために被
加工物を移動させることは、5装置自体を複雑かつ大形
として特許ではない。したがって、自由曲面の任意の位
置に対し、被加工物を移動することなくレーザ光を伝送
し照射する装置の実現が望まれている。In the case of laser processing of a workpiece with a three-dimensionally complex shape, moving the workpiece in order to orient the workpiece in the laser beam irradiation direction requires a patent as the device itself is complex and large. isn't it. Therefore, it is desired to realize an apparatus that transmits and irradiates a laser beam to an arbitrary position on a free-form surface without moving the workpiece.
そこで、本出願人は、NO制御もしくはロボット駆動に
よる操作でレーザ光軸を被加工部分の法線方向に移動さ
せ、被加工物を移動することなく容易に加工できる装置
を先に提案した。Therefore, the present applicant has previously proposed an apparatus that can easily process a workpiece without moving the workpiece by moving the laser optical axis in the normal direction of the workpiece using NO control or robot drive operation.
この要旨は、垂直軸に沿って進むレーザ光を導く第1の
案内筒と、この第1の案内筒に一端を回転自在に係合し
、V字状になる2箇所の屈曲部を備えるとともにこれら
屈曲部にレーザ光を折り返す第1および第2の反射鏡を
内設した第2の案内筒と、この第2の案内筒の他端部に
、一端を第2の反射鏡で反射した一光軸と直交する方向
に回転自在に係合し、第2の案内筒と略同形の屈曲部を
備えるとともにこれら屈曲部に第2の案内筒で折り返さ
れたレーザ光をさらに折り返す第3および第4の反1)
Jltを内設し、このさらに折り返されたレーザ光を集
光する集光レンズ番内設した第3の案内筒を備えて構成
したものである。The gist of this is that it includes a first guide tube that guides laser light traveling along a vertical axis, one end of which is rotatably engaged with the first guide tube, and two bent portions forming a V-shape. A second guide tube is provided with first and second reflecting mirrors that reflect the laser beam at these bent portions, and a guide tube with one end reflected by the second reflector is provided at the other end of the second guide tube. A third and a second guide tube are rotatably engaged in a direction perpendicular to the optical axis, and have a bent portion having substantially the same shape as the second guide tube, and further fold back the laser beam reflected by the second guide tube at these bent portions. 4 anti-1)
Jlt is installed therein, and a third guide tube is provided inside the condensing lens for condensing the folded laser beam.
しかしながら、被加工物が例えば大容量のタンク、船舶
、大形トラックのパネル等のように非常 □に大きくな
ると、各構成部が必然的に大きくなり、レーザ光の伝送
系を構成する案内筒や内設した反射鏡の加工誤差および
組立誤差等により、伝送路が正確に設定されずレーザ光
が反射鏡によって所定の角度で反射されないため、集光
レンズにょうて集光部の一点に集光されないからである
。However, when the workpiece becomes very large, such as a large-capacity tank, a ship, or a panel for a large truck, each component inevitably becomes large, and the guide tubes that make up the laser beam transmission system, etc. Due to processing errors and assembly errors of the built-in reflector, the transmission path is not set accurately and the laser beam is not reflected by the reflector at a predetermined angle. This is because it is not done.
そこで、被加工物が上記したように非常に大きくなって
も、被加工物を移動することなく、レーザ加工が可能な
装置の実現が望まれていた。Therefore, it has been desired to realize an apparatus that can perform laser processing without moving the workpiece even if the workpiece becomes very large as described above.
[発明の目的]
本発明は、上記した事情に鑑みてなされたもので、特に
大形の自由曲面を有する被加工物に対して、これを移動
することなくレーザ加工が可能なレーザ加工装置を提供
することを目的とするものである。[Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and provides a laser processing device capable of laser processing a workpiece having a particularly large free-form surface without moving the workpiece. The purpose is to provide
[発明の概要]
本発明は、被加工物の上部を水平面内の直交する2方向
に移動自在としかつレーザ光を下方に導くスキャナと、
このスキャナに回転自在に連結され、屈曲部にレーザ光
の反射鏡を内設した複数の案内筒と、最終段の案内筒の
開口部近傍に内設したレーザ光を集束する集光レンズと
、最終段の案内筒を所望の位置に移動させる移動装置で
構成することにより、スキャナと複数段に連結された屈
曲部を有する案内筒で移動範囲を分担し、案内筒を小形
かつ連結段数を少なくして、自由曲面を有する大形の被
加工物を正確にレーザ加工することができるようにした
ものである。[Summary of the Invention] The present invention provides a scanner that allows the upper part of a workpiece to be moved in two orthogonal directions in a horizontal plane and that guides laser light downward;
A plurality of guide tubes are rotatably connected to the scanner and have laser beam reflecting mirrors installed in their bent portions, and a condenser lens that focuses the laser beam is installed near the opening of the final stage guide tube. By configuring the final stage guide cylinder with a moving device that moves it to the desired position, the movement range is shared between the scanner and the guide cylinder with a bending part connected in multiple stages, making the guide cylinder compact and reducing the number of connected stages. This enables accurate laser processing of large workpieces having free-form surfaces.
[発明の実施例]
以下、本発明のレーザ加工装置の一実施例を図面を参照
して説明する。第1図および第2図において、床面1に
はベース2が設置され、このベース2には被加工物を取
付けるテーブル3と、移動形のスキャナ(以下スキャナ
という)4が設けられている。このスキャナ4は゛、ベ
ース2に図示しない駆動機構によりY軸方向の往復動自
在に設けられた門形枠5と、この門形枠5の上部に駆動
機構6によってX軸方向の往復動自在に設けられた支持
枠7から構成されている。この支持枠7には、床面に設
置された公知のレーザ発振IS8からダクト8a 、8
b 、8c 、8dおよび反射19a 、 9bおよび
9Cを介して導かれたレーザ光(一点鎖線で示す)しを
下方に反射する反射鏡9dが設けられている。なお、ダ
クト8Cおよび8dは、門形枠5および支持枠7が移動
自在に設けられているので、それぞれ伸縮自在の構造と
なっている。[Embodiment of the Invention] Hereinafter, an embodiment of the laser processing apparatus of the present invention will be described with reference to the drawings. 1 and 2, a base 2 is installed on a floor 1, and the base 2 is provided with a table 3 on which a workpiece is mounted and a movable scanner (hereinafter referred to as scanner) 4. This scanner 4 consists of a gate-shaped frame 5 provided on a base 2 so that it can freely reciprocate in the Y-axis direction by a drive mechanism (not shown), and a gate-shaped frame 5 installed on the top of this portal frame 5 so that it can freely reciprocate in the X-axis direction by a drive mechanism 6. It consists of a support frame 7 provided. This support frame 7 has ducts 8a, 8 from a known laser oscillation IS8 installed on the floor.
A reflecting mirror 9d is provided to reflect downward the laser light (indicated by a dashed dotted line) guided through the mirrors 19a, 8c, 8d and reflections 19a, 9b and 9C. Note that the ducts 8C and 8d are provided with movable portal frames 5 and support frames 7, so that they are respectively extendable and retractable.
しかして、支持枠7の下方に上記した屈曲部を有する案
内筒を直列的に回転自在に連結する。すなわち、支持枠
7の下部に垂直軸に沿ってレーザ光りを導く第1の案内
筒11を設け、この第1の案内筒11の下部に一端を回
転自在に係合する第2の案内筒12を設ける。この第2
の案内筒12は、直角および略45°の屈曲一部を有し
、これら屈曲部にレーザ光りを折り返す第1の反射鏡1
3および第2の反射鏡14を内部に設けたものである。Thus, the guide cylinder having the above-mentioned bent portion is rotatably connected in series below the support frame 7. That is, a first guide tube 11 for guiding the laser beam along the vertical axis is provided at the lower part of the support frame 7, and a second guide tube 12 is rotatably engaged at one end with the lower part of the first guide tube 11. will be established. This second
The guide tube 12 has a right angle part and a part bent at approximately 45 degrees, and the first reflecting mirror 1 which returns the laser beam to these bent parts
3 and a second reflecting mirror 14 are provided inside.
この第2の案内筒12の他端部に一端を回転自在に係合
する第3の案内筒15を設ける。この第3の案内111
5は、第2の案内筒12と略同形で直角および略45゛
の屈曲部を有し、これら屈曲部に第2の反射鏡14で折
り返されたレーザ光りを折り返す第3の反射鏡16およ
び第4の反射$1117を内部に設け、さらに第4の反
射a117で反射したレーザ光りを集束する集光レンズ
18を内部に設けるとともに先端を補助ガスが噴出する
ノズル15aとしたもので□ある。A third guide tube 15 is provided at the other end of the second guide tube 12, one end of which is rotatably engaged. This third guide 111
5 has approximately the same shape as the second guide tube 12 and has a right angle and an approximately 45° bent portion, and a third reflecting mirror 16 that reflects the laser beam reflected by the second reflecting mirror 14 at these bent portions; A fourth reflector $1117 is provided inside, and a condenser lens 18 is further provided inside to focus the laser beam reflected by the fourth reflector a117, and the tip thereof is a nozzle 15a from which auxiliary gas is ejected.
次に、上記構成の作用を説明する。まず、図示しないN
G制御装置またはその他通貨の制御装置により、図示し
ない駆動機構を介して門形枠5と駆動機構6を介して支
持枠7を加工部に対しそれぞれ移動させる。なお、この
移動に際しては、第3の案内筒15を移動させる図示し
ない公知の多関節形または直角座標形ロボットの動作に
運動させる。Next, the operation of the above configuration will be explained. First, N
The G control device or other currency control device moves the support frame 7 to the processing section via the portal frame 5 and the drive mechanism 6 via a drive mechanism (not shown). Incidentally, during this movement, the third guide tube 15 is moved by the motion of a known multi-jointed or rectangular coordinate robot (not shown).
しかして、レーザ発振器8からレーザ光りをダクト8a
、8b、8cおよび8d、反射19a 。Therefore, the laser beam from the laser oscillator 8 is transmitted to the duct 8a.
, 8b, 8c and 8d, reflection 19a.
9b、9cおよび9dを介して第1の案内筒11に導く
。このレーザ光りは、第3図に示すように垂直軸方向に
沿って第2の案内筒12に導かれ、屈曲部に設けられた
第1の反射[113および第2の反射!i14によって
直角方向および略45°方向に2回反射して第3の案内
筒15に導かれる。このレーザ光りは、屈曲部に設けら
れた第3の反射鏡および第4の反射!i17によってさ
らに直角方向および略45°方向に2回反射して集光レ
ンズ18に導かれ、この集光レンズ18によって集束さ
れて補助ガスとともにノズル15aから被加工物20の
加工部に照射される。It is led to the first guide cylinder 11 via 9b, 9c and 9d. As shown in FIG. 3, this laser light is guided along the vertical axis direction to the second guide tube 12, and is reflected by the first reflection [113 and the second reflection!] provided at the bent part. It is reflected twice by i14 in the right angle direction and in the approximately 45° direction and is guided to the third guide tube 15. This laser light is reflected by the third reflecting mirror provided at the bending part and the fourth reflecting mirror! i17 further reflects the light twice in the right angle direction and in the approximately 45° direction and guides it to the condenser lens 18, where it is focused by the condenser lens 18 and irradiated along with the auxiliary gas from the nozzle 15a onto the processing portion of the workpiece 20. .
このように構成することにより、スキャナ4がテーブル
3のX軸およびY軸方向に移動するので、各案内筒の屈
曲部の長さを短くし、かつ回転自在に係合する屈曲部を
有する案内筒の個数を少くしても、ノズル15aの移動
範囲を制限されることがない。少くとも屈曲部を有する
案内筒を5個設けることにより、非常に大きい被加工物
をレーザ加 ′工することができる。また、レーザ
光りは、スキャナ4によって正確に伝送ができるので、
屈曲部を有する案内筒を多数組合わせて照射する場合に
比較して、加工誤差や組立誤差等の影響を受けることが
少なく正確なレーザ加工を行うことができる。さらに、
案内筒の製作も容易となる。With this configuration, since the scanner 4 moves in the X-axis and Y-axis directions of the table 3, the length of the bent portion of each guide cylinder can be shortened, and the guide having the bent portion that can be freely engaged with the guide tube can be shortened. Even if the number of cylinders is reduced, the movement range of the nozzle 15a is not restricted. By providing at least five guide tubes with bent portions, very large workpieces can be laser processed. In addition, since the laser light can be accurately transmitted by the scanner 4,
Compared to the case where a large number of guide tubes having bent portions are combined for irradiation, accurate laser processing can be performed with less influence from processing errors, assembly errors, etc. moreover,
It also becomes easier to manufacture the guide tube.
なお、上記した実施例では、スキャナ4は門形枠5と支
持枠7で構成したが、天井部にY軸方向に沿って設けた
ガイドレール上を移動する水平枠と、この水平枠を移動
する支持枠で構成してもよい。また、スキャナ4は駆m
*構によりX輪およびY軸方向に移動させたが、例えば
直線駆動ベアリングのように摩擦のきわめて小さい部材
を介して案内することにより、第3の案内筒15の移動
に従って自動的に移動させることもできる。これによっ
て、駆動機構が不要となり安価な装置を実現することが
できる。ただし、ノズルの近傍にセンサやその他の部材
を設ける場合には、案内筒の重坦が増大してロボット装
置の負荷が増大するので、スキャナを駆動機構で駆動す
ることが望ましい。In the above-mentioned embodiment, the scanner 4 is composed of the portal frame 5 and the support frame 7, but it also includes a horizontal frame that moves on a guide rail provided on the ceiling along the Y-axis direction, and a horizontal frame that moves this horizontal frame. It may also be configured with a support frame. Also, the scanner 4 is
*Although it was moved in the X-wheel and Y-axis directions by the mechanism, it can be moved automatically according to the movement of the third guide cylinder 15 by guiding it through a member with extremely low friction, such as a linear drive bearing. You can also do it. This eliminates the need for a drive mechanism, making it possible to realize an inexpensive device. However, if a sensor or other member is provided near the nozzle, the weight of the guide tube increases and the load on the robot device increases, so it is desirable to drive the scanner with a drive mechanism.
[発明の効果]
本発明は、以上のように構成されているから、特に大形
の自由曲面を有する被加工物に対しても、これを移動さ
せることなくしかも正確にレーザ加工をすることができ
る。また、レーザ光の伝送系を簡易として製作や取扱い
を容易とすることができる。[Effects of the Invention] Since the present invention is configured as described above, it is possible to perform laser processing accurately even on a workpiece having a particularly large free-form surface without moving the workpiece. can. Furthermore, the laser beam transmission system can be simplified to facilitate manufacturing and handling.
第1図は本発明のレーザ加工装置の一実施例を示す平面
図、第2図は本発明の一実施例を示す正面図、第3図は
本発明の一実施例の作用を示す説明図である。
4・・・スキャナ
8・・・レーザ発振器
11・・・第1の案内筒
12・・・第2の案内筒
15・・・第3の案内筒
15a・・・ノズル
L・・・レーザ光
(7317)代理人 弁理士 則 近 憲 佑(ほか1
名)
第 1 図
第 2 図
第 3 @Fig. 1 is a plan view showing an embodiment of the laser processing device of the present invention, Fig. 2 is a front view showing an embodiment of the invention, and Fig. 3 is an explanatory diagram showing the operation of the embodiment of the invention. It is. 4...Scanner 8...Laser oscillator 11...First guide tube 12...Second guide tube 15...Third guide tube 15a...Nozzle L...Laser light ( 7317) Agent: Patent Attorney Noriyuki Chika (and 1 others)
Figure 1 Figure 2 Figure 3 @
Claims (4)
動自在としかつレーザ光を下方に導くスキャナと、この
スキャナに回転自在に連結され、屈曲部に前記レーザ光
の反射鏡を内設した複数の案内筒と、最終段の案内筒の
開口端近傍に内設した前記レーザ光を集束する集光レン
ズと、前記最終段の案内筒を所望の位置に移動させる移
動装置とから構成されたレーザ加工装置。(1) A scanner whose upper part of the workpiece is movable in two orthogonal directions in a horizontal plane and which guides the laser beam downward, and which is rotatably connected to the scanner and has a reflecting mirror for the laser beam in the bent part. A condenser lens disposed near the opening end of the final stage guide cylinder for converging the laser beam, and a moving device for moving the final stage guide cylinder to a desired position. laser processing equipment.
設けた特許請求の範囲第1項記載のレーザ加工装置。(2) The laser processing apparatus according to claim 1, wherein the guide cylinder is provided with two bent portions, one at a right angle and the other at approximately 45°.
求の範囲第1項記載のレーザ加工装置。(3) The laser processing apparatus according to claim 1, wherein the open end of the final stage guide cylinder is a nozzle.
ボット装置で移動させる特許請求の範囲第1項記載のレ
ーザ加工装置。(4) The laser processing device according to claim 1, wherein the final stage guide tube is moved by an articulated or orthogonal coordinate robot device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59266352A JPS61147988A (en) | 1984-12-19 | 1984-12-19 | Laser beam processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59266352A JPS61147988A (en) | 1984-12-19 | 1984-12-19 | Laser beam processing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61147988A true JPS61147988A (en) | 1986-07-05 |
Family
ID=17429744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59266352A Pending JPS61147988A (en) | 1984-12-19 | 1984-12-19 | Laser beam processing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61147988A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993019888A1 (en) * | 1992-03-31 | 1993-10-14 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation |
US5531857A (en) * | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
DE202007017864U1 (en) | 2007-12-19 | 2009-05-07 | Kuka Systems Gmbh | processing device |
CN103692088A (en) * | 2013-12-06 | 2014-04-02 | 武汉华俄激光工程有限公司 | Integrated laser cutting machine for large-format gantry fiber optic conducting tube plate |
CN110216373A (en) * | 2019-05-16 | 2019-09-10 | 广东镭奔激光科技有限公司 | Light-conducting system outside the robot of intense pulse laser |
CN113814555A (en) * | 2021-10-25 | 2021-12-21 | 中南大学 | High-precision curved surface laser processing system based on 3D and laser distance sensor |
-
1984
- 1984-12-19 JP JP59266352A patent/JPS61147988A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5531857A (en) * | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
WO1993019888A1 (en) * | 1992-03-31 | 1993-10-14 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation |
DE202007017864U1 (en) | 2007-12-19 | 2009-05-07 | Kuka Systems Gmbh | processing device |
CN103692088A (en) * | 2013-12-06 | 2014-04-02 | 武汉华俄激光工程有限公司 | Integrated laser cutting machine for large-format gantry fiber optic conducting tube plate |
CN110216373A (en) * | 2019-05-16 | 2019-09-10 | 广东镭奔激光科技有限公司 | Light-conducting system outside the robot of intense pulse laser |
CN113814555A (en) * | 2021-10-25 | 2021-12-21 | 中南大学 | High-precision curved surface laser processing system based on 3D and laser distance sensor |
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