JPS61144047A - Semiconductor device - Google Patents

Abstract

PURPOSE:To eliminate the deterioration in a package by providing a bent at the upper position inserted into a lead substrate of the center, thereby alleviating the impact due to cutting and bending of the lower end of leads extended downward of a printed board without adverse influence to the package. CONSTITUTION:A central lead 22 if formed with a forward bent 22a at the upper position of a printed board 7, and the lower portion is inserted to into an inserting hole 8. The lead 22 is cut at the excess portion of the lower end by pressing means and bent. The lead 22 is applied with an impact by cutting and bending the lower end, but the transmission into a package 2 is alleviated by the upper bent 22a of the printed board 7. Thus, an automatic insertion of a semiconductor device 21 into the board 7, cutting of leads and bending by an automatic mounting machine can be performed without adverse influence to the package 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device in which a plurality of leads are drawn out downward from a package and inserted into a substrate, and particularly relates to improvements in the leads.

[Conventional technology]

For example, a conventional semiconductor device, such as a transistor, in which three leads are protruded downward from a package in which a semiconductor chip is sealed, has a three-lead configuration, as shown in the perspective view in Figure 3.
(1) is a semiconductor device such as a transistor, and has three leads (3) from the package (2).

(4) is pulled out downward 0 Among these, the center lead (4) is pulled out in a straight line, and the leads (3) on both sides are bent at the bending part (3a) to widen the gap outward. teb
0 A large number of semiconductor devices (1) formed in this way are placed on a ribbon-shaped mount (5) with the lower ends of each lead +3) and (4), pasted with adhesive tape (6), and transported. That's what I do. (5a) is a positioning hole that also serves as a feed for the mount (6). In this way, a large number of semiconductor devices (1) are mounted on a mount (
It is packaged with vertical taping according to 5) and subjected to the mounting process on a printed circuit board.

The semiconductor device (1) wrapped and transported with taping as shown in FIG. 3 is mounted on a printed circuit board (7) as shown in FIGS. 4 and 5. First, as shown in FIG. as well as(
Each lead (3) of one semiconductor device (1) as shown in the front sectional view and side sectional view in b).

(4) is inserted into each insertion hole (8)K of the printed circuit board (7) by an automatic mounting machine (not shown), and the lower end is brought out downward.The leads (3) on both sides are pressed. It is broken by movement of the fixed blade (9) of the means and the movable blade a in the directions of arrows A and B. At the same time, the central lead (4) is broken by the movement of the fixed blade (9) and the movable blade (b) in the direction of arrow C.

At this time, as shown in the front sectional view and side sectional view in FIGS. 5(a) and 5(b), the lower end of each lead (3) is cut off, and the end remaining under the printed circuit board (7) is cut off. is bent laterally in the direction of arrows A and B. Lead at the same time (4)
The lower end of is cut off, and the end remaining under the printed circuit board (7) is bent forward in the direction of arrow C. In this way, each lead +3 bent under the printed circuit board (7)
) e The end of (4) is connected to the wiring of the board (7) by brazing.

[Problem that the invention seeks to solve]

In the conventional semiconductor device as described above, the central lead (4
), there was a risk that the impact from cutting or bending would be transmitted directly into the package and cause it to deteriorate.

This invention was made to solve this problem.The central lead coming out of the package is inserted into the printed circuit board, and the impact caused by cutting or bending the tip is transmitted into the package. A semiconductor device according to the present invention aims to provide a semiconductor device which alleviates the problems caused by the problem and eliminates deterioration inside the package.

A curved portion is provided at an upper position to be inserted into the board of the card.

[Effect]

In this invention, the central lead coming out of the package is inserted into the printed circuit board, and the impact caused by cutting or bending the lower end is buffered by the curved part, thereby preventing any adverse effects on the inside of the package. FIG. 1 is a perspective view showing an embodiment of the semiconductor device according to the present invention, and the figure shows a state in which a large number of semiconductor devices are wrapped vertically with taping.
, (5a).

(6) is the same as the conventional device mentioned above. o 2 is a semiconductor device consisting of a transistor, etc., and the package (2)
From downwards, the leads on both sides (3) and the lead in the center (2)
is drawn out. This central lead υ is provided with a curved portion (22a) at the upper and front side.

The state in which this ↓ conductor device +1) is placed on the printed circuit board is
It is shown in cross section in FIG. The center lead (2) has a forward curved part (22a) above the printed circuit board (7), and the lower part thereof is passed through the insertion hole (8) K. This lead (A) has a lower end. The excess portion is cut off by a press in the same manner as in FIGS. 4 and 5 above, and is bent as shown by the chain line in FIG.

Although a shock is applied to the lead (A) by cutting and bending the lower end, the impact is damped by the upper curved portion (22a) of the printed circuit board (7) into the package (2). In this way, automatic insertion of the semiconductor device R@ into the printed circuit board (7), lead cutting, and bending by an automatic mounting machine (not shown) can be performed without adversely affecting the package (2) portion.

〔Effect of the invention〕

As described above, according to the present invention, since the central lead extending from the package is provided with a curved portion at a position above the printed circuit board, the lower end of the lead extending below the printed circuit board can be cut and bent. The impact caused by K is alleviated without adversely affecting the package portion, and deterioration within the package is eliminated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the semiconductor device according to the present invention in a vertical taping packaged state, and FIG. 2 is a side cross-sectional view showing the state in which the central lead of the semiconductor device shown in FIG. 1 is inserted into a printed circuit board. , FIG. 3 is a perspective view of a conventional semiconductor device wrapped in vertical tape packaging, and FIGS. 4 and 5 are
The figures sequentially show the state in which the lower ends of the leads inserted into the printed circuit board of the semiconductor device shown in Fig. 3 are cut and bent.
Figure 4(a) is a front sectional view, Figure 4(1)) is a front sectional view, Figure 4(a) is a
5(IL) is a front sectional view, and FIG. 5(1)) is a sectional view taken along line v-v in FIG. 5(a). 2... Package, 3... Lead, 3a... Bent part, 7... Printed circuit board, 21... Semiconductor device,
22...+7 +d, g2a...curved portion Note that the same reference numerals in the drawings indicate the same - or equivalent parts.

Claims (1)

[Claims] Leads from the center and both sides come out from the bottom of the package,
The leads on both sides are bent outward at the top, and the lower ends are spaced apart from the center lead.These leads are inserted into the printed circuit board, the lower ends protruding downwards are cut off, and the remaining ends are cut off. A semiconductor device which is bendable, characterized in that the central lead is provided with a curved portion at a position above the printed circuit board.