JPS61139332A - Method and apparatus for producing hollow wafer protected from moisture absorption - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A single essentially flat wafer plate is rolled in a still semi-baked, moldable state to form hollow wafers, particularly wafer triangular containers, and singulated in the rolled state. The present invention relates to a method and an apparatus for producing hollow wafers which are protected against moisture absorption on at least one side and at least on the upper surface by a physiologically harmless substance, such as an oil or a grease.

When making a hollow wafer filled with ice cream, a so-called ice cone, the inside of the finished hollow wafer is coated with an edible substance, such as yang oil, peanut oil, or chocolate, to protect it from moisture absorption from the ice cream. It is known to process hollow wafers in such a way that they themselves become soft due to moisture absorption and can be stored in a frozen state in such a way that they do not lose their hardened, crumbly hardness.

Moisture absorption on the outside of the hollow wafer filled with ice cream is at least protected by an airtight packaging.

This protection of hollow wafers can be achieved, for example, in the case of wafer triangular containers, where liquid oils or fats are deposited into a finished wafer triangular container that has been cast or into a wafer triangular container that has been rolled from an essentially flat wafer plate. This is done by spraying so that the oil is absorbed at least on the inner surface of the wafer triangular container.

By spraying oil into the wafer triangular container, which due to its shape is open at only one top, an air cushion is formed in front of the spray stream, and this air cushion covers the entire inner surface of each wafer triangular container. Prevents uniform spraying of material. This results in an uneven distribution of fat and oil on the inside surface of the wafer triangle, 9 and a concomitant failure to protect the wafer triangle from moisture absorption. In order to eliminate this drawback, spraying is carried out with the wafer triangular container upright, that is, with the open side facing up and the pointed side facing down. It was made to seep downward along the inner wall of the container. However, at this time, it is necessary to apply more oil than necessary to the upper half of the wafer triangular container, and as a result, the excess oil reaches the lower half of the wafer triangular container along the inner wall of the wafer triangular container. Grease drippings or grease streaks that occur on the inside of the wafer triangular container then lead to excessive fat accumulation in the direction of the tip of the wafer triangular container and within individual sections of the inner wall of the wafer triangular container. This oil and fat accumulation significantly impedes the removal of the wafer triangular container, especially its apex. Another disadvantage is that during the post-processing of the wafer triangular containers, the wafer triangular containers that are inserted into one another to form a single wafer triangular container stack stick to each other due to oil and fat accumulations and are therefore not suitable for filling machines with high working rates. Problems arise when the wafers are separated into individual pieces to fill the triangular container with material.

Another disadvantage is that during the spraying of liquid oils, oil mist is generated and that eliminating the contamination of the area around the spraying location with this oil mist requires considerable technical outlay.

The object of the present invention is to eliminate these disadvantages when winding hollow wafers from essentially flat individual wafer plates.

In order to solve this problem, the present invention provides hollow wafers, in particular wafer triangular containers, by rolling an essentially flat single wafer plate baked from wafer batter in a still semi-baked, moldable state. We propose a method for producing hollow wafers which are formed on one side and at least on the upper surface are protected against moisture absorption by a physiologically innocuous substance, such as oil or grease. , the method comprises applying one or more physiologically innocuous substances to at least one side of a half-baked wafer plate in one or more process steps before and/or during rolling of the wafer plate. It is characterized by application, especially by brush application or roll application.

In this way, a uniform distribution of the loaded material over the respective side of the wafer plate is achieved, so that the hollow wafers obtained by rolling from this wafer plate are completely protected, for example on the inside. . By brushing or rolling, the amount of material to be applied at each stage is accurately metered. By selecting the consistency of the material to be plated in each case, it is possible to select the penetration depth of the substance into the wafer plate in each case, and to determine the surface shape of the wafer plate.

In order to achieve relatively large penetration depths into the wafer board, the invention proposes to deposit the material deposited in at least the first method step in the form of a thin liquid.

Another feature of the invention is that the material to be plated in at least the last process step is plated in liquid form close to its freezing point. By carrying out this method, it is possible to quickly close the holes in the surface of the wafer plate. This is particularly advantageous if the surface of the wafer plate is not shaped.

In order to significantly shape the surface of the wafer plate, the present invention involves applying a thin liquid fat or oil to the wafer plate in a first process step and absorbing it into the wafer plate, and in a second process step adding liquid fat or oil to the wafer plate. We propose that the wafer be plated at a state close to its freezing point and then solidified after the wafer board is rolled up.

With the method according to the invention, it is not only possible to precisely determine the amount and the penetration depth of the material in each case, but also to produce hollow wafers that are protected on the inside and on the outside, as well as hollow wafers that are protected on the inside. becomes possible.

To produce hollow wafers that are protected only on the inside, according to the invention, the wafer plate is first filled with one or more substances on one side only, and then the wafer plate is rolled up with this side inside to form a tube. Shape into a body or a triangular container.

In order to produce a hollow wafer protected on the inside and outside, the present invention first applies one or more substances to the side of the wafer plate that will form the inside when formed into a hollow wafer. Alternatively, it is proposed to apply with a roll, and then to apply at least one substance to the side of the wafer plate which will form the outside when formed into a hollow wafer, either by brushing or by rolling.

According to the present invention, one or more substances can be applied by brush or roller to the side stop forming the outer side when the wafer plate is formed into a hollow wafer even before the wafer plate is rolled into the hollow wafer and formed. , it is also possible to carry out the process during this roll-forming.

In order to carry out the method described above, the present invention includes rotating firing tongs for firing a wafer plate and the wafer plate being opened at a transfer station of a wafer plate processing furnace. In a wafer firing furnace of the type in which the wafer is removed from the firing tongs of the firing furnace, at least one applicator roll or applicator brush is provided in the path of the opened firing tongs, each of which is operatively connected to one side of the wafer plate. suggest.

The invention will now be described in detail with reference to the accompanying drawings.

In a wafer firing furnace 1 (not shown in detail), a wafer plate is fired in rotating firing tongs 2, and formed into a hollow wafer by a winding device (not shown). The wafer plate, which is essentially flat and has an area on one side or a wafer pattern etc. on both sides, remains on the batter-handling side of the baking tong half 3 when the baking tong 2 is opened, and the baking tong and fed to the winding device. The baking tongs 2 are opened at the front end of the wafer baking oven in the deflection area of the baking tong chain, so that the batter-processing side of the baking tong half 3, to which the wafer plate is attached, moves in a vertical plane. In the orbit of the opened firing tongs 3 there is provided a serving device 4, which serves as a storage container 5 for the liquid substance to be deposited, into which it is immersed. The feed roll 6 and the platter in circumferential contact with this feed roll consist of a roll 7, the side rolls rotating in the same direction and being driven individually.

During plating, the roll 7 is in contact with a wafer plate attached to the firing tong half 8.

In this arrangement, coconut oil or peanut oil having a curing temperature of 28° to 40' is applied in a liquid state to one side of a wafer plate at a firing temperature, and is cured on the wafer plate.

The wafer plate thus protected against moisture absorption is then rolled up with the protected side inward by a winding device (not shown), formed into a wafer tube or wafer 77 triangular container, and cured. Formed as a hollow wafer.

The serving roll 7 is formed as a smooth steel roll. However, the roll can also be provided with a flexible surface made of foam rubber, for example. It is also possible to use a brush instead of a roll for this arrangement.

The platter roll or platter brush is formed into a cylindrical shape and a conical shape. If the roll and the associated feed roll are conical, the application may be applied to a wafer plate, for example from a horizontal storage container for liquid fats, which is attached to the upper half of the baking tongs. becomes possible.

In the embodiment of FIG. 1, the serving roll 7 belongs to the upper baking tong half 3. The sintering process of the wafer plate in the sintering furnace 1 is carried out when the sintering tongs 2 are opened, and instead of the wafer plate remaining stuck on the batter-treated surface of the upper sintering tong half 3, When controlled so that it remains attached to the batter-treated surface of part 3',
In order to stack the upper side of the wafer plate, the stacking shown in FIG. 1 requires that the device 4 be rotated through 90 DEG and attached to the lower firing tong half 3'. The stacking is then adjusted by positioning the roll in the direction of the wafer plate adhering to the battered surface of the lower baking tong half 3'.

The application of the liquid oil coating, so-called brush application, is shown in the figure.In the apparatus, the application is performed as follows. The supply roll 6 rests against a roll 7, which brings the roll into contact with a wafer plate adhering to the upper firing tong half 3. Since both rolls are rotating in the same direction, the liquid fat is removed from the container 5 by the supply roll 6 and the mound is transferred to the roll 7 on the upwardly directed circumferential surface of the supply roll.

This coating of oil on the supply roll 6 is transferred to the supply roll 6 in the area of the contact point with the roller 7, and onto the wafer plate on its upwardly directed circumferential surface. Sent.

This wafer plate is moved in a direction opposite to the roll 7 and in a direction opposite to the direction of rotation thereof, and liquid oil is removed from the roll 7 on its surface. The fats and oils that are not removed by the wafer plate are sent back to the supply roll 6 by the roll 7 via its downwardly directed circumferential surface;
In the region of the contact point of the two rolls, it is transferred to the supply roll 6 from which it is returned via its downwardly directed circumferential surface to the fat storage of the container 5.

In the illustrated apparatus, the wafer plate is protected on only one side with only one type of material.

When a large amount of a protective substance is required to protect one side of the wafer plate, a number of plating devices are used to sequentially apply a certain amount of the protective substance each time. It is installed along the orbit of the firing tongs. For example, if two serving devices are installed one after the other,
In the first arrangement, for example, coconut oil is in a liquid state in the apparatus, and in the second arrangement, in the apparatus, for example, coconut oil is in a liquid state, but it is arranged in the vicinity of the freezing point. Ru.

Of course, the respective quantity of substance required for a complete protective treatment can also be applied in a number of successive treatment stages, in which case the actual application can be determined by a person skilled in the art in accordance with the consistency of the substance which is advantageous for the working stages. The selection is made within the framework of the knowledge of the person's work. Of course, it is also possible to apply other substances in a number of successive working stages, the respective consistency of these substances being selected appropriately by a person skilled in the art during the application.

If the brush or roll application of the protective substance is carried out in a number of successive stages, a relatively large amount of the substance can be applied to each side of the wafer plate in a relatively short period of time; No dripping occurs or grooves are formed.

A suitable method for protecting only one side of the wafer plate is to apply the protective agent to the batter-treated surface of the baking tongs of the wafer baking furnace while the wafer plate is still attached to the batter-treated surface of the baking tongs of the wafer baking furnace.
The method is to arrange the wafer on a wafer plate using a roll or a brush. If the side of the wafer plate adhering to the flour-treated side must be protected against moisture absorption, this side should be protected from the embossment that is placed together in the engulfing device during the engulfing of the wafer plate. The protective treatment is carried out by means of a device or, prior to entrainment, by means of a transfer device, in which a reservoir of protective material is placed on the side to be protected, which is fed towards the device and from there to the entrainment device. do.

The materials applied by brush or roll to protect the relevant side of the wafer plate against moisture absorption may be the materials mentioned in the examples above, such as coconut oil, peanut oil,
Cocoa butter and coconut oil or peanut oil are not limited to substances containing cocoa butter.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the apparatus, showing the arrangement at the front end of a wafer firing furnace with rotating firing tongs for physiologically harmless substances; FIG. 2 is a plan view of the apparatus; FIG. A cross-sectional view along A. The symbols in the diagram are: 2... Baking tongs 4... Apparatus 7 for serving 7... Rolls for serving

Claims (1)

[Claims] 1. Forming hollow wafers, especially wafer triangular containers, by rolling an essentially flat single wafer plate baked from wafer batter in a still semi-baked, moldable state. A method for producing hollow wafers which are singulated in a rolled-up state and which are protected against moisture absorption on at least one side and at least on the upper surface by a physiologically innocuous substance, such as an oil or a fat. One or more physiologically harmless substances may be added to the half-baked wafer sheet in one or more successive process steps prior to and/or during the rolling and forming process of the wafer sheet. A method as described above, characterized in that at least one side is in particular brushed or rolled. 2. The method according to claim 1, wherein the substance to be plated in at least the first method step is plated in thin liquid form. 3. The method according to claim 1, wherein the material to be plated in at least the last process step is plated in liquid form close to its freezing point. 4. In the first method step, thin liquid oil or fat is placed on the wafer plate and absorbed into the wafer plate, and in the second method step, liquid oil close to the freezing point is applied, and this oil is placed on the wafer plate. 2. The method according to claim 1, wherein the plate is singulated after rolling. 5. The method according to any one of claims 1 to 4, in which one or more types of substances are placed on the side facing inward during post-rolling of the wafer plate. . 6. First, at least one substance is applied to the side of the wafer plate that faces inward during rolling, and then at least one substance is placed on the side of the wafer plate that faces outward during roll-forming. A method according to any one of claims 1 to 4. 7. A method as claimed in claim 6, characterized in that at least one substance is applied during the rolling process of the wafer plate on the side facing outward during said rolling. 8. From a single essentially flat wafer plate baked from wafer batter, rolled in a still semi-baked, moldable state to form a hollow wafer, especially a wafer triangular container, and the rolled state. A method for producing hollow wafers which are individuated on one side and at least on the upper surface are protected against moisture absorption by a physiologically innocuous substance, such as oil or fat, the method comprising: in particular on at least one side of the still half-baked wafer plate in one or more successive process steps prior to and/or during the rolling process of the wafer plate. A wafer firing furnace is provided for carrying out the above-described method of brush laying or roll laying, and the wafer plate is removed from the open firing tongs of the furnace at a transfer station of the wafer firing furnace. In an apparatus equipped with rotating baking tongs for baking, one or more serving devices (4) are provided in the orbit of the open baking tongs (2), and these serving devices are Device as described above, characterized in that it is equipped with at least one embossment roll (7) or embossment brush, each of which can act on the side surface of the wafer plate.