JPS61139039A - Mechanism for positioning wafer - Google Patents

Mechanism for positioning wafer

Info

Publication number
JPS61139039A
JPS61139039A JP26106984A JP26106984A JPS61139039A JP S61139039 A JPS61139039 A JP S61139039A JP 26106984 A JP26106984 A JP 26106984A JP 26106984 A JP26106984 A JP 26106984A JP S61139039 A JPS61139039 A JP S61139039A
Authority
JP
Japan
Prior art keywords
wafer
stopper
positioning
blocks
stopper blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26106984A
Other languages
Japanese (ja)
Inventor
Muneyoshi Hatano
羽田野　統慶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP26106984A priority Critical patent/JPS61139039A/en
Publication of JPS61139039A publication Critical patent/JPS61139039A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PURPOSE:To enable a wafer to be positioned easily and correctly without damaging the same, by providing a conveying means with stopper blocks having curved surfaces to be applied to the side faces of the wafer and movable in the vertical directions. CONSTITUTION:The opposing inner walls of stopper plates 25 and 25 have stopper blocks 27 and 27 attached thereto, and the opposing walls of the stopper blocks are provided with curved faces 26 and 26, respectively, to be applied to the peripheral surface of a wafer 21. The stopper plates 25 and 25 are attached to a conveying means movably in the vertical directions by means of fixing members 29 such as screws through screw holes 28. Each stopper block 27 is provided with an elevating knob 30 extending through the stopper plate 25. When the stopper blocks 27 and 27 are fixed with the fixing members 29 at the uppermost position, a gap which is at least larger than the thickness of the wafer 21 is defined between the stopper blocks 27 and the conveying surface of the conveying means 20. The stopper blocks 27 and 27 are further provided with receiving grooves 31 and 31 on the bottom surfaces thereof so as to receive conveyor belts 22 and 22.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ウェハの位置決めｌｌ１ｌＩＩに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to wafer positioning ll1lII.

〔発明の技術的背景〕[Technical background of the invention]

従来、ウェハの位置決め機構として第３図に示す構造の
ものが使用されている。図中１は、ウェハ２を水平に搬
送する搬送ベルト３．３を所定間隔で並設した状態で有
する搬送手段である。搬送ベルト３．３の内側の位置決
め部に、ウェハ２の側面に当接する一対のストッパービ
ン、４．４が第４図（Ａ）（Ｂ）に示す如く、立伏自在
に設けられている。而して、ウェハ２が位置決め部に到
達した時に第４図（Ａ）及び第５図（Ａ）に示す如く、
ストッパービン４．４が立設してウェハ２の側面に当接
することにより、ウェハ２を位置決めするようになって
いる。また、所望の処理をウェハ２に施し終わると、第
４図（Ｂ）に示す如く、ストッパービン４．４が伏せた
状態となって搬送ベルト３．３によりウェハ２は次の処
理部に搬出される。Conventionally, a structure shown in FIG. 3 has been used as a wafer positioning mechanism. In the figure, reference numeral 1 denotes a conveyance means having conveyor belts 3.3 for horizontally conveying the wafer 2, arranged in parallel at predetermined intervals. A pair of stopper bins 4.4 that abut against the side surfaces of the wafer 2 are provided in a positioning portion inside the conveyor belt 3.3 so as to be able to stand up and down as shown in FIGS. 4(A) and 4(B). Thus, when the wafer 2 reaches the positioning section, as shown in FIGS. 4(A) and 5(A),
The stopper bin 4.4 stands upright and contacts the side surface of the wafer 2, thereby positioning the wafer 2. When the desired processing is completed on the wafer 2, the stopper bin 4.4 is turned upside down and the wafer 2 is transported to the next processing section by the conveyor belt 3.3, as shown in FIG. 4(B). be done.

〔背景技術の問題点〕[Problems with background technology]

しかしながら、このようなウェハの位置決め機構では、
ウェハ２の周面に所謂オリフラ面と称する切欠面が形成
されているため、搬送ベルト３．３上に載置するウェハ
２の中心の位置が所定の位置からずれる場合がある。こ
のような場合には、ウェハ２は第５図（Ｂ）に示す如く
、オリフラ面５がストッパービン４．４間で挟まれるよ
うにして位置決めされる。しかもウェハ２は、搬送ベル
ト３．３によって高速度で搬送されているため、位置決
め時に損傷を受けやすい。また、所望の処理が終わって
ウェハ２を搬出するためにストッパーピン４．４を下げ
る際にもウェハ２は損傷を受けやすい。その結果、搬送
ベルト３．３へのウェハ２の載置を極めて慎重にする必
要があり、作業性を著しく低下する問題があった。However, in such a wafer positioning mechanism,
Since a cutout surface called a so-called orientation flat surface is formed on the circumferential surface of the wafer 2, the center position of the wafer 2 placed on the conveyor belt 3.3 may deviate from a predetermined position. In such a case, the wafer 2 is positioned such that the orientation flat surface 5 is sandwiched between the stopper bins 4.4, as shown in FIG. 5(B). Moreover, since the wafer 2 is being transported at high speed by the transport belt 3.3, it is susceptible to damage during positioning. The wafer 2 is also susceptible to damage when the stopper pin 4.4 is lowered to transport the wafer 2 after a desired process. As a result, it is necessary to place the wafer 2 on the conveyor belt 3.3 extremely carefully, which poses a problem of significantly reducing work efficiency.

〔発明の目的〕[Purpose of the invention]

本発明は、簡単な機構および操作でしかもウェハに損傷
を与たえずにウェハの位置決めを行なって生産性を向上
することができるウェハの位置決め機構を提供すること
を目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer positioning mechanism that can improve productivity by positioning a wafer with a simple mechanism and operation and without damaging the wafer.

（発明の概要〕 本発明は、ウェハの側面に当接する湾曲面を形成したス
トッパーブロックを搬送手段に昇降自在に設けたことに
より、簡単な機構及び操作によってウェハに損傷を与た
えずにウェハの位置決めを容易にかつ正確に行なって生
産性を向上することができるウェハの位置決め機構であ
る。(Summary of the Invention) The present invention provides a stopper block having a curved surface that contacts the side surface of the wafer, which is movable up and down on the transfer means, so that the wafer can be positioned without damaging the wafer with a simple mechanism and operation. This is a wafer positioning mechanism that can easily and accurately perform wafer positioning to improve productivity.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例について図面を参照して説明す
る。An embodiment of the present invention will be described below with reference to the drawings.

第１図は、本発明の一実施例の斜視図である。FIG. 1 is a perspective view of one embodiment of the present invention.

図中２０は、ウェハ２１を水平に搬送する搬送ベルト２
２．２２を所定間隔で並設した状態で有する搬送手段で
ある。搬送手段２ｏの位置決め部２３には、ウェハ２１
を固定するチャック２４が搬送ベルト２２．２２間窃略
中央部に設置されている。位置決め部２３の搬送手段２
ｏ上、には、一対のストッパー板２５．２５が相対向し
て設けられている。ストッパー板２５．２５の対向する
内壁面には、ウェハ２１の周面に当接する湾曲面２６．
２６を対向壁面に夫々形成したストパーブロック２７．
２７が取付けられている。ストッパー板２５．２５には
、略三か月形のねじ穴２８が形成されている。ストッパ
ー板２５．２５は、ねじ穴２８を介してねじ等の固定部
材２９により搬送手段に昇降自在に取付けられている。In the figure, 20 indicates a conveyor belt 2 that horizontally conveys the wafer 21.
2.22 are arranged in parallel at predetermined intervals. The wafer 21 is placed in the positioning section 23 of the transport means 2o.
A chuck 24 for fixing the conveyor belts 22 and 22 is installed at the center between the conveyor belts 22 and 22. Transport means 2 of positioning section 23
A pair of stopper plates 25, 25 are provided on the upper side of the stopper plate 25, facing each other. The opposing inner wall surfaces of the stopper plate 25.25 are provided with curved surfaces 26.25 that abut against the circumferential surface of the wafer 21.
Stopper blocks 27.26 are formed on the opposing wall surfaces.
27 is installed. A substantially crescent-shaped screw hole 28 is formed in the stopper plate 25.25. The stopper plate 25.25 is attached to the conveyance means via a screw hole 28 with a fixing member 29 such as a screw so as to be able to move up and down.

また、ストッパーブロック２７．２７には、ストッパー
板２５を構挿して昇降ノツプ３０が取付けられている。Further, a lift knob 30 is attached to the stopper block 27, 27 by inserting the stopper plate 25 therein.

固定部材２つをねじ穴２８の最上端部に位置付けてスト
ッパーブロック２７．２７を固定した場合には、ストッ
パーブロック２７．２７と搬送手段２０の搬送面との間
に少なくともウェハ２１の肉厚以上の隙間が形成される
ようになっている。ストッパーブロック２７．２７の下
面には、搬送ベルト２２．２２を収容する収容溝３１．
３１が形成されている。When the stopper block 27.27 is fixed by positioning the two fixing members at the uppermost ends of the screw holes 28, there is a space between the stopper block 27.27 and the transfer surface of the transfer means 20 that is at least the thickness of the wafer 21. A gap is formed. The lower surface of the stopper block 27.27 has an accommodation groove 31.2 for accommodating the conveyor belt 22.22.
31 is formed.

このように構成されたウェハの位置決め機構り仄メよれ
ば、ウェハ２１の位置決めを行なう際にはまず第２図（
Ａ）に示す如く、昇降ノツプ３０によりストッパーブロ
ック２７．２７を押し下げて固定部材２９をねじ穴２８
の最上端部に位置付け、ストッパーブロック２７．２７
の下面と搬送面とがほぼ接触するように近付けた状態で
ストッパーブロック２７．２７を固定する。この時搬送
ベルト２２．２２は、収容溝３１．３１内に収容される
。この状態で図示しない駆動手段により搬送ベルト２２
．２２を駆動し、搬送ベルト２２．２２上に載置された
ウェハ２１を位置決め部２３に搬送する。ウェハ２１が
位置決め部２３に到達するとウェハ２１の周側面が湾曲
面２６．２６に当接して位置決めが行われる。ウェハ２
１の位置決めは、周側面と湾曲面２６．２６の面接触に
より行われる。従って、ウェハ２１に形成されたオリフ
ラ面３２がどのような位置にあってもウェハ２１の位置
決めを極めて正確に行なうことができる。また、搬送ベ
ルト２２．２２上に載置したウェハ２１の中心の位置が
ずれていても・位置決めの際に湾曲面２６．２６に挟ま
れるようにしてウェハ２１の位置が決定されるので、容
易にかつ正確に位置決めすることができる。また、ウェ
ハ２１の位置決めが面接触でなされるので位置決めの際
にウェハ２１に損傷を与えることはほとんどない。According to the wafer positioning mechanism configured as described above, when positioning the wafer 21, first the steps shown in FIG.
As shown in A), push down the stopper block 27.
Positioned at the top end of the stopper block 27.27
The stopper block 27.27 is fixed in a state in which the lower surface of the block and the conveyance surface are brought close together so that they are almost in contact with each other. At this time, the conveyor belt 22.22 is accommodated in the receiving groove 31.31. In this state, the conveyor belt 22 is moved by a drive means (not shown).
．． 22 is driven to transport the wafer 21 placed on the transport belt 22.22 to the positioning section 23. When the wafer 21 reaches the positioning section 23, the circumferential side of the wafer 21 comes into contact with the curved surface 26, 26, and positioning is performed. wafer 2
1 is positioned by surface contact between the circumferential side surface and the curved surface 26.26. Therefore, the wafer 21 can be positioned extremely accurately no matter where the orientation flat surface 32 formed on the wafer 21 is located. Furthermore, even if the center of the wafer 21 placed on the conveyor belt 22.22 is shifted, the position of the wafer 21 is easily determined by being sandwiched between the curved surfaces 26.26 during positioning. positioning can be done quickly and accurately. Furthermore, since the wafer 21 is positioned by surface contact, the wafer 21 is hardly damaged during positioning.

ウェハ２１の位置決めがなされると、ウェハ２１はチャ
ック２４に吸着固定された状態で所望の処理が施される
。ウェハ２１に施す処理が終了すると、チャック２４に
よるウェハ２１の固着を解除し、第２図（８）に示す如
く、昇降ノッ７３０によりストッパーブロック２７．２
７を搬送面から離間するように引上げ、固定部材２９の
位置がねじ穴２８の最下位になったところで固定する。Once the wafer 21 is positioned, the wafer 21 is subjected to a desired process while being suctioned and fixed to the chuck 24. When the processing to be applied to the wafer 21 is completed, the wafer 21 is released from the chuck 24, and the stopper block 27.2 is moved by the lifting notch 730 as shown in FIG. 2(8).
7 is pulled up away from the conveying surface, and when the fixing member 29 is at the lowest position of the screw hole 28, it is fixed.

つまり、この状態ではストッパーブロック２７．２７か
ら搬送ベルト２２．２２が離間し、ストッパーブロック
２７．２７の下面と搬送面との間にはウェハ２１が通過
できる程度の隙間ができている。That is, in this state, the conveyor belt 22.22 is separated from the stopper block 27.27, and a gap large enough for the wafer 21 to pass is created between the lower surface of the stopper block 27.27 and the conveyance surface.

このため、搬送ベルト２２．２２を駆動するとウェハ２
１を容易に搬出することができる。この搬出操作の際に
もウェハ２１に損傷を与えることはほとんどない。Therefore, when the conveyor belt 22.22 is driven, the wafer 2
1 can be easily carried out. There is almost no damage to the wafer 21 during this unloading operation.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るウェハの位置決め機構
によれば、ウェハの側面に当接する湾曲面を形成したス
トッパーブロックを搬送手段に昇降自在に設けたことに
より、簡単な機構及び操作によってウェハに損傷を与た
えずにウェハの位置決めを容易にかつ正確に行なって生
産性を向上することができるものである。As explained above, according to the wafer positioning mechanism according to the present invention, the stopper block having a curved surface that abuts the side surface of the wafer is provided on the transfer means so as to be able to move up and down. It is possible to easily and accurately position the wafer without causing damage, thereby improving productivity.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明の一実施例の斜視図、第２図（Ａ）（
Ｂ）は、ストッパーブロックの動きを示す説明図、第３
図は、従来のウェハの位置決め機構の要部を示す斜視図
、第４図（Ａ）（Ｂ）は、ストッパービンの動きを示す
説明図、第５図（Ａ（Ｂ）は、従来のウェハの位置決め
機構でのウェハの搬送状態を示す説明図である。 ２０・・・搬送手段　２１・・・ウェハ　２２・・・搬
送ベルト　２３・・・位置決め部　２４・・・チャック
　２５・・・ストッパー板　２６・・・湾曲面　２７・
・・ストッパーブロック　２８・・・ねじ穴　２９・・
・固定部材　３０・・・昇降ノツプ　３１・・・収容溝
　３２・・・オリフラ面　４０・・・ウェハの位置決め
機構。 出願人代理人　弁理士　鈴江武彦 第１　図 第２図 第４図FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 (A) (
B) is an explanatory diagram showing the movement of the stopper block, the third
The figure is a perspective view showing the main parts of a conventional wafer positioning mechanism, FIGS. 4(A) and 4(B) are explanatory diagrams showing the movement of a stopper bin, and FIG. It is an explanatory diagram showing the conveyance state of the wafer in the positioning mechanism. 20... Conveyance means 21... Wafer 22... Conveyance belt 23... Positioning section 24... Chuck 25... Stopper plate 26...Curved surface 27.
...Stopper block 28...Screw hole 29...
- Fixed member 30... Elevating knob 31... Accommodating groove 32... Orientation flat surface 40... Wafer positioning mechanism. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 4

Claims (1)

【特許請求の範囲】[Claims] ウェハの搬送手段の位置決め部に所定間隔で対向すると
共に、前記搬送手段の搬送面に対して昇降自在に取付け
られ、かつ、その相対向する内側面に前記ウェハの側面
に当接する湾曲面を形成したストッパーブロックと、該
ストッパーブロックと前記搬送手段間に取付けられた前
記ストッパーブロックの固定部材とを具備することを特
徴とするウェハの位置決め機構。A curved surface that faces the positioning part of the wafer transport means at a predetermined interval, is attached to the transport surface of the transport means so as to be able to rise and fall freely, and has a curved surface that abuts the side surface of the wafer on the opposing inner surface. 1. A wafer positioning mechanism, comprising: a stopper block; and a fixing member for the stopper block attached between the stopper block and the transport means.
JP26106984A 1984-12-11 1984-12-11 Mechanism for positioning wafer Pending JPS61139039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26106984A JPS61139039A (en) 1984-12-11 1984-12-11 Mechanism for positioning wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26106984A JPS61139039A (en) 1984-12-11 1984-12-11 Mechanism for positioning wafer

Publications (1)

Publication Number Publication Date
JPS61139039A true JPS61139039A (en) 1986-06-26

Family

ID=17356645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26106984A Pending JPS61139039A (en) 1984-12-11 1984-12-11 Mechanism for positioning wafer

Country Status (1)

Country Link
JP (1) JPS61139039A (en)

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