JPS637647A - Apparatus for processing semiconductor substrate - Google Patents

Apparatus for processing semiconductor substrate

Info

Publication number
JPS637647A
JPS637647A JP15255486A JP15255486A JPS637647A JP S637647 A JPS637647 A JP S637647A JP 15255486 A JP15255486 A JP 15255486A JP 15255486 A JP15255486 A JP 15255486A JP S637647 A JPS637647 A JP S637647A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
substrate
parts
supported
supporting
tapered surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15255486A
Inventor
Yuji Imori
Hidesaburo Mori
Masaaki Umetani
Original Assignee
Plasma Syst:Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To prevent contamination, damage and the like of a substrate, by a constitution, wherein parts for supporting the substrate support it only at the edges of the substrate and do not make contact with the back surface at all.
CONSTITUTION: A first carrier 10 holds a substrate P by supporting parts 11 and 13 at the facing two sides. At this time, the substrate P is supported only at its edge Pa by inward facing tapered surfaces 17 and 18 of the supporting parts 11 and 13. When the first carrier 10 is lowered, the substrate P is transferred to a first arm 51 and supported only at the edge by the tapered surfaces of both supporting parts 53 and 53. Base parts 4 having inward facing tapered surfaces are provided at the four corners of a stage 3 so that the device can be lifted and lowered in the direction of a solid line A. The substrate P is received by the base parts 4. Only the edge Pa of the substrate P is supported by the tapered surface 5. Thus damage and the like of the corner part of the substrate P can be prevented when the substrate P is trasferred from the arm.
COPYRIGHT: (C)1988,JPO&Japio
JP15255486A 1986-06-28 1986-06-28 Apparatus for processing semiconductor substrate Pending JPS637647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15255486A JPS637647A (en) 1986-06-28 1986-06-28 Apparatus for processing semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15255486A JPS637647A (en) 1986-06-28 1986-06-28 Apparatus for processing semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS637647A true true JPS637647A (en) 1988-01-13

Family

ID=15543003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15255486A Pending JPS637647A (en) 1986-06-28 1986-06-28 Apparatus for processing semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS637647A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4869533B2 (en) * 2000-03-10 2012-02-08 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Processing chambers and apparatus for supporting a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4869533B2 (en) * 2000-03-10 2012-02-08 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Processing chambers and apparatus for supporting a substrate

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