JPS61136549U - - Google Patents

Info

Publication number
JPS61136549U
JPS61136549U JP1985019804U JP1980485U JPS61136549U JP S61136549 U JPS61136549 U JP S61136549U JP 1985019804 U JP1985019804 U JP 1985019804U JP 1980485 U JP1980485 U JP 1980485U JP S61136549 U JPS61136549 U JP S61136549U
Authority
JP
Japan
Prior art keywords
substrate
stepped
hole
minute gap
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985019804U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985019804U priority Critical patent/JPS61136549U/ja
Publication of JPS61136549U publication Critical patent/JPS61136549U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1985019804U 1985-02-14 1985-02-14 Pending JPS61136549U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985019804U JPS61136549U (enExample) 1985-02-14 1985-02-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985019804U JPS61136549U (enExample) 1985-02-14 1985-02-14

Publications (1)

Publication Number Publication Date
JPS61136549U true JPS61136549U (enExample) 1986-08-25

Family

ID=30509713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985019804U Pending JPS61136549U (enExample) 1985-02-14 1985-02-14

Country Status (1)

Country Link
JP (1) JPS61136549U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7040383B2 (en) 2001-08-16 2006-05-09 Nec Corporation Telecommunication device including a housing having improved heat conductivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7040383B2 (en) 2001-08-16 2006-05-09 Nec Corporation Telecommunication device including a housing having improved heat conductivity

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