JPS61135194A - Hybrid ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a hybrid integrated circuit including an inductance element, and in particular to a hybrid integrated circuit that prevents the influence of leakage magnetic fields generated by the inductance element on surrounding electronic components. Regarding.

[Conventional technology]

In a conventional hybrid integrated circuit in which electronic components made of ferromagnetic materials and inductance elements coexist, as shown in FIG. By arranging them at positions where their leakage magnetic fields 4 cancel each other out, electronic components made of ferromagnetic material are prevented from malfunctioning due to leakage magnetic fields.

[Problem that the invention seeks to solve]

The method of mounting an inductance element according to the above-mentioned conventional technology has the advantage of effectively canceling out leakage magnetic fields, but in order to realize mounting in this arrangement, the inductance element must be mounted on both sides of the hybrid integrated circuit board. Because of the necessity, it is often necessary to print mounting patterns on both sides of the circuit board, and in the element mounting process, the number of man-hours for solder dip and solder reflow is doubled, causing an increase in costs.

[Means for solving problems]

According to the present invention, by centrally mounting inductance elements on arbitrary ends of a hybrid integrated circuit board, a hybrid integrated circuit device is obtained in which a composite magnetic field generated by the inductance elements is locally concentrated.

[Effect]

Therefore, considering the strength and direction of the composite magnetic field emitted from the inductance element, the magnetic field from the inductance element should not affect the operation of electronic components made of ferromagnetic materials, such as the above-mentioned magnetic circuit and floppy disk. fl
By arranging K, it is possible to prevent malfunctions caused by the composite magnetic field from the inductance element.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partial vertical sectional view showing an embodiment of the present invention. A plurality of inductance elements 2 are arranged in a concentrated manner at a predetermined peripheral portion of the hybrid integrated circuit board 1, apart from other components 3. FIGS. 2 and 3 show a hybrid integrated circuit 7 according to the present invention.
An example of the relative position of the electronic component 5 when the electronic component 5 is placed near the electronic component 5 made of ferromagnetic material is shown. Figure 2 shows the composite magnetic field 6
This shows a case where the magnetic properties of the electronic component 5 are adversely affected, and represents an undesirable use of the present invention.

On the other hand, in FIG. 4, the composite magnetic field 6 is positioned so that it does not directly act on the ferromagnetic electronic component 5, thereby providing more stable operation.

〔Effect of the invention〕

As explained above, by arranging inductance elements concentrated at any end of a hybrid integrated circuit, the direction of generation of the composite magnetic field determined by the mounting position is fixed in one direction, which cancels out the composite magnetic field. By skillfully arranging the mounting position relative to the circuit and electronic components made of ferromagnetic material, malfunctions due to leakage magnetic fields can be prevented.

Further, as mentioned above, since it is not necessary to mount inductance elements on both sides according to the conventional technology, there is a cost reduction effect.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional view showing an embodiment of the present invention. FIG. 2 and FIG. 3 are sectional views each showing a mode of use of the present invention. FIG. 4 is a sectional view showing the main parts of a conventional hybrid integrated circuit. 1... Hybrid integrated circuit board, 2... Inductance element, 3... Other mounted elements, 4...
... Leakage magnetic field, 5 ... Electronic component made of ferromagnetic material, 6 ... Synthetic magnetic field, 7 ... Hybrid integrated circuit. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] A hybrid integrated circuit characterized in that a plurality of inductance elements are mounted concentratedly at arbitrary ends of a hybrid integrated circuit board.