JPS61134025A - 半導体ウエハのメサエツチング方法 - Google Patents

半導体ウエハのメサエツチング方法

Info

Publication number
JPS61134025A
JPS61134025A JP25668584A JP25668584A JPS61134025A JP S61134025 A JPS61134025 A JP S61134025A JP 25668584 A JP25668584 A JP 25668584A JP 25668584 A JP25668584 A JP 25668584A JP S61134025 A JPS61134025 A JP S61134025A
Authority
JP
Japan
Prior art keywords
cassette
mesa
wafer
semiconductor wafer
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25668584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410735B2 (cs
Inventor
Kenji Suzuki
健司 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP25668584A priority Critical patent/JPS61134025A/ja
Publication of JPS61134025A publication Critical patent/JPS61134025A/ja
Publication of JPH0410735B2 publication Critical patent/JPH0410735B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
JP25668584A 1984-12-05 1984-12-05 半導体ウエハのメサエツチング方法 Granted JPS61134025A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25668584A JPS61134025A (ja) 1984-12-05 1984-12-05 半導体ウエハのメサエツチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25668584A JPS61134025A (ja) 1984-12-05 1984-12-05 半導体ウエハのメサエツチング方法

Publications (2)

Publication Number Publication Date
JPS61134025A true JPS61134025A (ja) 1986-06-21
JPH0410735B2 JPH0410735B2 (cs) 1992-02-26

Family

ID=17296045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25668584A Granted JPS61134025A (ja) 1984-12-05 1984-12-05 半導体ウエハのメサエツチング方法

Country Status (1)

Country Link
JP (1) JPS61134025A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764316A (zh) * 2021-11-09 2021-12-07 天霖(张家港)电子科技有限公司 一种半导体加工设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764316A (zh) * 2021-11-09 2021-12-07 天霖(张家港)电子科技有限公司 一种半导体加工设备

Also Published As

Publication number Publication date
JPH0410735B2 (cs) 1992-02-26

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