JPS6112877A - Method for carrying out electroless copper plating - Google Patents

Method for carrying out electroless copper plating

Info

Publication number
JPS6112877A
JPS6112877A JP13110584A JP13110584A JPS6112877A JP S6112877 A JPS6112877 A JP S6112877A JP 13110584 A JP13110584 A JP 13110584A JP 13110584 A JP13110584 A JP 13110584A JP S6112877 A JPS6112877 A JP S6112877A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
plating
electroless copper
carrying out
copper plating
method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13110584A
Inventor
Yoshihito Kobayashi
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1682Control of atmosphere
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1676Heating of the solution

Abstract

PURPOSE:To improve the mechanical properties of a plated film as well as to increase the rate of plating by carrying out electroless copper plating under reduced pressure. CONSTITUTION:A body 9 to be plated is immersed in an electroless copper plating soln. 11 in a plating tank 10, and gaseous hydrogen 4 in the plating soln. 11 is exhausted with a vacuum pump 2. In the figure, 12 is a vacuum gauge. By the degassing, the mechanical properties of a copper film deposited by plating are improved, and the film is made free from defects such as blister and pits. An effect produced by raising the temp. of the plating soln. corresponds to that obtd. by reducing the pressure, so the rate of plating can be increased.
JP13110584A 1984-06-27 1984-06-27 Method for carrying out electroless copper plating Pending JPS6112877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13110584A JPS6112877A (en) 1984-06-27 1984-06-27 Method for carrying out electroless copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13110584A JPS6112877A (en) 1984-06-27 1984-06-27 Method for carrying out electroless copper plating

Publications (1)

Publication Number Publication Date
JPS6112877A true true JPS6112877A (en) 1986-01-21

Family

ID=15050091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13110584A Pending JPS6112877A (en) 1984-06-27 1984-06-27 Method for carrying out electroless copper plating

Country Status (1)

Country Link
JP (1) JPS6112877A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263991A (en) * 1986-05-07 1987-11-16 Adachi Shin Sangyo Kk Manufacture of plated material
EP0308011A1 (en) * 1987-09-16 1989-03-22 Philips Electronics N.V. Method of locally providing metal on a surface of a substrate
US5259818A (en) * 1989-04-14 1993-11-09 Fuji Kiko Company, Limited Stroke absorbing type intermediate shaft for vehicular steering column and method for assembling the same
WO2004097929A2 (en) * 2003-04-29 2004-11-11 Asm Nutool, Inc. Method and apparatus for reduction of defects in wet processed layers
CN105420697A (en) * 2015-12-16 2016-03-23 中山联合光电科技股份有限公司 Automatic vacuum chemical plating equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263991A (en) * 1986-05-07 1987-11-16 Adachi Shin Sangyo Kk Manufacture of plated material
EP0308011A1 (en) * 1987-09-16 1989-03-22 Philips Electronics N.V. Method of locally providing metal on a surface of a substrate
US5259818A (en) * 1989-04-14 1993-11-09 Fuji Kiko Company, Limited Stroke absorbing type intermediate shaft for vehicular steering column and method for assembling the same
US7189146B2 (en) 2003-03-27 2007-03-13 Asm Nutool, Inc. Method for reduction of defects in wet processed layers
US7503830B2 (en) 2003-03-27 2009-03-17 Novellus Systems, Inc. Apparatus for reduction of defects in wet processed layers
WO2004097929A2 (en) * 2003-04-29 2004-11-11 Asm Nutool, Inc. Method and apparatus for reduction of defects in wet processed layers
WO2004097929A3 (en) * 2003-04-29 2004-12-29 Asm Nutool Inc Method and apparatus for reduction of defects in wet processed layers
CN105420697A (en) * 2015-12-16 2016-03-23 中山联合光电科技股份有限公司 Automatic vacuum chemical plating equipment

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