JPS61127194A - Ceramic wiring board - Google Patents
Ceramic wiring boardInfo
- Publication number
- JPS61127194A JPS61127194A JP25017684A JP25017684A JPS61127194A JP S61127194 A JPS61127194 A JP S61127194A JP 25017684 A JP25017684 A JP 25017684A JP 25017684 A JP25017684 A JP 25017684A JP S61127194 A JPS61127194 A JP S61127194A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- ceramic
- wiring board
- ceramic substrate
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業との利用分野〉
本発明はセラミック配線基板に関し、特に配線パターン
上１こ架橋板や外部リード端子等の金属板がロウ材され
るセラミック配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a ceramic wiring board, and more particularly to a ceramic wiring board in which a metal plate such as a bridge plate or an external lead terminal is brazed over a wiring pattern.
＜＝ｆｌ−門の背景〉
近時、情報処理装置の高性能化に伴ない、これを構成す
るセラミック配線基板も高周波特性に優れたものである
ことが要求されている。そのため、セラミック基板とに
形成される配線パターンも従来のタングステン（Ｗ）、
モリブデン（Ｍｏ） 、 モリブデン−マンガン（Ｍ
ｏ −Ｍｎ）等の高融点金属材料ｌこ代わって鋼（Ｃｕ
）等の高周波特性屹優れた低抵抗の材料を用いることが
検討されている。<=Background of fl-gate> In recent years, as the performance of information processing devices has increased, the ceramic wiring boards that constitute the devices are also required to have excellent high frequency characteristics. Therefore, the wiring pattern formed on the ceramic substrate is also made of conventional tungsten (W).
Molybdenum (Mo), Molybdenum-manganese (M
High melting point metal materials such as o -Mn) are replaced by steel (Cu
) and other low-resistance materials with excellent high-frequency characteristics are being considered.
しかし乍ら、第２図に示すよう（こセラミック基板１表
面１こ鋼から成る配線パターン２を形成した場合、該配
線パターン２上に例えば高周波信号の損失、遅延、クロ
ストーク等を防止するための金属架橋板３を銀ロウ材４
を介しロウ材すると、配線パターン２を構成する銅がロ
ウ材４を加熱溶融させた際番こロウ材４中に拡散してし
まい、その結果ロウ材４とセラミック基板ｌとが直接接
触することとなり両者はきわめて漏れ性が悪く接合しな
いことから金属架橋板３はセラミック基板ｌから剥離し
てしまう。そのためセラミック基板１表面の銅から成る
配線パターン２上に金属架橋板３を銀ロウ材４でロウ材
することは実質と不可能であった。However, as shown in FIG. 2, when a wiring pattern 2 made of steel is formed on the surface of the ceramic substrate 1, there are some The metal bridge plate 3 is soldered with silver brazing material 4
If the soldering material is used through the wiring pattern 2, the copper constituting the wiring pattern 2 will diffuse into the soldering material 4 when the soldering material 4 is heated and melted, and as a result, the soldering material 4 and the ceramic substrate l will come into direct contact. As a result, the metal bridging plate 3 peels off from the ceramic substrate l because the two have extremely poor leakage and cannot be bonded together. Therefore, it was virtually impossible to braze the metal bridging plate 3 with the silver brazing material 4 on the wiring pattern 2 made of copper on the surface of the ceramic substrate 1.
〈発明の目的〉
本発明は上記事情【こ鑑み案出されたものであり、その
目的は架橋板や外部リード端子等の金属板を銅から成る
配線パターン上に強固１こロウ材することができるセラ
ミック配線基板を提供す・ることにある。<Objective of the Invention> The present invention has been devised in view of the above-mentioned circumstances, and its purpose is to provide a strong single-coat material for metal plates such as bridging plates and external lead terminals on wiring patterns made of copper. Our goal is to provide ceramic wiring boards that can.
〈問題点を解決するための手段〉
本発明のセラミック配線基板は、セラミック基板上に銅
から成る配線パターンを形成するとともｌξ該配線パタ
ーン下部に高融点金属部を形成したことを特徴とする。<Means for Solving the Problems> The ceramic wiring board of the present invention is characterized in that a wiring pattern made of copper is formed on a ceramic substrate, and a high melting point metal portion is formed under the wiring pattern.
〈作用〉 以下、本発明を添付の第１図に基づき詳細に説明する。<Effect> Hereinafter, the present invention will be explained in detail based on the attached FIG. 1.
第１図は本発明のセラミック配線基板の一実施例を示す
断面図であり、１１はアルミナ（ＡＪ２０ａ）。FIG. 1 is a sectional view showing an embodiment of the ceramic wiring board of the present invention, and 11 is alumina (AJ20a).
フォルステライト（２Ｍｇｏ・５ｉ−Ｏｓ ） 、
ムライト（３ＡＪＩＩ０３ ｅ ２５ｉｎｓ ） 、
ヘリリア（ＢｅＯ）等のセラミックから成るセラミック
基板である。Forsterite (2Mgo・5i-Os),
Mullite (3AJII03 e 25ins),
This is a ceramic substrate made of ceramic such as Heliaria (BeO).
前記セラミック基板１１上の所定部分には高融点金属部
１５ａ、１５１）が複数箇所独立して被着形成されてい
る。前記高融点金属部１５ａ 、 １５ｂは、例えばタ
ングステン（Ｗ）、モリブデン（ＭＯ） 、 モリブ
デン−マンガン（Ｍｏ −Ｍｎ）等から成り、従来周知
の厚膜手法を採用することによりセラミック基板１１ｈ
の所定部分１ζ被着形成される。A plurality of high melting point metal portions 15a, 151) are independently adhered to predetermined portions on the ceramic substrate 11. The high melting point metal parts 15a and 15b are made of, for example, tungsten (W), molybdenum (MO), molybdenum-manganese (Mo-Mn), etc., and are formed on the ceramic substrate 11h by employing a conventionally well-known thick film method.
A predetermined portion 1ζ of is deposited.
前記セラミック基板１１及び高融点金属部ｉｓａ。The ceramic substrate 11 and the high melting point metal part isa.
１５ｂ上には銅（Ｃｕ）から成る配線パターン１２ａ。A wiring pattern 12a made of copper (Cu) is disposed on the wiring pattern 15b.
１２１）が被着形成されている。鋼は高Ｒｆｌ信号の表
皮効果が極めて優れており且つ電力損失も著しく少ない
ことから特に高周波回路基板等の配線パターンとして好
適である。121) is formed by adhesion. Steel has an extremely excellent skin effect for high Rfl signals and has extremely low power loss, so it is particularly suitable for wiring patterns for high frequency circuit boards and the like.
このように銅から成る配線パターン１２ａ、１２’ｂの
下部Ｃζタングステン等の高融点金属部１５ａ、１ｓｔ
）を設けておくと配線パターン１２ａ、１２ｂ上に高周
波信号のクロストーク等を防止するため等の金属架橋板
１３を銀ロウ材（銀７２ｗｔ％−銅２６ ｗｔ％）１４
を介しロウ付した場合、配線パターン１２ａ。In this way, the lower part Cζ of the wiring patterns 12a, 12'b made of copper has a high melting point metal part 15a, 1st made of tungsten, etc.
) is provided on the wiring patterns 12a and 12b to prevent crosstalk of high-frequency signals, etc. The metal bridging plate 13 is made of silver brazing material (72 wt% silver - 26 wt% copper) 14.
In the case of soldering through the wiring pattern 12a.
１２１）の銅成分が銀ロウ材１４中に拡散しても銀ロウ
材１４は高融点金属部１５ａ、ｔａｂに接合することと
なり、両者はなじみがよ（接合性がよいことから金属架
橋板１３はセラミック基板１１より剥離することなく強
固にロウ付けされる。Even if the copper component of 121) diffuses into the silver brazing material 14, the silver brazing material 14 will be bonded to the high melting point metal parts 15a and tab, and the two will be compatible (because of the good bonding properties, the metal bridge plate 13 is firmly brazed to the ceramic substrate 11 without peeling off.
尚、前妃銅から成る配線パターン１２ａ及び１２１）は
従来間知の薄膜手法等によりセラミック基板１１表面及
び高融点金属部１５ａ、１５’ｂ上に被着形成される。The wiring patterns 12a and 121) made of copper are deposited on the surface of the ceramic substrate 11 and the high melting point metal portions 15a and 15'b by a known thin film technique.
また、前記高融点金属部１５ａ、 １５１）の外表面及
び配線パターン１２ａ、 １２ｔ）の外表面にはロウ
材との濡れ性を更に改善するために必要に応じてニッケ
ル（Ｎ１）や金（Ａｕ）等のめつき金属をそれぞれ被着
させることができる。In addition, nickel (N1) or gold (Au) may be applied to the outer surfaces of the high melting point metal portions 15a, 151) and the wiring patterns 12a, 12t) to further improve the wettability with the brazing material. ), etc. can be applied respectively.
〈発明の効果〉
かくして本発明のセラミック配線基板番こよれば、セラ
ミック基板上１こ銅から成る配線パターンを形成すると
ともに金属架橋板や外部リード端子がロウ付される部位
の配線パターン下部に高融点金属部を形成したことから
、金属板を配線パターン上に銀ロウ材によりロウ付して
も一銀ロウ材は高融点金属部に接合することから金属板
とセラミック基板の接合強度は劣化することなく、金属
板を配線パターン上に強固にロウ付することが可能とな
る。<Effects of the Invention> Thus, according to the ceramic wiring board of the present invention, a wiring pattern made of one copper layer is formed on the ceramic substrate, and a high height is formed at the bottom of the wiring pattern in the area where the metal bridging plate and external lead terminals are brazed. Since the melting point metal part is formed, even if the metal plate is brazed with silver brazing material on the wiring pattern, the bonding strength between the metal plate and the ceramic substrate will deteriorate because the silver brazing material will bond to the high melting point metal part. It becomes possible to firmly braze the metal plate onto the wiring pattern without any trouble.
尚、本発明は上述の実施例にのみ限定されるものではな
く、本発明の要旨を逸脱しない範囲であれば種々の変更
は可能である。Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
第１図は本発明のセラミック配線基板の一実施例を示す
断面図、第２図は従来のセラミック配線基板を示す断面
図である。FIG. 1 is a sectional view showing an embodiment of the ceramic wiring board of the present invention, and FIG. 2 is a sectional view showing a conventional ceramic wiring board.
Claims (1)
とともに該配線パターン下部に高融点金属部を形成した
ことを特徴とするセラミック配線基板。A ceramic wiring board characterized in that a wiring pattern made of copper is formed on a ceramic substrate, and a high melting point metal part is formed below the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25017684A JPS61127194A (en) | 1984-11-26 | 1984-11-26 | Ceramic wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25017684A JPS61127194A (en) | 1984-11-26 | 1984-11-26 | Ceramic wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127194A true JPS61127194A (en) | 1986-06-14 |
Family
ID=17203944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25017684A Pending JPS61127194A (en) | 1984-11-26 | 1984-11-26 | Ceramic wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127194A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04349690A (en) * | 1991-05-27 | 1992-12-04 | Kyocera Corp | Circuit board |
| US7878018B2 (en) | 2006-01-25 | 2011-02-01 | Lg Electronics Inc. | Kimchi refrigerator and control method of the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130590A (en) * | 1982-01-29 | 1983-08-04 | 株式会社日立製作所 | Ceramic circuit board and thick film hybrid ic using same board |
-
1984
- 1984-11-26 JP JP25017684A patent/JPS61127194A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130590A (en) * | 1982-01-29 | 1983-08-04 | 株式会社日立製作所 | Ceramic circuit board and thick film hybrid ic using same board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04349690A (en) * | 1991-05-27 | 1992-12-04 | Kyocera Corp | Circuit board |
| US7878018B2 (en) | 2006-01-25 | 2011-02-01 | Lg Electronics Inc. | Kimchi refrigerator and control method of the same |
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