JPS61124157A - 半導体装置用キヤツプ・フレ−ム - Google Patents

半導体装置用キヤツプ・フレ−ム

Info

Publication number
JPS61124157A
JPS61124157A JP59245312A JP24531284A JPS61124157A JP S61124157 A JPS61124157 A JP S61124157A JP 59245312 A JP59245312 A JP 59245312A JP 24531284 A JP24531284 A JP 24531284A JP S61124157 A JPS61124157 A JP S61124157A
Authority
JP
Japan
Prior art keywords
cap
frame
caps
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59245312A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0351300B2 (enExample
Inventor
Eiji Hagimoto
萩本　英二
Koji Nagao
長尾　工司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59245312A priority Critical patent/JPS61124157A/ja
Publication of JPS61124157A publication Critical patent/JPS61124157A/ja
Publication of JPH0351300B2 publication Critical patent/JPH0351300B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59245312A 1984-11-20 1984-11-20 半導体装置用キヤツプ・フレ−ム Granted JPS61124157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59245312A JPS61124157A (ja) 1984-11-20 1984-11-20 半導体装置用キヤツプ・フレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59245312A JPS61124157A (ja) 1984-11-20 1984-11-20 半導体装置用キヤツプ・フレ−ム

Publications (2)

Publication Number Publication Date
JPS61124157A true JPS61124157A (ja) 1986-06-11
JPH0351300B2 JPH0351300B2 (enExample) 1991-08-06

Family

ID=17131797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59245312A Granted JPS61124157A (ja) 1984-11-20 1984-11-20 半導体装置用キヤツプ・フレ−ム

Country Status (1)

Country Link
JP (1) JPS61124157A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174340A (ja) * 1987-01-13 1988-07-18 Ibiden Co Ltd 半導体装置
JPH0529152U (ja) * 1992-08-07 1993-04-16 イビデン株式会社 電子部品装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174340A (ja) * 1987-01-13 1988-07-18 Ibiden Co Ltd 半導体装置
JPH0529152U (ja) * 1992-08-07 1993-04-16 イビデン株式会社 電子部品装置

Also Published As

Publication number Publication date
JPH0351300B2 (enExample) 1991-08-06

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