JPS61123151A - Production apparatus - Google Patents
Production apparatusInfo
- Publication number
- JPS61123151A JPS61123151A JP23512385A JP23512385A JPS61123151A JP S61123151 A JPS61123151 A JP S61123151A JP 23512385 A JP23512385 A JP 23512385A JP 23512385 A JP23512385 A JP 23512385A JP S61123151 A JPS61123151 A JP S61123151A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- stocker
- works
- conveyor
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Control Of Conveyors (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は多品種の製品群を製・造するにあたって数工程
に亘る各処理作業にそれぞれ対応する処理装置群(Jo
b−5hop−Type)及び各処理装置群にワーク(
被処理物)を搬送する搬送機(搬送装置)を配し、多品
種のワークの処理順序、処理条件等を入力情報から自動
的に求めて前記搬送機、処理装置群等を制御゛し、効率
2よく有機的にこれらを稼動(Flow−3hop−T
ype)させ製品管理、工程管理の最適化を図った自動
化された製造装置、特に、半導体工業におけるウェハ(
半導
以下余白
体薄板)の処理加工装置に関する。Detailed Description of the Invention The present invention provides a processing equipment group (Jo
b-5hop-Type) and each processing equipment group (
A conveying machine (conveying device) for conveying (workpieces) is arranged, and the conveying machine, a group of processing devices, etc. are controlled by automatically determining the processing order, processing conditions, etc. of various types of workpieces from input information, Operate these organically with high efficiency (Flow-3hop-T)
Automated manufacturing equipment that optimizes product management and process control, especially wafer production in the semiconductor industry.
This invention relates to processing equipment for semiconductors (sub-semiconductor thin plates).
半導体装置、IC(集積回路)、LSI(大規模集積口
n>専の組立に用いる回路素子は一般に半導体小片(ベ
レット)で形成されている。このぜレットは偉い半導体
g(ウェー)K!!1横に整列配置形成された回路素子
領域をその境で分断することに工って得られる。ウェー
に回路素子領域を作るKは極めて多くの一造工8fc必
要とする。たとえば、シリコンウェハ(所望の不純物原
子を含む領域を形成する工程についてみても、(1)ウ
ニ・へt洗浄して清浄化する洗浄工程、C2)クエ・・
を熱処理して表面に酸化膜(3’Oz) を形成する
酸化膜形成工程、(3)酸化膜上にレジスト(フォトレ
ジスト)を塗布しかつ乾燥するレジス)I!布工程、(
4)レジストを部分感光させる露光工程、(5)感光し
σストあるいは非感光レジストt一部分的に除去するレ
ジスト細分除去(エツチング)二[、(6)酸化膜上に
部分的r/c残留するレジストをマスクとして用いて露
出する酸化at−除去する酸化膜部分除去(エツチング
)より、C7酸化膜上の残留するレジ、ストを除去する
レジスト除去(エツチング)工程、(8)酸化膜をマス
クとして不純物雰囲気中にシリコンクエl5t−置くと
か、CVD (気相化学成長)、蒸着、イオン打ち込み
等の技術で不純物原子ft露出するシリコン上に沈着お
るいは素層部に瀝入させ、再び熱を加えて所望の深場に
不純物を拡散させる拡散工程、(9)ウニへ表面の不要
酸化膜等を除去する除去(エツチング)工程等がるる。Circuit elements used in the assembly of semiconductor devices, ICs (integrated circuits), and LSIs (large-scale integration) are generally made of small semiconductor pieces (vellets). These pellets are great semiconductors! It is obtained by dividing circuit element regions arranged horizontally in one line at the boundary. K to create circuit element regions on a wafer requires an extremely large number of machining processes of 8 fc. For example, a silicon wafer ( Looking at the process of forming a region containing desired impurity atoms, there are (1) a cleaning process of cleaning by cleaning with sea urchins, C2) que...
An oxide film forming step in which an oxide film (3'Oz) is formed on the surface by heat treatment, (3) a resist (photoresist) is applied on the oxide film and dried)I! Cloth process (
4) Exposure step to partially expose the resist, (5) Resist subdivided removal (etching) to partially remove exposed and non-exposed resist, (6) Partial r/c remaining on the oxide film. (8) Resist removal (etching) process to remove the resist remaining on the C7 oxide film from the oxide film part removal (etching) using the resist as a mask to expose the oxide at-removal; (8) using the oxide film as a mask By placing silicon quench in an impurity atmosphere, or by using techniques such as CVD (chemical vapor deposition), vapor deposition, or ion implantation, impurity atoms are deposited on exposed silicon or transferred into the base layer, and heat is applied again. In addition, there is a diffusion process to diffuse impurities to a desired depth, and (9) a removal (etching) process to remove unnecessary oxide films and the like on the surface of the sea urchin.
また、前記レジスト塗布工程から始まり、(7)のレジ
スト除去工程で終る技術は一般に写真蝕刻技術と呼ば1
ているが、回路素子の形成にはこの技術が繰り返して使
用される。すなわち、不純物拡散以外の配線層の形成、
ノミツクイージョンのための保轟膜形成等にも用いられ
る。Furthermore, the technique that starts with the resist coating process and ends with the resist removal process (7) is generally called photoetching technique.
However, this technique is used repeatedly to form circuit elements. In other words, formation of wiring layer other than impurity diffusion,
It is also used to form a holding film for chisel quesion.
このようにクエへく各種処理を施こすウニ^処理に訃け
る工程順路は各製品毎によって異なる。In this way, various processes are applied to the sea urchin, and the process sequence for each product differs depending on the product.
最も効率のよい作業形態として工程順に沿って作業装置
設備を配置するいわゆる70・ショップ屋(Flow
−5hop −Type ) を採用すれば、スムース
にワークが流れる。しかし、各製品は独自に設備配置を
持つに足るようには大量に生産で目ないのが一般でらる
。仮りに、“そのよ5な大量生産ができる製品が存在し
ても、半導体工業°の発展は署しく、製品の移り変わり
は激しい。このため、その設備配置はすぐに陳腐化して
使えなくなる地味がめる。そこで、従来は第1図に示す
ように、共通的な作業をするa4A詳をまとめる配置、
いわゆるジョブ・ショップ型(Job −5hOp−T
”!pe)(同図において、複数の拡政装置1t−配置
した拡散N2、複数のイオン打込み装置3を配置したイ
オン打込み瓦4、複数のフォトエツチング装置5および
N装置6t−配置し尺フォトレジスト呈7、複数の蒸M
装置8等を配置したCVD蒸層呈9、複数の検量装!(
プローバ)10を配置した検査!1t11等を配設する
。)を採用し、各装e杯で一部
厩に多数品種のワークを処理する方法をとらざるへ
を得ない。しかし、ウェー処理ではiB法(数十方法)
の異なる多種(数百種類)のワークを大量(数万個)に
同時に流すので、これを旨く管理して泥すことFi難し
い。その結果、工児(工期)は長くなり、かつ多数の作
業員を必要とする欠点がある。また、ウニ^を処理する
作業空間は常に清浄に保つ必要があるが、多勢の作業員
が処理室内を動き回るため、被服(付着したごみf床等
に付着するごみが舞い上がったりして飛散し、クエ・・
が汚染され、歩留が低下する。特に回路素子のパターン
が微細化するにつれて高い清浄度の作業空間が要京され
る。 °゛
一方、人間は本質的Kffiも効率の良い状態を永続す
ることは翔しく、工完長期化の原因ともなっている。The most efficient work format is the so-called 70-shop shop (Flow
-5hop -Type), the work will flow smoothly. However, each product is generally not produced in large quantities to warrant its own equipment layout. Even if such a product existed that could be mass-produced, the development of the semiconductor industry is slow and products change rapidly.As a result, the equipment layout would quickly become obsolete and unusable. Therefore, conventionally, as shown in Figure 1, a4A details that perform common tasks are arranged together.
So-called job shop type (Job-5hOp-T)
``!pe) (In the figure, a plurality of expansion devices 1t-disposed diffusion N2, an ion implantation tile 4 with a plurality of ion implantation devices 3 disposed, a plurality of photoetching devices 5 and an N device 6t-disposed photo Resist presentation 7, multiple vaporization M
CVD evaporation layer 9 with equipment 8 etc. installed, multiple calibration devices! (
Prober) Inspection with 10 placed! 1t11 etc. are arranged. ), and we have no choice but to adopt a method of processing multiple types of work in some stables for each type of e-cup. However, in wave processing, the iB method (dozens of methods)
Since a large number (tens of thousands) of different types (hundreds of types) of workpieces with different characteristics are flowed simultaneously, it is difficult to manage them effectively. As a result, the construction period becomes long and a large number of workers are required. In addition, the work space where sea urchins are processed needs to be kept clean at all times, but as many workers move around in the processing room, clothing (garbage adhering to them) and dirt adhering to the floor, etc., may fly up and scatter. Quest...
becomes contaminated and reduces yield. In particular, as the patterns of circuit elements become finer, highly clean work spaces are required.゛On the other hand, it is difficult for humans to maintain a highly efficient state permanently due to their inherent Kffi, which is also a cause of prolonging the completion time of construction.
そこで、従来ウェー処理工程の細部の個々の自動化を図
ることによって、各工程での作業の効率化1.清浄作業
空間の維持による歩留の向上を図っている。またミニ程
の退行管理情報処理をコンピユータ化することも一部で
は行なわれている。Therefore, by automating each detail of the conventional wafer processing process, work efficiency in each process has been improved.1. We are working to improve yield by maintaining a clean work space. In addition, some efforts are being made to computerize regression management information processing on a mini-scale.
しかし、これらの装置では単一工程の自動化、コンピュ
ータ制御化でろって、単一製品の製造経路からみ之場合
、製品管理が充分とは言えない。However, even if these devices are automated or computer-controlled for a single process, product management is not sufficient when viewed from the manufacturing route of a single product.
また、ウニ^は各自動機間あるいは処理2間を作業者に
よって這はれることから、ウェー〇汚染防止は充分とは
言えない。特にウェーの移動経路中に作業者が存在する
ことが汚tQ!’t−充分く防げない致命的な原因とな
っている。In addition, since sea urchins crawl between each automatic machine or between two processing machines by workers, prevention of wafer contamination cannot be said to be sufficient. In particular, the presence of workers along the moving route of the wafer is a contamination! 't-This is a fatal cause that cannot be adequately prevented.
したがって、本発明の目的はクエ・〜処理等のワークの
処理を無人化装置内で処理することによってワークの汚
染を防止するとともに、ワークの一連の作業を有機的K
III御゛して、多品穫多数のワークの製品管理を行
なうことによって、製品の工完短縮、歩留向上、作業人
員低減を図ることIcある。Therefore, the purpose of the present invention is to prevent contamination of the workpiece by processing the workpiece, such as query processing, in an unmanned device, and to perform a series of operations on the workpiece in an organic manner.
It is possible to shorten the completion time of products, improve yields, and reduce the number of workers by performing product management for a large number of products and many workpieces.
また、本発明の他の目的は各処理装置′1#全集約する
ことによって設備の据付けに必要な敷地を小さくするこ
とIcある。Another object of the present invention is to reduce the area required for installing the equipment by consolidating all of the processing equipment '1#.
以下余白
このような目的を達成するために本発明は、被処理物を
自動的に搬送して所定の処理を施す処理装置をそれぞれ
少なくとも一台有し被処理物に対してそれぞれ異なった
処理を施す複数の処理部門と、各処理装置間を結ぶ搬送
路と、前記搬送路に沿って移動して各処理装置に移動す
る被処理物を収容保持する搬送装置と、各処理装置と搬
送装置との間で被処理物を移換する移換装置と、前記搬
送路に面して配設され被処理物を収容する収容部を複数
有しかつ搬送装置との間で被処理物の授受を行なうスト
ッカと、前記各処理装置、搬送装置。Margin below In order to achieve such an object, the present invention has at least one processing device that automatically transports the object to be processed and performs a predetermined process, and each of the processing devices performs different processing on the object to be processed. a plurality of processing departments for processing, a transport path connecting each processing device, a transport device that accommodates and holds the workpiece that moves along the transport path and is transferred to each processing device, and each processing device and the transport device. A transfer device that transfers the workpiece between the two, and a plurality of storage units disposed facing the conveyance path and accommodating the workpiece, and transfers the workpiece between the conveyor and the conveyance device. A stocker, each processing device, and a conveyance device.
移換装置、ストッカを制御する制御装置を備えるもので
ある。It is equipped with a control device that controls a transfer device and a stocker.
つぎに、第2因〜第9図に示す図面を参照しながら本発
明について説明する。第2図〜第8図は本発明の一実施
例を示す。第2図は本発明による製造装置、特にウェハ
処理装置の″aWIi平面図を示す。このウェハ処理装
置は建屋全体あるいは一部が一つの装置となっていて、
その中には多くの装置類が配置されている。すなわち、
建屋の中央にはその長手方向く沿って搬送路12が配設
されている。また、この搬送路12はいくつも停止箇所
(図示O印で示す。)13を有している。また、搬送路
120両側にはそれぞれ複数の処理製置からなる処理部
門が複数配設されている。すなわち、搬送路12の−@
には2台の自動化されたCVD装置14からなるCVD
処理部門15.4台の自動化された拡散装置16からな
る拡散処理部門17.4台の自動化てれ7?、フォトレ
ジスト感光製置18からなる感光処理部門(露光処理部
門)19.2台の自動化さA7?:フォトエツチング装
置20からなるエツチング処理部門21.2台の自動化
されたイオン打込装置22からなるイオン打込、処理部
門23がそれぞれ並イて配置aでれている。Next, the present invention will be explained with reference to the drawings shown in Factor 2 to FIG. 9. 2 to 8 show an embodiment of the present invention. FIG. 2 shows an "aWIi" plan view of a manufacturing apparatus according to the present invention, particularly a wafer processing apparatus. This wafer processing apparatus has a building in which the whole or part of the building is a single apparatus.
Many devices are located inside it. That is,
A conveyance path 12 is arranged in the center of the building along its longitudinal direction. Further, this conveyance path 12 has a number of stopping points (indicated by O marks in the figure) 13. Furthermore, a plurality of processing departments each consisting of a plurality of processing equipment are arranged on both sides of the conveyance path 120. In other words, −@ of the conveyance path 12
The CVD system consists of two automated CVD devices 14.
Processing Department 15. Diffusion Processing Department consisting of 4 automated diffusion devices 16 17. 4 automated diffusion devices 7? , photoresist processing section (exposure processing section) consisting of 18 photoresist processing machines, 19.2 automated machines A7? : An etching processing section 21 consisting of a photoetching device 20 and an ion implantation and processing section 23 consisting of two automated ion implantation devices 22 are arranged side by side.
また、搬送路12の他側には2台の自動化てれた蒸着装
置24からなる蒸着処理部門25.3台の自動化された
検査装置26からなる検査処理部門27、自動化され友
ストッカ28が配設されている。lた、ストッカ28の
背面には、中央側u装置29(コンピュータ)を配した
ガラス張りの室からなる中央情報処理@30が配設され
ている。Further, on the other side of the conveyance path 12, a vapor deposition processing section 25 consisting of two automated vapor deposition devices 24, an inspection processing section 27 consisting of three automated inspection devices 26, and an automated companion stocker 28 are arranged. It is set up. Furthermore, on the back side of the stocker 28, a central information processing @30 consisting of a glass-walled room in which a central u device 29 (computer) is arranged is disposed.
また、ストッカ28および中央情報処理室30の側方に
は空気調和除塵(空調除塵)機械室31が広く設けられ
ている。この空調除!!1m械室31には空気を清浄化
する図示しない装置が配設式れ、この装置で建屋内金体
の空気の?#浄化を図っている。特に囚で・・ソチング
′t−施こさない領域(・・ツチング領域は各処理装置
を修理調整する保全室となっている。)すなわち、搬送
路12を設けた領域、ストッカ28を設けfI−gA域
、各処理装置および各処理装置の前面および搬送路12
に対面するそれぞれの領域は一段と高い空気清浄度7c
維持されている。なお、図中32はj@を示す。Further, an air conditioning dust removal (air conditioning dust removal) machine room 31 is widely provided on the side of the stocker 28 and the central information processing room 30. Except for this air conditioner! ! A device (not shown) for purifying the air is installed in the 1m machine room 31, and this device cleans the air inside the building's metal body. #We are trying to purify. Particularly in the case of prisoners...an area where soching is not carried out (...the soching area is a maintenance room where each processing device is repaired and adjusted). gA area, each processing device, the front of each processing device, and the conveyance path 12
Each area facing the air has an even higher air cleanliness level of 7c.
Maintained. Note that 32 in the figure indicates j@.
@記各処理部門17の各処理製置の数は同一の処理でも
工程によってはたとえば処理雰囲気が異なつ次り、オー
トドーピングを防いたりすることから同一装置を使用で
きないことによって増加するとともに、建屋内金体のワ
ークの流れを円滑に行なわせるように各装置のバランス
を考慮して決定てれる。The number of processing equipment in each processing department 17 increases because even for the same processing, the processing atmosphere differs depending on the process, and secondly, the same equipment cannot be used to prevent autodoping. It is determined by considering the balance of each device to ensure smooth flow of indoor metal work.
l九、搬送s&12における停止箇所に対応する6処!
l:?cαの一端にはワークを搬出入する筒−ディンゲ
スチージョン(■−ディング位装置)およびアンローデ
ィ/メスチージョン(アン冨−テイング立は)が七れ一
+:れ配設てれている。そして、ローディンメスチージ
ョンに供給(搬入)テれ几ワークはそ几ぞn鎖線矢印で
示すようKI!i)処理装置の処!1部に自動釣に運び
込まれて所愈の処理で施こさ几た後、アンローディンメ
スチージョンに戻嘔nる。lた停止綿屑13はストッカ
281Cも対面している。6 locations corresponding to the stopping points in l9, transportation s & 12!
l:? At one end of cα, a tube-ding station (■-ding position device) and an unloading/message station (unloading station) for loading and unloading the workpiece are arranged. Then, the workpiece is supplied (carried in) to the loading station as shown by the dashed line arrow. i) Processing equipment! After being taken to the automatic fishing station in the first section and cleaned up as required, it was returned to the unloading mess section. The stopped cotton waste 13 also faces the stocker 281C.
一方、前記搬送路12上にはワーク(この場合はクエ/
%ii収容したカートリッジ、たとえばクエ^t−25
並列列に収容する公知の運搬用1−トリッレ)を複数保
持して搬送する搬送装(!i(搬送機)23が配設され
ている。この搬送装f133にたとえば4台配設ぢれて
、個々は前記〒矢制#装置29に制御ぢnて搬送路12
上t−移動する。1次、搬送路120両端部には搬送−
置待機スチージョン34が設けられ、使用てれない搬送
装f133が待機するよりになっている。搬送装置33
は術5図〜第7図で示すように、台座35の下部に車輪
36t−有し、無線によって制御てれて移動する。On the other hand, on the conveyance path 12, there is a workpiece (in this case, a
%ii accommodated cartridges, such as Que^t-25
A transport device (!i (transport machine) 23 is disposed that holds and transports a plurality of known transport 1-trilles stored in parallel rows. For example, four transport devices are disposed in this transport device f133. , each is controlled by the arrow control device 29 and the conveyance path 12
Up t - Move. The primary conveyance path 120 has conveyance at both ends.
A station standby station 34 is provided so that an unused transport device f133 is placed on standby. Conveying device 33
As shown in FIGS. 5 to 7, it has wheels 36t at the bottom of the base 35 and moves under wireless control.
1 fc s台座35上の機体37からは側方にワーク
受はアーム38が設けられ、第5図で示すよう罠、スト
ッカ28から運び出され九ワーク39を載置支持、シ、
帛6■で示すように処理装置のローディングステーショ
ン40に移し変えるよ5になっている。(アンローディ
ングステーションに:6つてはワークを受は取る。なお
、これら授受装置は一般公知の装置、機構でよく、たと
えば各処理装置側に設ける。)。したがって、ワーク受
はアーム38は台座35上t−回動するよ5にもなって
いる。A workpiece receiving arm 38 is provided on the side of the machine 37 on the 1 fc s pedestal 35, and as shown in FIG.
As shown in Figure 6-5, it is transferred to the loading station 40 of the processing device. (At the unloading station: 6 stations receive and take the workpieces. These transfer devices may be generally known devices and mechanisms, and are provided, for example, on each processing device side.) Therefore, the arm 38 of the workpiece receiver is also rotated by t on the pedestal 35.
を大、1I12!S装置33は搬送路12に沿って移動
するが、搬送路12に沿って張り付けられに光学的・磁
気的・機械的等に検出回層なテープを検出しながら進み
、次とえは、搬送路12の停止箇所13をカクントして
目的位置TiC進むようになっている。Big, 1I12! The S device 33 moves along the conveyance path 12 while detecting the tape attached along the conveyance path 12 optically, magnetically, mechanically, etc. The vehicle is designed to pass a stop point 13 on a road 12 and proceed to the destination TiC.
ストッカ28は第3図、第4図に示すように、ワーク3
9t−収容する複数の収容部41を有する棚42と、こ
の棚42の前面において昇降、左右動自在なトランス7
7機43とからなってやる。As shown in FIGS. 3 and 4, the stocker 28 stores the workpiece 3.
9t - A shelf 42 having a plurality of accommodating parts 41, and a transformer 7 that can be raised and lowered and moved left and right on the front surface of the shelf 42.
It will consist of 7 aircraft and 43 aircraft.
そして、トランスファ機43は中央制御装置290指令
によって、棚42の所定位置にあるワーク39t−取り
出して搬送装fi!33に供給したり、あるいは搬送装
933に保持されているワーク39を保持して棚の9収
容部41に収容する。なお、棚にシけるワーク39の情
報は全て中央制御装置29で制御される。Then, in response to a command from the central controller 290, the transfer machine 43 takes out the workpiece 39t from a predetermined position on the shelf 42 and transfers it to the transfer device fi! 33, or hold the workpiece 39 held by the transport device 933 and store it in the storage section 41 of the shelf. Note that all information about the works 39 to be placed on the shelves is controlled by the central control device 29.
つぎに、!8gの70−チャートを参照しなからつ、工
・・処理作t&t−説明する。まず、ストッカに収容さ
れているワーク(処理品積やロフト)全体の確認を行な
う(1,1品管理)。品種(製品)を確認すれば、工程
フローは決定して込るので、つぎはどの処理を行なえば
よいか判明する。また、各処理部門における各処理装置
の現在のPl:桑状態を確認して、その余裕変、仕掛状
態を調べる。さらに、咎表品(ロフト)の優先順位を決
定する。これらの各作業は中央制御装置に記憶されてい
る情報に基づいて行なわれる。その後、空きライン(4
!r処理装置)の有無をチェックし、このライン ゛を
使用することのできるワシク(0ツト)があるか否かを
チェックする。さらに1このワーク<e+’ット)は優
先7111位を結果的に損わないか否かをチェックし、
損わない場合には搬送装置およびトランスファ機t−駆
動ぢせて、所定の処理装置Kワークを運ぶ用意を嘔ぜる
。next,! Referring to the 8g 70-chart, I will explain the process. First, the entire workpiece (processed product volume and loft) stored in the stocker is confirmed (one-by-one product management). Once the type (product) is confirmed, the process flow is determined, so it becomes clear which process to perform next. In addition, the current Pl:mulberry status of each processing device in each processing department is confirmed, and its margin change and work-in-progress status are investigated. Furthermore, the priority order of the lofts is determined. Each of these operations is performed based on information stored in the central controller. After that, open line (4
! It checks whether there is a line (0) that can use this line. Furthermore, 1 checks whether this work<e+'t) does not result in the loss of priority 7111,
If there is no damage, the transport device and the transfer machine t-drive will not be ready to transport the workpiece to the predetermined processing device.
一方、これと併行して、完成したロフトがめるか否かを
チェックし、有る場合には搬送装置およびトランスファ
掘をgo嘔ぜてワークを9収容部41に収容する。そし
て、全ラインのチェックを完了した後は、各処理装置、
搬送装置、トランスファ機を、常に作業進行予測を行な
いながら動作名゛ぜゐ。On the other hand, in parallel with this, it is checked whether the completed loft can be accommodated or not, and if it is, the conveyance device and the transfer excavator are turned off and the workpiece is accommodated in the storage section 9 41 . After checking all lines, each processing device,
The operation of the transport equipment and transfer machine is controlled while constantly predicting the progress of the work.
前記中央制御装置はワーク(ロット)の工程管理、製品
管理ばかりでなく、各処理装置のプロセス条件管理、グ
j七スγ−タ収集、さらには処理装置のシーダンス制御
群管理をも行なり。なお、中央制御装置で全ての管理を
行なうと、情報記憶装置、計算量等が多くなり、fc置
が大型化することから、各処理装置、飯送装謹、ストッ
カ等にも小型の制WJ装置を内蔵でぜ、中央制鉤装置と
の間で記は、計算、制御等の各作業を分担ぢせるように
してもよい。The central control unit not only manages the process of workpieces (lots) and products, but also manages the process conditions of each processing device, collects data, and also manages seedance control groups of the processing devices. . In addition, if all the management is performed by a central control unit, the information storage device, the amount of calculation, etc. will increase, and the fc unit will become larger. The device may be built-in, and each work such as calculation, control, etc. may be shared between the device and the central control device.
このような実m向によれは、つぎのような効果が生じる
。Such deviation in the actual m direction produces the following effects.
(1) ワークに対して同一系統の作業は同一処理部門
の処理g&置で行ない、各処理部門間はt@送装置を用
いて行なう、いわゆるフロラ・ショップ・タイプとし、
これら七袈品゛簀埋、工程管理をも汚点して自動的に制
@装註で管理する次め、各処理I&置は効率よく稼動し
、かつロフトも希望するロットから順次クエへ作業が完
了すると−とになるので、作業性が極めて高くなる。ま
た、グロ七ス条件、グロ七スモニタ等もコンピュータに
よって制御ぢれる次め、高品質で安定した処理が成てれ
る。(1) The same type of work for the work is performed in the same processing department's processing department, and the t@ transfer device is used between each processing department, which is a so-called flora shop type.
By arranging these seven-piece products and automatically managing the process control with control@equipment, each processing unit and equipment will operate efficiently, and the loft will be able to work from the desired lot to the desired batch. When completed, it becomes -, so the work efficiency is extremely high. In addition, the computer controls the global conditions, global monitor, etc., resulting in high-quality and stable processing.
(2) この装置はジョグ・ショップ・タイプをも一部
で採用した7a−・ショップ・タイプでろることから故
地面積を従来に較べて狭くすることができる。(2) Since this device is a 7a-shop type, in which a part of the jog shop type is also adopted, the ground area can be made smaller than that of conventional devices.
(3) クエへの移kjJ域には原則的には作業者は
立ち入らない。この次め、従来多量の血埃の発生源でろ
る作業者がいないことによってウニへの汚染は減少し、
歩留が向上する。(3) In principle, workers are not allowed to enter the kjJ area. Next, contamination of sea urchins is reduced because there are no workers who are the source of large amounts of blood dust.
Yield is improved.
(4)各処理部Cは菖2図の・1ツチング領域である背
面から6J!lIA整截れるため、高い清浄度空間が狭
くな9空気清浄化装置が従来Kmべて小型化できる。(4) Each processing section C is 6J from the back which is the 1 cutting area of the iris diagram 2! Since the lIA is arranged, high cleanliness and narrow air purification equipment can be made smaller than conventional 9Km.
(5) この&置では全ての作業は自動化てれている
ので、作業人負金低減でさる。(5) Since all the work in this machine is automated, the burden on workers is reduced.
な2、不発明は前記実施でQK限定でれない。すなわち
、処理部門はさらに多数であってもよく、各′処理部門
の処理装置数は笑施11Rjの数と異なってもよい。ま
た、実施列では搬送i置は部屋内だけを移動するように
しであるが、他の作業との連結を考え、隣掛する建屋に
直接出入するよりにしてもよい。tfc1各処理装置の
ローディング位置およびアン;−ディング位置は実施列
では同一端に設け、一つの移換装置を共月するようにし
ているが、このローディング位置およびアンローディン
グ位置を自動化された処理層Itをそれぞれ一端忙分け
て配置するようにしてもよい。また、移換装置には搬送
装置の位置決め機構やワークの授受確認機構を設ける。Second, the invention is not limited to QK in the above implementation. That is, there may be a larger number of processing departments, and the number of processing devices in each processing department may be different from the number of processing units 11Rj. In addition, in the actual process, the transport unit moves only within the room, but in consideration of connection with other work, it may be possible to move directly into and out of the adjacent building. tfc1 The loading and unloading positions of each processing device are provided at the same end in the actual row, so that one transfer device is used together, but this loading and unloading position is set in an automated processing layer. It may be arranged such that each of the It is divided into two parts. Further, the transfer device is provided with a mechanism for positioning the transfer device and a mechanism for confirming transfer of the workpiece.
ま九、位置決め、された際、搬送装置と処理装置がドツ
Φングし、この状態で両者間の情報の交換が行なわれる
ようKしてもよい。Furthermore, when the positioning is performed, the transport device and the processing device may be brought into contact with each other, and information may be exchanged between the two in this state.
”!7t−X移換装置はローラコンベア方式やグツシャ
方式等であってもよい。また、搬送装置はM線方式でコ
ントロールするよ5Kしてもよい。また、搬送装aは床
上t−走るタイプ以外でろってもよい。``!7t-X transfer device may be of a roller conveyor type, a grip type, etc. Also, the transfer device may be 5K controlled by an M-line method. It can be anything other than the type.
lた、第9図に示すように、中央にストッカ28を配し
、その囲りを搬送装置33t−回動させ、各処理部門4
4にワーク’tm送するようにしてもよい。ま几、本発
明はウェー・処理以外の技術に適用できる。In addition, as shown in FIG.
It is also possible to send the work 'tm in step 4. However, the present invention can be applied to technologies other than wafer processing.
以上のように、不発明の!A造装置によれば、全てコン
ピュータによって製品管理、工程管理、処理飯送管理等
が行なわれるのモ、各処理部門は有機的に制御されワー
クの流れがスムースになり、漬望のロットから効率L<
jm次処理が行なわれる。As mentioned above, uninvented! According to the A-manufacturing equipment, product management, process management, processing and transport management, etc. are all carried out by computer, and each processing department is organically controlled, resulting in a smooth flow of work and efficient production from small lots. L<
jm-th processing is performed.
この九め、処理コストの低減が因れる。This ninth factor is due to the reduction in processing costs.
1、念、本発明によれば、作粛スペースと保全スペース
を分離させ、^清浄度ルームとしての作業スペースf、
従来に較べて狭くすることができ次ことから、臣調除塵
装置の小型化を図ることができ、設@費を軽減すること
がでまた。1. According to the present invention, the cleaning space and the maintenance space are separated, and the work space f as a cleanliness room is created.
Since it can be made narrower than before, the dust removal device can be made smaller and the installation cost can be reduced.
47’C、本発明によれば、作業スペースには作業者が
立ち居らないことと、各処理装置の処理条件等はコンピ
ュータによって適格に制@嘔れることから、微細処理も
正確確実に行なえ、歩留も同上する。47'C. According to the present invention, since no worker is present in the work space and the processing conditions of each processing device can be appropriately controlled by a computer, even fine processing can be performed accurately and reliably. Same goes for yield.
1次、本発明によれば、処4装置の配tR4−ジョブ′
・ショップ・タイプと70−・タイプとを連結しfc構
成となっていることから、各ワークを効率的に流せる。First, according to the present invention, the arrangement of processing 4 devices tR4-job'
・Since the shop type and 70-type are connected to form an fc configuration, each workpiece can be flowed efficiently.
特に、このフロー・ショップ・タイプによれば、新製品
系列でもコンピュータ円にデータを追加するだけで旧来
の製品と同様に合理化されたラインとして流すことがで
きる。lた、新プロセスを導入する場合でも、追加設備
群とじて取り扱えばスムースにラインに入れることがで
きる。まt1フロー・ショップ・タイプにすることによ
って、必要な敷地を狭くすることができる等多くの効果
を奏する。In particular, according to this flow shop type, even new product lines can be run as a streamlined line in the same way as old products simply by adding data to the computer circle. Furthermore, even when introducing a new process, it can be smoothly introduced into the production line by handling it as a group of additional equipment. By making it a 1-flow shop type, there are many effects such as being able to reduce the required area.
第1図は従来のウニ・・処理車ヲ示すレイアウト、渠2
0は本発明の艮造装置の一実施例を示す平面図、第3図
は同じくストッカの正面図、県4図は同じくストッカの
側断面図、第5図は同じくストッカと搬送at示す正面
図、第6回は同じく搬送機と処理装置詳を示す正面図、
第7図は同じく搬送機の側面図、第8図は同じく処理工
程進行制御フローチャート、第9図は本発明の他の実施
列を示す平面図である。
1・・・拡散妄司、2・・・拡散室、3・・・イオン打
込み装置、4・・・イオン打込み室、5・・・フォトエ
ツチング装置、6・・・n光装置、7・・・フォトレジ
スト室、8・・・蒸着装置、9・・・CVD・・・蒸着
室、1o・・・検査装置、11・・・検査室、12・・
・搬送路、13・・・停止箇所、14・CVD装置、l
5−CV D処理部門、16・・・拡散装置、17・
・・拡散処理部門、18・・・フォトレジスト感光装置
、19・・・感光処理部門、20・・・フォトエツチン
グ!直、21・・・エツチング処理部門、22・・・イ
オン打込mH12a・・・イオン打込処理部門、24・
・・蒸着装置、25・・・蒸着処理部門、26・・・検
査装置、27・・・検査処理部門、28・・・ストッカ
、29・・・中央制御装置、30・・・中央情報処理室
、31・・・4調除塵機械室、32・・・工、33・・
・搬送装置、34・・・搬送装置待箭ステーショ11字
2ン、35・・・台座、36・・・車輪、37・・・機
体、38゛・・・ワーク受ffアーム、39・・・ワー
ク、40・・・ローディングステーション、41・・・
収容部、42・・・棚、43・・・トランス77機、4
4・・・処理部門。Figure 1 shows the layout of a conventional sea urchin processing vehicle, Drainage 2
0 is a plan view showing an embodiment of the fabrication device of the present invention, FIG. 3 is a front view of the stocker, FIG. 4 is a side sectional view of the stocker, and FIG. 5 is a front view showing the stocker and the conveyor. , Part 6 is a front view showing details of the conveyor and processing equipment,
FIG. 7 is a side view of the conveying machine, FIG. 8 is a flowchart for controlling the process progress, and FIG. 9 is a plan view showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Diffusion chamber, 2... Diffusion chamber, 3... Ion implantation device, 4... Ion implantation chamber, 5... Photo etching device, 6... N optical device, 7...・Photoresist room, 8... Vapor deposition equipment, 9... CVD... Vapor deposition chamber, 1o... Inspection equipment, 11... Inspection room, 12...
・Conveyance path, 13...Stopping point, 14・CVD device, l
5-CV D processing department, 16...diffusion device, 17.
... Diffusion processing department, 18... Photoresist photosensitive equipment, 19... Photosensitive processing department, 20... Photo etching! Direct, 21... Etching processing department, 22... Ion implantation mH12a... Ion implantation processing department, 24.
... Vapor deposition device, 25... Vapor deposition processing department, 26... Inspection device, 27... Inspection processing department, 28... Stocker, 29... Central control device, 30... Central information processing room , 31...4 dust removal machine room, 32...engineering, 33...
・Transportation device, 34...Transportation device standby station 11 characters 2, 35...Pedestal, 36...Wheels, 37...Main body, 38゛...Work receiving ff arm, 39... Work, 40...Loading station, 41...
Storage section, 42... Shelf, 43... 77 transformers, 4
4...Processing department.
Claims (1)
装置をそれぞれ少なくとも一台有し被処理物に対してそ
れぞれ異なった処理を施す複数の処理部門と、各処理装
置間を結ぶ搬送路と、前記搬送路に沿って移動して各処
理装置に移動する被処理物を収容保持する搬送装置と、
各処理装置と搬送装置との間で被処理物を移換する移換
装置と、前記搬送路に面して配設され被処理物を収容す
る収容部を複数有しかつ搬送装置との間で被処理物の授
受を行なうストッカと、前記各処理装置、搬送装置、移
換装置、ストッカを制御する制御装置を備える製造装置
。1. Each has at least one processing device that automatically transports the processed material and performs the prescribed processing, and connects each processing device with multiple processing departments that each perform different processing on the processed material. a conveyance path; a conveyance device that accommodates and holds objects to be processed that move along the conveyance path and are moved to each processing device;
A transfer device that transfers the objects to be processed between each processing device and the transport device, and a plurality of storage sections arranged facing the transfer path and accommodating the objects to be processed, and between the transfer device and the transfer device. A manufacturing apparatus comprising: a stocker for delivering and receiving objects to be processed; and a control apparatus for controlling each of the processing apparatuses, a transport apparatus, a transfer apparatus, and the stocker.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23512385A JPS61123151A (en) | 1985-10-23 | 1985-10-23 | Production apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23512385A JPS61123151A (en) | 1985-10-23 | 1985-10-23 | Production apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9500479A Division JPS5619635A (en) | 1979-07-27 | 1979-07-27 | Manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61123151A true JPS61123151A (en) | 1986-06-11 |
Family
ID=16981391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23512385A Pending JPS61123151A (en) | 1985-10-23 | 1985-10-23 | Production apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61123151A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49107678A (en) * | 1973-02-05 | 1974-10-12 | ||
JPS5336478A (en) * | 1976-09-17 | 1978-04-04 | Hitachi Ltd | Automatic lead-out device for wafer from cartridge |
JPS53137670A (en) * | 1977-04-25 | 1978-12-01 | Rca Corp | Device for simultaneously treating plural substrates |
-
1985
- 1985-10-23 JP JP23512385A patent/JPS61123151A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49107678A (en) * | 1973-02-05 | 1974-10-12 | ||
JPS5336478A (en) * | 1976-09-17 | 1978-04-04 | Hitachi Ltd | Automatic lead-out device for wafer from cartridge |
JPS53137670A (en) * | 1977-04-25 | 1978-12-01 | Rca Corp | Device for simultaneously treating plural substrates |
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