JPS61121489A - 基板製造用Ｃｕ配線シ−ト - Google Patents
基板製造用Ｃｕ配線シ−トInfo
- Publication number
- JPS61121489A JPS61121489A JP24410784A JP24410784A JPS61121489A JP S61121489 A JPS61121489 A JP S61121489A JP 24410784 A JP24410784 A JP 24410784A JP 24410784 A JP24410784 A JP 24410784A JP S61121489 A JPS61121489 A JP S61121489A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- wiring sheet
- active
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 230000000737 periodic effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 58
- 239000000919 ceramic Substances 0.000 description 25
- 239000004065 semiconductor Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24410784A JPS61121489A (ja) | 1984-11-19 | 1984-11-19 | 基板製造用Ｃｕ配線シ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24410784A JPS61121489A (ja) | 1984-11-19 | 1984-11-19 | 基板製造用Ｃｕ配線シ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61121489A true JPS61121489A (ja) | 1986-06-09 |
| JPH0518477B2 JPH0518477B2 (en, 2012) | 1993-03-12 |
Family
ID=17113855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24410784A Granted JPS61121489A (ja) | 1984-11-19 | 1984-11-19 | 基板製造用Ｃｕ配線シ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121489A (en, 2012) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016805A1 (en) * | 1990-04-16 | 1991-10-31 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| WO1997004483A1 (fr) * | 1995-07-21 | 1997-02-06 | Kabushiki Kaisha Toshiba | Plaquette de circuits imprimes de ceramique |
| JP2594475B2 (ja) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
| JPH09181423A (ja) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
| JP2009071297A (ja) * | 2007-08-22 | 2009-04-02 | Mitsubishi Materials Corp | パワーモジュール用基板の製造装置及びパワーモジュール用基板の製造方法 |
-
1984
- 1984-11-19 JP JP24410784A patent/JPS61121489A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016805A1 (en) * | 1990-04-16 | 1991-10-31 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| US5354415A (en) * | 1990-04-16 | 1994-10-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for forming a ceramic circuit board |
| JP2594475B2 (ja) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
| JPH09181423A (ja) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
| WO1997004483A1 (fr) * | 1995-07-21 | 1997-02-06 | Kabushiki Kaisha Toshiba | Plaquette de circuits imprimes de ceramique |
| JP2009071297A (ja) * | 2007-08-22 | 2009-04-02 | Mitsubishi Materials Corp | パワーモジュール用基板の製造装置及びパワーモジュール用基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0518477B2 (en, 2012) | 1993-03-12 |
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