JPS61114879U - - Google Patents

Info

Publication number
JPS61114879U
JPS61114879U JP1984198910U JP19891084U JPS61114879U JP S61114879 U JPS61114879 U JP S61114879U JP 1984198910 U JP1984198910 U JP 1984198910U JP 19891084 U JP19891084 U JP 19891084U JP S61114879 U JPS61114879 U JP S61114879U
Authority
JP
Japan
Prior art keywords
layer
power supply
ground
holes
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984198910U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023631Y2 (US20030157376A1-20030821-M00001.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984198910U priority Critical patent/JPH023631Y2/ja
Priority to US06/811,355 priority patent/US4675789A/en
Priority to DE8585309399T priority patent/DE3586532T2/de
Priority to EP85309399A priority patent/EP0186485B1/en
Priority to AU51562/85A priority patent/AU569186B2/en
Priority to BR8506566A priority patent/BR8506566A/pt
Publication of JPS61114879U publication Critical patent/JPS61114879U/ja
Application granted granted Critical
Publication of JPH023631Y2 publication Critical patent/JPH023631Y2/ja
Priority to KR2019900006890U priority patent/KR910003175Y1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1984198910U 1984-12-28 1984-12-28 Expired JPH023631Y2 (US20030157376A1-20030821-M00001.png)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1984198910U JPH023631Y2 (US20030157376A1-20030821-M00001.png) 1984-12-28 1984-12-28
US06/811,355 US4675789A (en) 1984-12-28 1985-12-20 High density multilayer printed circuit board
DE8585309399T DE3586532T2 (de) 1984-12-28 1985-12-23 Mehrschichtleiterplatte mit hoher dichte.
EP85309399A EP0186485B1 (en) 1984-12-28 1985-12-23 High density multilayer printed circuit board
AU51562/85A AU569186B2 (en) 1984-12-28 1985-12-23 High density multilayer printed circuit board
BR8506566A BR8506566A (pt) 1984-12-28 1985-12-27 Placa de circuito impresso em multi-camadas de alta densidade
KR2019900006890U KR910003175Y1 (ko) 1984-12-28 1990-05-22 고밀도 다층 인쇄 회로기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984198910U JPH023631Y2 (US20030157376A1-20030821-M00001.png) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114879U true JPS61114879U (US20030157376A1-20030821-M00001.png) 1986-07-19
JPH023631Y2 JPH023631Y2 (US20030157376A1-20030821-M00001.png) 1990-01-29

Family

ID=16398979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984198910U Expired JPH023631Y2 (US20030157376A1-20030821-M00001.png) 1984-12-28 1984-12-28

Country Status (6)

Country Link
US (1) US4675789A (US20030157376A1-20030821-M00001.png)
EP (1) EP0186485B1 (US20030157376A1-20030821-M00001.png)
JP (1) JPH023631Y2 (US20030157376A1-20030821-M00001.png)
AU (1) AU569186B2 (US20030157376A1-20030821-M00001.png)
BR (1) BR8506566A (US20030157376A1-20030821-M00001.png)
DE (1) DE3586532T2 (US20030157376A1-20030821-M00001.png)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US5066831A (en) * 1987-10-23 1991-11-19 Honeywell Inc. Universal semiconductor chip package
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US5159536A (en) * 1988-05-13 1992-10-27 Mupac Corporation Panel board
US4928061A (en) * 1989-03-29 1990-05-22 International Business Machines Corporation Multi-layer printed circuit board
ZA905327B (en) * 1989-07-07 1992-03-25 Sandoz Ltd Sustained release formulations of water soluble peptides
JPH05219729A (ja) * 1992-02-07 1993-08-27 Sony Corp 直流電源装置
US5418689A (en) * 1993-02-01 1995-05-23 International Business Machines Corporation Printed circuit board or card for direct chip attachment and fabrication thereof
JPH06268381A (ja) * 1993-03-11 1994-09-22 Hitachi Ltd 多層配線構造体及びその製造方法
US5641988A (en) * 1993-12-22 1997-06-24 Vlsi Technology, Inc. Multi-layered, integrated circuit package having reduced parasitic noise characteristics
US6191475B1 (en) * 1997-11-26 2001-02-20 Intel Corporation Substrate for reducing electromagnetic interference and enclosure
JP3206561B2 (ja) * 1998-10-01 2001-09-10 日本電気株式会社 多層配線基板
US6184477B1 (en) * 1998-12-02 2001-02-06 Kyocera Corporation Multi-layer circuit substrate having orthogonal grid ground and power planes
JP3368870B2 (ja) * 1999-06-25 2003-01-20 日本電気株式会社 パッケージ基板及びこれを備えた半導体装置
JP3562568B2 (ja) * 1999-07-16 2004-09-08 日本電気株式会社 多層配線基板
US6441313B1 (en) * 1999-11-23 2002-08-27 Sun Microsystems, Inc. Printed circuit board employing lossy power distribution network to reduce power plane resonances
US6335494B1 (en) * 2000-06-23 2002-01-01 International Business Machines Corporation Multiple power distribution for delta-I noise reduction
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
US6734369B1 (en) * 2000-08-31 2004-05-11 International Business Machines Corporation Surface laminar circuit board having pad disposed within a through hole
US6326557B1 (en) 2001-03-06 2001-12-04 Mitac International Corp. Multi-layer circuit board
US6417460B1 (en) * 2001-03-06 2002-07-09 Mitac International Corp. Multi-layer circuit board having signal, ground and power layers
US6489570B2 (en) * 2001-03-06 2002-12-03 Mitac International Corp. Multi-layer circuit board
US6384340B1 (en) * 2001-03-06 2002-05-07 Mitac International Corp. Multi-layer circuit board
US6548858B2 (en) 2001-03-06 2003-04-15 Mitac International Corp. Multi-layer circuit board
JP4034046B2 (ja) * 2001-06-07 2008-01-16 日本碍子株式会社 高精度な貫通孔を有する多層板、及び、回路基板
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20050225955A1 (en) * 2004-04-09 2005-10-13 Hewlett-Packard Development Company, L.P. Multi-layer printed circuit boards
JP4916300B2 (ja) * 2006-12-19 2012-04-11 新光電気工業株式会社 多層配線基板
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519959A (en) * 1966-03-24 1970-07-07 Burroughs Corp Integral electrical power distribution network and component mounting plane
US3680005A (en) * 1966-03-24 1972-07-25 Burroughs Corp Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes
FR1552207A (US20030157376A1-20030821-M00001.png) * 1967-11-22 1969-01-03
US3740678A (en) * 1971-03-19 1973-06-19 Ibm Strip transmission line structures
ZA804558B (en) * 1979-08-18 1981-09-30 Int Computers Ltd Multilayer circuit structures
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package

Also Published As

Publication number Publication date
AU5156285A (en) 1986-07-03
US4675789A (en) 1987-06-23
EP0186485A3 (en) 1988-01-07
AU569186B2 (en) 1988-01-21
BR8506566A (pt) 1986-09-09
EP0186485B1 (en) 1992-08-19
EP0186485A2 (en) 1986-07-02
DE3586532T2 (de) 1993-01-14
JPH023631Y2 (US20030157376A1-20030821-M00001.png) 1990-01-29
DE3586532D1 (de) 1992-09-24

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