JPS61114864U - - Google Patents

Info

Publication number
JPS61114864U
JPS61114864U JP19824684U JP19824684U JPS61114864U JP S61114864 U JPS61114864 U JP S61114864U JP 19824684 U JP19824684 U JP 19824684U JP 19824684 U JP19824684 U JP 19824684U JP S61114864 U JPS61114864 U JP S61114864U
Authority
JP
Japan
Prior art keywords
emitting element
receiving
light emitting
photocoupler
transmitting light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19824684U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19824684U priority Critical patent/JPS61114864U/ja
Publication of JPS61114864U publication Critical patent/JPS61114864U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるフオトカプ
ラの回路図、第2図は同じくフオトカプラの平面
図、第3図はフオトカプラの他の実施例を示す平
面図、第4図は他の実施例によるフオトカプラの
回路図である。 1は送信用発光素子、2は受信用受光素子、3
…は動作表示用発光素子、4はパツケージ。
Fig. 1 is a circuit diagram of a photocoupler according to one embodiment of this invention, Fig. 2 is a plan view of the same photocoupler, Fig. 3 is a plan view showing another embodiment of the photocoupler, and Fig. 4 is a diagram according to another embodiment. FIG. 3 is a circuit diagram of a photocoupler. 1 is a light emitting element for transmission, 2 is a light receiving element for reception, 3
... is a light emitting element for operation display, and 4 is a package.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 送信用発光素子と受信用受光素子とをモールド
によりパツケージ化したフオトカプラにおいて、
上記送信用発光素子の電気回路に接続される動作
表示用発光素子が、上記パツケージの表面に臨む
ように、上記送信用発光素子および受信用受光素
子とともにモールドされたことを特徴とするフオ
トカプラ。
In a photocoupler in which a transmitting light-emitting element and a receiving light-receiving element are packaged by molding,
A photocoupler characterized in that an operation display light emitting element connected to the electric circuit of the transmitting light emitting element is molded together with the transmitting light emitting element and the receiving light receiving element so as to face the surface of the package.
JP19824684U 1984-12-28 1984-12-28 Pending JPS61114864U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19824684U JPS61114864U (en) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19824684U JPS61114864U (en) 1984-12-28 1984-12-28

Publications (1)

Publication Number Publication Date
JPS61114864U true JPS61114864U (en) 1986-07-19

Family

ID=30757076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19824684U Pending JPS61114864U (en) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPS61114864U (en)

Similar Documents

Publication Publication Date Title
JPS61114864U (en)
JPS61114865U (en)
JPS6212966U (en)
JPS6176978U (en)
JPS6294656U (en)
JPS60109344U (en) chipped semiconductor device
JPS6188257U (en)
JPS6343459U (en)
JPS6212967U (en)
JPS61121764U (en)
JPS61114863U (en)
JPS6291275U (en)
JPH0212130U (en)
JPS6151764U (en)
JPS6437063U (en)
JPH02127045U (en)
JPS63114043U (en)
JPS63102261U (en)
JPS61204238U (en)
JPS6316466U (en)
JPS62168527U (en)
JPS6179549U (en)
JPS6452255U (en)
JPS62172161U (en)
JPH0242455U (en)