JPS6212967U - - Google Patents

Info

Publication number
JPS6212967U
JPS6212967U JP12902785U JP12902785U JPS6212967U JP S6212967 U JPS6212967 U JP S6212967U JP 12902785 U JP12902785 U JP 12902785U JP 12902785 U JP12902785 U JP 12902785U JP S6212967 U JPS6212967 U JP S6212967U
Authority
JP
Japan
Prior art keywords
light
emitting diode
receiving element
display device
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12902785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12902785U priority Critical patent/JPS6212967U/ja
Publication of JPS6212967U publication Critical patent/JPS6212967U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す等価回路図、
第２図は第１図に示す発光ダイオード表示装置の
内部断面図、第３図は従来例を示すブロツク線図
である。 １０……発光ダイオード表示装置、１１……発
光ダイオード素子、１２……受光素子、１５……
透光性樹脂。 FIG. 1 is an equivalent circuit diagram showing an embodiment of the present invention.
FIG. 2 is an internal sectional view of the light emitting diode display device shown in FIG. 1, and FIG. 3 is a block diagram showing a conventional example. 10... Light emitting diode display device, 11... Light emitting diode element, 12... Light receiving element, 15...
Translucent resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光ダイオード素子と受光素子とを同一透光性
樹脂内に封止し、前記発光ダイオード素子と前記
受光素子とを並列に接続したことを特徴とする発
光ダイオード表示装置。 1. A light-emitting diode display device, characterized in that a light-emitting diode element and a light-receiving element are sealed in the same light-transmitting resin, and the light-emitting diode element and the light-receiving element are connected in parallel.
JP12902785U 1985-08-24 1985-08-24 Pending JPS6212967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12902785U JPS6212967U (en) 1985-08-24 1985-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12902785U JPS6212967U (en) 1985-08-24 1985-08-24

Publications (1)

Publication Number Publication Date
JPS6212967U true JPS6212967U (en) 1987-01-26

Family

ID=31025232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12902785U Pending JPS6212967U (en) 1985-08-24 1985-08-24

Country Status (1)

Country Link
JP (1) JPS6212967U (en)

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