JPS61113642A - 半導体封止用エポキシ樹脂組成物 - Google Patents
半導体封止用エポキシ樹脂組成物Info
- Publication number
- JPS61113642A JPS61113642A JP23501184A JP23501184A JPS61113642A JP S61113642 A JPS61113642 A JP S61113642A JP 23501184 A JP23501184 A JP 23501184A JP 23501184 A JP23501184 A JP 23501184A JP S61113642 A JPS61113642 A JP S61113642A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- epoxy resin
- parts
- filler
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 17
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000007789 sealing Methods 0.000 title claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 33
- 239000000945 filler Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 abstract description 8
- 230000035939 shock Effects 0.000 abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 7
- 239000012756 surface treatment agent Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23501184A JPS61113642A (ja) | 1984-11-09 | 1984-11-09 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23501184A JPS61113642A (ja) | 1984-11-09 | 1984-11-09 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61113642A true JPS61113642A (ja) | 1986-05-31 |
| JPH032390B2 JPH032390B2 (enrdf_load_html_response) | 1991-01-14 |
Family
ID=16979741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23501184A Granted JPS61113642A (ja) | 1984-11-09 | 1984-11-09 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61113642A (enrdf_load_html_response) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (ja) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | 電子部品封止用液状エポキシ樹脂組成物 |
| JPS63108021A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS63128020A (ja) * | 1986-11-18 | 1988-05-31 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS6411355A (en) * | 1987-07-06 | 1989-01-13 | Hitachi Ltd | Resin sealed semiconductor device |
| JPH02209949A (ja) * | 1989-02-09 | 1990-08-21 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び硬化物 |
| GB2345803A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Electronic component with a hydrophobic surface treated resin additive |
| US6198373B1 (en) | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
| JP2008062010A (ja) * | 2006-08-11 | 2008-03-21 | Kokuyo Co Ltd | デスク、及びオフィス構成システム |
| JP2008119333A (ja) * | 2006-11-15 | 2008-05-29 | Kokuyo Co Ltd | 天板付き家具 |
| JP2008142517A (ja) * | 2006-11-15 | 2008-06-26 | Kokuyo Co Ltd | 支持体、及び天板付き家具 |
-
1984
- 1984-11-09 JP JP23501184A patent/JPS61113642A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (ja) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | 電子部品封止用液状エポキシ樹脂組成物 |
| JPS63108021A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS63128020A (ja) * | 1986-11-18 | 1988-05-31 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPH0680863A (ja) * | 1986-11-18 | 1994-03-22 | Hitachi Ltd | エポキシ樹脂組成物 |
| JPS6411355A (en) * | 1987-07-06 | 1989-01-13 | Hitachi Ltd | Resin sealed semiconductor device |
| JPH02209949A (ja) * | 1989-02-09 | 1990-08-21 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び硬化物 |
| GB2345803A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Electronic component with a hydrophobic surface treated resin additive |
| US6198373B1 (en) | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
| GB2329762B (en) * | 1997-08-19 | 2001-06-06 | Taiyo Yuden Kk | Wire wound electronic component |
| GB2345803B (en) * | 1997-08-19 | 2001-06-20 | Taiyo Yuden Kk | Wire wound electronic component |
| JP2008062010A (ja) * | 2006-08-11 | 2008-03-21 | Kokuyo Co Ltd | デスク、及びオフィス構成システム |
| JP2008119333A (ja) * | 2006-11-15 | 2008-05-29 | Kokuyo Co Ltd | 天板付き家具 |
| JP2008142517A (ja) * | 2006-11-15 | 2008-06-26 | Kokuyo Co Ltd | 支持体、及び天板付き家具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032390B2 (enrdf_load_html_response) | 1991-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61113642A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS63245426A (ja) | 樹脂封止半導体装置 | |
| CN102617981B (zh) | 环氧树脂组合物及半导体器件 | |
| TWI666246B (zh) | 樹脂組成物用塡料、含有塡料之漿體組成物、及含有塡料之樹脂組成物 | |
| JP3468996B2 (ja) | エポキシ樹脂組成物及び樹脂封止型半導体装置 | |
| JPS6274924A (ja) | 半導体装置封止用エポキシ樹脂組成物 | |
| US6288169B1 (en) | Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant | |
| CN101068846B (zh) | 环氧树脂组合物及半导体器件 | |
| JP2773955B2 (ja) | 半導体装置 | |
| KR101526001B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치 | |
| JPS62149743A (ja) | 半導体封止用エポキシ樹脂成形材料 | |
| JP5141857B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2005171199A (ja) | 微塩基性アルミナ粉体、その製造方法及び樹脂組成物 | |
| JPS5837939A (ja) | 半導体装置 | |
| KR101266542B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 패키지 | |
| JP2633856B2 (ja) | 樹脂封止型半導体装置 | |
| JP2947072B2 (ja) | 表面処理アルミナの製造方法 | |
| KR101570558B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
| JPH0142631B2 (enrdf_load_html_response) | ||
| JPS627143A (ja) | 半導体封止用エポキシ樹脂成形材料 | |
| JP2001139771A (ja) | エポキシ樹脂成形材料及び半導体装置 | |
| JPS61190550A (ja) | 半導体封止用エポキシ樹脂成形材料 | |
| JP2006257309A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JPH0583113B2 (enrdf_load_html_response) | ||
| JP2635621B2 (ja) | 半導体装置封止用樹脂組成物 |