JPS61104582U - - Google Patents
Info
- Publication number
- JPS61104582U JPS61104582U JP19003384U JP19003384U JPS61104582U JP S61104582 U JPS61104582 U JP S61104582U JP 19003384 U JP19003384 U JP 19003384U JP 19003384 U JP19003384 U JP 19003384U JP S61104582 U JPS61104582 U JP S61104582U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- substrate
- board
- electrical component
- small electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19003384U JPS61104582U (hu) | 1984-12-17 | 1984-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19003384U JPS61104582U (hu) | 1984-12-17 | 1984-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61104582U true JPS61104582U (hu) | 1986-07-03 |
Family
ID=30747478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19003384U Pending JPS61104582U (hu) | 1984-12-17 | 1984-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61104582U (hu) |
-
1984
- 1984-12-17 JP JP19003384U patent/JPS61104582U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61104582U (hu) | ||
| JPS61104583U (hu) | ||
| JPS61153372U (hu) | ||
| JP2725719B2 (ja) | 電子部品及びその製造方法 | |
| JP2571902Y2 (ja) | 電子部品の実装構造 | |
| JPS635248Y2 (hu) | ||
| JPH0519974Y2 (hu) | ||
| JPH019160Y2 (hu) | ||
| JPS6120737Y2 (hu) | ||
| JPH041744Y2 (hu) | ||
| JP3067214U (ja) | 複合半導体装置 | |
| JPS6149453U (hu) | ||
| JPS61199052U (hu) | ||
| JPH046212Y2 (hu) | ||
| JPH0119395Y2 (hu) | ||
| JPS61106071U (hu) | ||
| JPS61106072U (hu) | ||
| JPS6157555U (hu) | ||
| JPS6186968U (hu) | ||
| JPS58173860A (ja) | 電気部品組立体 | |
| JPS6186969U (hu) | ||
| JPH0732211B2 (ja) | 半導体パッケージ | |
| JPH01208874A (ja) | Ｌｅｄヘッド | |
| JPH0631154U (ja) | 複合半導体装置 | |
| JPS60181031U (ja) | チツプキヤリアの基板構造 |