JPS61106071U - - Google Patents
Info
- Publication number
- JPS61106071U JPS61106071U JP19137584U JP19137584U JPS61106071U JP S61106071 U JPS61106071 U JP S61106071U JP 19137584 U JP19137584 U JP 19137584U JP 19137584 U JP19137584 U JP 19137584U JP S61106071 U JPS61106071 U JP S61106071U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- conductor
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19137584U JPS61106071U (hu) | 1984-12-19 | 1984-12-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19137584U JPS61106071U (hu) | 1984-12-19 | 1984-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61106071U true JPS61106071U (hu) | 1986-07-05 |
Family
ID=30748814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19137584U Pending JPS61106071U (hu) | 1984-12-19 | 1984-12-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61106071U (hu) |
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1984
- 1984-12-19 JP JP19137584U patent/JPS61106071U/ja active Pending