JPS61102954U - - Google Patents
Info
- Publication number
- JPS61102954U JPS61102954U JP18856884U JP18856884U JPS61102954U JP S61102954 U JPS61102954 U JP S61102954U JP 18856884 U JP18856884 U JP 18856884U JP 18856884 U JP18856884 U JP 18856884U JP S61102954 U JPS61102954 U JP S61102954U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- outer peripheral
- humidity sensor
- electrodes
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Description
第１図および第２図は本考案の一実施例に係る
湿度センサの取付装置を示すもので第１図は平面
図、第２図は第１図Ａ―Ａ断面図、第３図は第１
図および第２図に示す湿度センサを示す斜視図、
第４図は第１図および第２図を構成する基板を示
す斜視図、第５図は従来の参考例に係る湿度セン
サの取付装置を示す断面図、第６図は従来の他の
参考例に係る湿度センサの取付装置を示す断面図
である。
１……感湿素子、２，３……外周縁部、４，５
……電極、６……湿度センサ、７……貫通孔、８
……基板、９……両面粘着テープ。
1 and 2 show a humidity sensor mounting device according to an embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a sectional view taken along line A-A in FIG. 1
A perspective view showing the humidity sensor shown in FIGS.
FIG. 4 is a perspective view showing a board constituting FIGS. 1 and 2, FIG. 5 is a sectional view showing a humidity sensor mounting device according to a conventional reference example, and FIG. 6 is another conventional reference example. FIG. 2 is a cross-sectional view showing a humidity sensor mounting device according to the present invention. 1... Moisture sensing element, 2, 3... Outer periphery, 4, 5
... Electrode, 6 ... Humidity sensor, 7 ... Through hole, 8
...Substrate, 9...Double-sided adhesive tape.
Claims (1)
の感湿素子と、該素子の両面に外周縁部を残して
形成した電極を有する湿度センサと、該センサを
取着する貫通孔を設けた基板とを具備し、前記電
極の一方を前記貫通孔内に位置し、該貫通孔内に
位置した電極周辺を構成する外周縁部と前記貫通
孔の外周面間を両面粘着テープを介して接続した
ことを特徴とする湿度センサの取付装置。 A humidity sensor having a plate-shaped humidity sensing element formed by molding and sintering porous ceramic powder, electrodes formed on both sides of the element with outer peripheral edges left, and a through hole for attaching the sensor. a substrate, one of the electrodes is located in the through hole, and an outer peripheral edge forming a periphery of the electrode located in the through hole and an outer peripheral surface of the through hole are connected via a double-sided adhesive tape. A humidity sensor mounting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18856884U JPS61102954U (en) | 1984-12-11 | 1984-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18856884U JPS61102954U (en) | 1984-12-11 | 1984-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61102954U true JPS61102954U (en) | 1986-07-01 |
Family
ID=30746030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18856884U Pending JPS61102954U (en) | 1984-12-11 | 1984-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102954U (en) |
-
1984
- 1984-12-11 JP JP18856884U patent/JPS61102954U/ja active Pending
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