JPS5880558U

JPS5880558U - Humidity sensor with support board

Info

Publication number: JPS5880558U
Application number: JP17732981U
Authority: JP
Inventors: 伸一勝田
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1981-11-27
Filing date: 1981-11-27
Publication date: 1983-05-31

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は本考案の前提となる支持基板付湿度センサの断
面図、第２図は第１図の■−■線より見た一部破断正面
図、第３図は第１図の部品で感湿素子の断面図、第４図
及び第５図は第３図のＩＶ−■線及び■−■線より見た
正面図、第６図は本考案の支持基板付湿度センサの断面
図、第７図は第６図の■−■線より見た一部破断正面図
、第８図は第６図の組立途上の斜視図である。１・・・・・・支持基板（セラミック基板）、３．４・
・・・・・導電層、５・・・・・・感湿素子、７，８・
・・・・・電極層、１０・・・・・・導電性接着剤、１
１・・・・・・耐熱性無機接着剤。Figure 1 is a cross-sectional view of a humidity sensor with a supporting substrate, which is the premise of the present invention, Figure 2 is a partially cutaway front view taken from line ■-■ in Figure 1, and Figure 3 shows the parts shown in Figure 1. 4 and 5 are front views seen from the IV-■ line and ■-■ line in FIG. 3; FIG. 6 is a sectional view of the humidity sensor with a support substrate of the present invention; FIG. 7 is a partially cutaway front view taken along the line ■--■ in FIG. 6, and FIG. 8 is a perspective view of FIG. 6 in the middle of assembly. 1... Support substrate (ceramic substrate), 3.4.
... Conductive layer, 5 ... Moisture sensitive element, 7, 8.
... Electrode layer, 10 ... Conductive adhesive, 1
1...Heat-resistant inorganic adhesive.

Claims

[Scope of utility model registration request]

A humidity sensing element is placed on a conductive layer provided on a support substrate, an electrode layer of this humidity sensing element is fixed to the conductive layer with a conductive adhesive, and the humidity sensing element and the support substrate are bonded together with a heat-resistant inorganic adhesive. A humidity sensor with a support substrate, characterized in that it is fixed with a support substrate.