JPS61114354U - - Google Patents
Info
- Publication number
- JPS61114354U JPS61114354U JP19950184U JP19950184U JPS61114354U JP S61114354 U JPS61114354 U JP S61114354U JP 19950184 U JP19950184 U JP 19950184U JP 19950184 U JP19950184 U JP 19950184U JP S61114354 U JPS61114354 U JP S61114354U
- Authority
- JP
- Japan
- Prior art keywords
- humidity
- detection device
- humidity detection
- wiring board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000013464 silicone adhesive Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Description
第1図および第2図は本考案の一実施例を示し
、第1図は第2図中―線の断面図、第2図は
平面図、第3図は従来の構成を示す斜視図である
。
20……配線基板、21,22,23……配線
、24……開口部、30……セラミツクス湿度検
出素子、31,31……電極、32……接着剤、
33,34……リード線。
1 and 2 show an embodiment of the present invention, FIG. 1 is a sectional view taken along the line in FIG. 2, FIG. 2 is a plan view, and FIG. 3 is a perspective view showing a conventional configuration. be. 20... Wiring board, 21, 22, 23... Wiring, 24... Opening, 30... Ceramic humidity detection element, 31, 31... Electrode, 32... Adhesive,
33, 34... Lead wire.
Claims (1)
ツクス系湿度検出素子の上記他側面を配線基板の
一側面に対向させ、この湿度検出素子を接着剤に
より周方向の複数位置でかつ上記基板に対して離
間させて接合したことを特徴とする湿度検出装置
。 (2) 上記配線基板の一側面と湿度検出素子の他
側面との離間寸法を1mm以上としたことを特徴と
する実用新案登録請求の範囲第1項記載の湿度検
出装置。 (3) 上記配線基板には、湿度検出素子の他側面
に対向して開口部を形成したことを特徴とする実
用新案登録請求の範囲第1項または第2項記載の
湿度検出装置。 (4) 上記接着剤は、シリコーン系接着剤である
ことを特徴とする実用新案登録請求の範囲第1項
または第2項もしくは第3項記載の湿度検出装置
。[Claims for Utility Model Registration] (1) The other side of a ceramic humidity sensing element provided with electrodes on one side and the other side faces one side of a wiring board, and the humidity sensing element is attached with an adhesive in the circumferential direction. A humidity detection device characterized in that the humidity detection device is bonded to the substrate at a plurality of positions and spaced apart from the substrate. (2) The humidity detection device according to claim 1, wherein the distance between one side of the wiring board and the other side of the humidity detection element is 1 mm or more. (3) The humidity detecting device according to claim 1 or 2, wherein the wiring board has an opening facing the other side of the humidity detecting element. (4) The humidity detection device according to claim 1, 2, or 3, wherein the adhesive is a silicone adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19950184U JPS61114354U (en) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19950184U JPS61114354U (en) | 1984-12-28 | 1984-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61114354U true JPS61114354U (en) | 1986-07-19 |
Family
ID=30759485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19950184U Pending JPS61114354U (en) | 1984-12-28 | 1984-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61114354U (en) |
-
1984
- 1984-12-28 JP JP19950184U patent/JPS61114354U/ja active Pending
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