JPS6110262A - Device for manufacturing semiconductor lead frame - Google Patents
Device for manufacturing semiconductor lead frameInfo
- Publication number
- JPS6110262A JPS6110262A JP13011984A JP13011984A JPS6110262A JP S6110262 A JPS6110262 A JP S6110262A JP 13011984 A JP13011984 A JP 13011984A JP 13011984 A JP13011984 A JP 13011984A JP S6110262 A JPS6110262 A JP S6110262A
- Authority
- JP
- Japan
- Prior art keywords
- coining
- lead frame
- roller
- pressing
- semiconductor lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Straightening Metal Sheet-Like Bodies (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、半導体リードフレーム製造装置に係り、特に
安定したコイニング加工を行うこの種装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor lead frame manufacturing apparatus, and particularly to this type of apparatus that performs stable coining processing.
［発明の技術的背景］
一般に半導体リードフレームの製造工程においては、そ
のリードフレームの耐湿性、エンキャップの流れ止め、
或いはモールディング時の樹脂ふくらみ防止等のため材
料に溝を形成するコイニング加工が巾広く採用されてい
る。[Technical Background of the Invention] In general, in the manufacturing process of semiconductor lead frames, the moisture resistance of the lead frame, the flow prevention of the encap,
Alternatively, coining processing, in which grooves are formed in the material, is widely used to prevent resin from swelling during molding.
コイニングの形状、深さ、大きさ１本数はその目的、品
種等により異なるが、コイニング加工は従来から、順送
り金型或いはコイニング専用型のプレス金型によって行
われている。即ち、第４図に示すように、コイニング加
工部に搬送された材料（一般に銅又は銅合金）１を、上
方からプレス金型２を下方へ移動させて加工するもので
あり、第５図（ａ）に示すような半導体リードフレーム
３に溝４が形成される。そして、溝４が形成された半導
体リードフレーム３が各個に分離され、第５図（ｂ）に
示ずように、半導体素子５が載置され、さらに樹脂７に
よってモールドされて半導体装置が製造される。Although the shape, depth, size, and number of coining coins vary depending on the purpose, type, etc., coining processing has conventionally been performed using a progressive die or a press die dedicated to coining. That is, as shown in FIG. 4, the material (generally copper or copper alloy) 1 transported to the coining processing section is processed by moving the press die 2 from above downward. A groove 4 is formed in a semiconductor lead frame 3 as shown in a). Then, the semiconductor lead frame 3 in which the groove 4 is formed is separated into individual parts, and as shown in FIG. 5(b), a semiconductor element 5 is placed thereon, and the semiconductor device is manufactured by molding with resin 7. Ru.
［背景技術の問題点］
しかしながら、このようなプレス金型でコイニングを行
うことは、切削、研削、放電、エツチング等の不必要部
を取除く加工とは異なって、コイニングによりつぶされ
た肉が周辺に押しやられることにより材料が伸延して金
型内で詰まり、このことにより送りトラブルが発生し、
また打ち抜かれた素子（材料）の曲がりや１反りによる
寸法変化や厚み方向の面平坦度が悪化するという難点が
ある（第１図材料１）。また、プレス機械の下死点の変
化によりコイン深さが安定しないという難点がある。[Problems with the background technology] However, coining with such a press die is different from processing that removes unnecessary parts such as cutting, grinding, electric discharge, and etching; As the material is pushed to the periphery, it becomes stretched and gets stuck in the mold, which causes feeding problems.
Further, there are drawbacks such as dimensional changes due to bending or warpage of the punched element (material) and deterioration of surface flatness in the thickness direction (Material 1 in Figure 1). Another problem is that the coin depth is not stable due to changes in the bottom dead center of the press machine.
［発明の目的コ 本発明は上記従来の難点に鑑みなされたもので。[Purpose of the invention] The present invention was made in view of the above-mentioned conventional difficulties.
コイニング形状をローラーに突設させて連続にコイニン
グ加工することにより、品質の安定したリードフレーム
の供給を可能とし、プレス機械の稼動率、生産性、経済
性を向上させる半導体リードフレーム製造装置を提供せ
んとするものである。By making the coining shape protrude from a roller and performing continuous coining processing, it is possible to supply lead frames with stable quality, and provide semiconductor lead frame manufacturing equipment that improves the operating rate, productivity, and economic efficiency of press machines. This is what I am trying to do.
［発明の概要］
以上のような目的を達成するため本発明によれば、金属
材料の送り手段と金属材料を所定形状にプレス加工する
プレス部との間に、所定のコイニング形状を有するロー
ラー部を配置する半導体リードフレーム製造装置を構成
する。[Summary of the Invention] In order to achieve the above objects, according to the present invention, a roller portion having a predetermined coining shape is provided between the metal material feeding means and the press portion that presses the metal material into a predetermined shape. A semiconductor lead frame manufacturing apparatus is constructed in which the semiconductor lead frame is placed.
［発明の実施例］ 以下、本発明の好ましい実施例を図面により説明する。[Embodiments of the invention] Preferred embodiments of the present invention will be described below with reference to the drawings.
本発明の半導体リードフレーム製造装置は、第１図に示
すように、金属材料（一般に銅或いは銅合金）１０が巻
回されるアンコイラ−１１から材料レベラー１２が介在
されてプレス装置１１１３が設置され、プレス装置１３
にはレベラー１４が連設されている。プレス装置１３は
、その入口には金属材料１０を搬送する送り手段である
搬送ローラー１５が設けられ、搬送ローラー１５の近傍
であってそれと金属材料１２をプレスする金型１６を有
するプレス部との間に、コイニングローラー１７および
下側ローラー１８を有するローラー部が設けられている
。ローラー部は、一つのコイニングローラー或いは第２
図に示すように二連のコイニングローラー１７に、コイ
ニングを行うべき幅、深さ、形状の凸部１７′が所定位
置に突設されてコイニング形状を有し、コイニングロー
ラー１７は搬送ローラー１５からの回転をギア１９を介
して伝達され回転を行う。As shown in FIG. 1, the semiconductor lead frame manufacturing apparatus of the present invention includes an uncoiler 11 around which a metal material (generally copper or copper alloy) 10 is wound, and a press device 1113 with a material leveler 12 interposed therebetween. , press device 13
A leveler 14 is connected in series. The press device 13 is provided with a conveyance roller 15, which is a feeding means for conveying the metal material 10, at its entrance. In between there is provided a roller section having a coining roller 17 and a lower roller 18. The roller part can be one coining roller or a second coining roller.
As shown in the figure, the two coining rollers 17 are provided with convex portions 17' having the width, depth, and shape required for coining at predetermined positions, and have a coining shape. The rotation is transmitted through the gear 19 and rotates.
このような構成による半導体リードフレーム製造装置は
、金属材料１０がアンコイラ−１１から材料レベラー１
２で平坦度等を矯正してプレス装置１３に送り込まれる
。プレス装置１３に送り込まれた金属材料１０は搬送ロ
ーラー１５によって所定の長さづつ金型１６内に搬送さ
れるが、金型１６の前段階でローラー部において搬送ロ
ーラー１５からギア１９を介して伝達された回転により
、下側ローラー１８との間で金属材料ＩＯを連続的にコ
イニング加工を行い、さらにコイニング加工で発生する
反りや平坦度等を矯正している。また、コイニングロー
ラー１７を二連にして分割しておくことは、コイニング
位置を自在に変更することができるだけでなく、これを
送り方向に並列に配置すると、第３図に示すように、先
ず最初の工程で溝２０のコイニングを行い（第３図（ａ
））、次に溝２１をコイニングすることにより（第３図
（ｂ））、第３図（ｃ）に示す如く最初のコインを倒し
てしまういわゆる喰いイ１きコイン等の加工が容易にで
きるようになる。そして、金型１６でプレス加工を行っ
て形成された半導体リードフレーム３をレベラー１７で
プ１ノス加工で発生する反り等が矯正されてのち第５図
に示される半導体リードフレーム、半導体装置が完成す
る。In the semiconductor lead frame manufacturing apparatus having such a configuration, the metal material 10 is transferred from the uncoiler 11 to the material leveler 1.
In Step 2, the flatness and the like are corrected, and the sheet is fed into the press device 13. The metal material 10 fed into the press device 13 is conveyed into the mold 16 by conveyance rollers 15 for a predetermined length, but before the metal mold 16, the metal material 10 is conveyed from the conveyance roller 15 via a gear 19 in the roller section. Due to this rotation, the metal material IO is continuously coined between it and the lower roller 18, and warpage, flatness, etc. that occur during the coining process are further corrected. Furthermore, dividing the coining rollers 17 into two makes it possible not only to change the coining position freely, but also to arrange them in parallel in the feeding direction, as shown in FIG. Coining of the groove 20 is performed in the step of (Fig. 3 (a)
)), and then by coining the groove 21 (Fig. 3(b)), it is possible to easily process a so-called "eating coin" in which the first coin is knocked over as shown in Fig. 3(c). It becomes like this. Then, the semiconductor lead frame 3 formed by press working with the mold 16 is corrected by a leveler 17 to correct any warping that may occur during press processing, and the semiconductor lead frame and semiconductor device shown in FIG. 5 are completed. do.
このようにすることによって、コイニング加工した場合
の金属材料の変形による詰りゃ送りトラブル、寸法変化
、そして面平坦度悪化等の問題が一掃することができ、
連続・安定したコイニング加工及び品質の安定した半導
体リードフレームの供給が可能となる。By doing this, problems such as clogging, feeding trouble, dimensional changes, and deterioration of surface flatness due to deformation of the metal material during coining processing can be eliminated.
It becomes possible to perform continuous and stable coining processing and supply semiconductor lead frames with stable quality.
なお、上記実施例ではローラー部においてコイニング用
凸部を上側のローラーに設けた場合を示したが、これを
下側に即ち上下を入れ替えて金属材料の裏面にコイニン
グ加工することもでき、また両面においてコイニング等
の加工をするときも上下共にコイニングローラーとする
ことにより容易に可能である。In addition, in the above embodiment, the coining convex part is provided on the upper roller of the roller part, but it is also possible to place the convex part on the lower side, that is, to switch the top and bottom, and to perform coining on the back side of the metal material. Coining and other processing can be easily done by using coining rollers on both the upper and lower sides.
［発明の効果コ
以上のような実施例からも明らかなように本発明によれ
ば、プレス加工の前段階にコイニング形状をローラーに
突設させて連続的に金属材料をコイニング加工すること
により、プレス金型には常にコイニング加工済の定寸の
材料を供給することができ、連続・安定したコイニング
加工による品質の安定した半導体リードフレームを供給
することが可能となり、プレス機械の稼動率、生産性を
向上させると共に、金型で行っていたコイニング用のス
ペースが不要となり、その分コンパクトとなって安価に
することができる。[Effects of the Invention] As is clear from the above-described embodiments, according to the present invention, a coining shape is protruded from a roller in the pre-pressing stage to continuously coin a metal material. It is possible to always supply a fixed size of coined material to the press mold, and it is possible to supply semiconductor lead frames with stable quality through continuous and stable coining, which improves the operating rate of the press machine and production. In addition to improving performance, there is no need for space for coining, which was done with a mold, making it more compact and cheaper.
第１図は本発明における半導体リードフレーム製造装置
のリードフレームの製造工程を示した概略図、第２図は
本発明におけるローラー部を送り方向から見た場合の正
面図、第３図（ａ）・（ｂ）・（ｃ）は本発明によって
の加工例を示した断面図、第４図は従来のコイニング加
工の装置を示した概略図、第５図（ａ）・（ｂ）は完成
された半導体リードフレーム及び半導体装置を示した概
略図である。
ｌＯ・・・・・・・金属材料
１５・・・・・・・・搬送ローラ（送り手段）１６・・
・・・・・金型（プレス部）
１７ ・・・・・・・ コイニングローラー （ローラ
ー部）１７′ ・・・・・・ 凸部
１８ ・・ ・・・・下側ローラー（ローラー部）（７
３１７）代理人弁理士則 近 憲 佑（ばか１名）第２
図
４４ 区
ＪＬ ５ 日
（ｃＬ）
（Ｊ）FIG. 1 is a schematic diagram showing the lead frame manufacturing process of the semiconductor lead frame manufacturing apparatus according to the present invention, FIG. 2 is a front view of the roller section according to the present invention when viewed from the feeding direction, and FIG. 3 (a)・(b) and (c) are cross-sectional views showing processing examples according to the present invention, FIG. 4 is a schematic diagram showing a conventional coining processing device, and FIGS. 5(a) and (b) are completed FIG. 2 is a schematic diagram showing a semiconductor lead frame and a semiconductor device. lO...Metal material 15...Conveyance roller (feeding means) 16...
...Mold (pressing part) 17 ...... Coining roller (roller part) 17' ...... Convex part 18 ... ...Lower roller (roller part) ( 7
317) Agent Patent Attorney Rules Kensuke Chika (1 idiot) Part 2
Figure 44 Ward JL 5 days (cL) (J)
Claims (1)
加工により半導体リードフレームを形成するにあたり、
前記金属材料を搬送するための送り手段と、該送り手段
より搬送された金属材料を所定形状にプレス加工するプ
レス部と、前記送り手段とプレス部との間に配置され、
所定のコイニング形状を有するローラー部とを備えてい
ることを特徴とする半導体リードフレーム製造装置。When transporting metal materials to a predetermined location and forming a semiconductor lead frame by coining and pressing,
A feeding means for conveying the metal material, a press section that presses the metal material conveyed by the feeding means into a predetermined shape, and arranged between the feeding means and the press section,
1. A semiconductor lead frame manufacturing device, comprising: a roller portion having a predetermined coining shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13011984A JPS6110262A (en) | 1984-06-26 | 1984-06-26 | Device for manufacturing semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13011984A JPS6110262A (en) | 1984-06-26 | 1984-06-26 | Device for manufacturing semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6110262A true JPS6110262A (en) | 1986-01-17 |
Family
ID=15026400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13011984A Pending JPS6110262A (en) | 1984-06-26 | 1984-06-26 | Device for manufacturing semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6110262A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354851A (en) * | 1989-07-24 | 1991-03-08 | Goto Seisakusho:Kk | Manufacture of lead frame for semiconductor device |
| JP2011203897A (en) * | 2010-03-25 | 2011-10-13 | Secom Co Ltd | Heat image monitoring apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5565450A (en) * | 1978-11-10 | 1980-05-16 | Hitachi Ltd | Resin-mold type semiconductor device |
| JPS57209153A (en) * | 1981-06-16 | 1982-12-22 | Nippon Radiator Co Ltd | Conveyer of belt-shaped material |
-
1984
- 1984-06-26 JP JP13011984A patent/JPS6110262A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5565450A (en) * | 1978-11-10 | 1980-05-16 | Hitachi Ltd | Resin-mold type semiconductor device |
| JPS57209153A (en) * | 1981-06-16 | 1982-12-22 | Nippon Radiator Co Ltd | Conveyer of belt-shaped material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354851A (en) * | 1989-07-24 | 1991-03-08 | Goto Seisakusho:Kk | Manufacture of lead frame for semiconductor device |
| JP2011203897A (en) * | 2010-03-25 | 2011-10-13 | Secom Co Ltd | Heat image monitoring apparatus |
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