JP3030599B2 - Electronic parts shape processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for shaping electronic parts such as semiconductor device lead frames and connector leads. The present invention relates to a shape processing apparatus for an electronic component, which is configured by arranging a required number of independent horizontal shape processing stations that are driven to open and close in order to cope with the production of a small number of products.

[0002]

2. Description of the Related Art In recent years, semiconductor devices and connectors, which are examples of electronic devices, have been miniaturized and thinned. Lead frame (see Fig. 3)
With respect to the same, the miniaturization of both the lead width and the lead interval has been required. Further, various types of lead frames have been designed to meet the diversifying specifications of semiconductor devices. The era of so-called low-volume, multi-product varieties has come.

Such a lead frame for a semiconductor device is manufactured by using a vertical shape processing device (press device) or an etching device using a progressive die device (see FIG. 5) from a thin metal sheet such as nickel or copper. It is formed in a required shape by using. In particular, a progressive die apparatus (see FIG. 5) with excellent production efficiency is used for the shape processing of electronic parts, and a vertical shape processing apparatus (press apparatus) which drives the open / close operation of the die is generally used. I have.

FIG. 5 shows a conventional progressive die apparatus for forming a lead frame for a semiconductor device (hereinafter referred to as a lead frame). As shown in the figure, the progressive die apparatus 60 has a problem in the structure of the die in that all of the fine lead shapes of the lead frame (see FIG. 3) are formed by one processing. For this reason, the layout is designed and arranged in a progressive die having an integral structure shown in FIG. 5 which is divided and arranged in a plurality of steps of the shape processing stations 61a, 61b,.

In recent years, there has been a demand for the development of a flexible shape processing apparatus that can handle a large number of products in small quantities, even in a lead frame for a semiconductor device, which is an example of the semiconductor component. FIG. 4 is a lead frame for a semiconductor device (see FIG. 3).
FIG. 1 is a schematic explanatory view showing a vertical shape processing device for forming a slab.

According to FIG. 4, this vertical shape processing device 84
Is a semiconductor element mounting pad 71, a support bar 74 supporting the semiconductor element mounting pad 71, an inner lead 72 connected to an electrode terminal of the semiconductor element to form an internal conductive circuit, and connected to this to form an external conductive circuit. Forming the semiconductor device lead frame 70 shown in FIG. 3 having the outer leads 73 and the progressive die device 60 shown in FIG. The vertical processing station 86 is detachably provided and has an independent pressurizing means for vertically opening and closing the vertical processing station 86 in an appropriate sequence. Further, an intermittent conveyance device 85 for intermittently supplying the strip 83 is provided upstream and downstream of the vertical shape processing device 84.

In order to form a lead frame for a semiconductor device, which is an example of an electronic component, by using the vertical shape device 84 shown in FIG. 4, a thin strip 83 is taken from an uncoiler 81 arranged upstream of the processing device 84. Through the hoop controller 82, the wafer is supplied to the processing device 84 in a horizontal state. The strip member 83 intermittently travels at a predetermined transport pitch in each of the shape processing stations 86 (S1, S2,... Sn) of the processing device 84, and is processed by the shape processing mold device 87 mounted on the station 86. The shape processing of the predetermined processing area is sequentially performed, and the shape of the lead frame 70 shown in FIG. 3 is completed.

[0008]

However, as electronic components have become thinner, strips used for the same have become thinner than 0.15 mm, and wide strips have been used. In order to intermittently travel in the vertical shape processing device in a horizontal state, the strip material adheres to the lower die surface of the shape processing die device by punching oil or the like, and separation of the strip material is incomplete, resulting in poor conveyance. There was a problem that would occur.

Furthermore, the strip material is bent by its own weight, and when the strip material travels in the mold apparatus, it comes into contact with the mold surface and damages the surface of the fine electronic component, such as abrasion and bending. There was a problem that would occur.

In addition, when the thin strip material travels horizontally in the mold apparatus and forms a desired shape, the removal of falling pieces such as punch burrs and fine punch scraps is incomplete, and these are incomplete. There is a problem that it remains in the mold device and generates a dent on the surface of a fine electronic component.

The present invention has been made in view of the above circumstances, and solves the above-mentioned problems, prevents poor conveyance, abrasions and dents, and produces a high-quality and highly reliable electronic component. It is an object of the present invention to provide an electronic component shape processing device that can be efficiently obtained.

[0012]

According to a first aspect of the present invention, there is provided an electronic component shape processing apparatus, comprising: an independent horizontal die for horizontally opening and closing a shape processing die apparatus divided for each processing step; A required number of horizontal shape processing stations provided with pressure means are arranged in a required number, and the required shapes of electronic components such as semiconductor device lead frames and connector leads are sequentially formed from the thin plate material by the shape processing die apparatus. A shape processing device for an electronic component to be formed, wherein the shape processing device is configured to divide the plurality of horizontal shape processing stations into at least two shape processing groups separately for each processing shape, and An intermittent transport device that transports the thin strip in synchronization with one or both of the upstream and the downstream is provided, and the thin strip support device that performs the synchronous transport with the intermittent transport device is a horizontal type. At least between Jo processing stations
The configuration is characterized by being provided in one place.

[0013]

According to a second aspect of the present invention, there is provided the electronic component shape processing apparatus according to the first aspect, wherein each of the shape processing groups includes a horizontal loop for adjusting a tension of the thin strip material. It is configured to be connected via a forming device to form a one-step unit of shape processing.

According to a third aspect of the present invention, there is provided the electronic component shape processing apparatus according to the first or second aspect, further comprising: An air discharging device for discharging air for each processing cycle is provided in the shape processing die device.

According to a fourth aspect of the present invention, there is provided an electronic component shape processing apparatus according to any one of the first to third aspects, wherein each of the horizontal shape processing stations is provided with an electronic component. Is characterized by being equipped with a terminal detection sensor for detecting a terminal of the thin strip material, a clutch brake for individually stopping the shaping station by a signal of the detection sensor, and a control device for controlling them. It is configured to be.

[0017]

According to a first aspect of the present invention, there is provided an electronic component shape processing apparatus, wherein a required number of horizontal shape processing stations are arranged, and the thin strip material is placed inside a shape processing die apparatus in a vertical state with an end face in a width direction up and down. Therefore, the residue such as the burrs of the punched burrs and the scraps can be easily removed from the mold apparatus. As a result, it is possible to prevent deterioration in quality due to damage such as fine dents or deformation on the surface, which has occurred in the prior art, and to remarkably improve the workability of removing residues and the yield.

In the electronic component shape processing apparatus according to the present invention, the configuration processing is divided into a plurality of shape processing groups. By replacing the stations individually, it is possible to easily cope with the demands of small lots and many kinds.

Further, since the thin strip material is provided with an intermittent conveying device upstream and downstream of each shape processing group and a thin strip material supporting device provided in the middle thereof, an ultra-thin strip of 0.15 mm or less is provided. The material can be gripped and transported in a state where the tension is applied to the material, and the intermediate bending of the ultra-thin sheet material caused by the related art can be eliminated. As a result, the ultra-thin strip can be accurately conveyed at a predetermined pitch, and does not come into contact with the mold surface. As a result, the positioning accuracy is improved, the conveyance failure is eliminated, and the workability is improved. Can be.

Further, in the electronic component shape processing apparatus according to the present invention, the respective shape processing groups are connected via a horizontal loop forming apparatus and are configured as a single process unit. The parts and the discharge part can be arranged in an adjacent U-shape, so that the workability can be remarkably improved.

According to a third aspect of the present invention, there is provided an apparatus for processing a shape of an electronic component, wherein air is intermittently blown into a forming apparatus for a forming cycle at an upper side of the forming station. With this configuration, the strip can be easily separated from the die surface of the shape processing die device. As a result, the separation failure between the die surface and the strip in the shape processing which occurs in the prior art is eliminated, and the ultra-thin strip can be smoothly transported in contact. Furthermore, it is possible to forcibly remove residues such as falling pieces of punched burrs and blanks, thereby further reducing damage such as dents on the surface of the electronic component.

According to a fourth aspect of the present invention, there is provided an apparatus for processing a shape of an electronic component, wherein the shape processing station includes a terminal detecting sensor for a strip and a clutch brake, and the shape processing stations are individually stopped.
In the prior art, the unextracted strip remaining over the entire length in the shaping apparatus is only the shaping station in the final process, and the unextracted length of the strip can be significantly reduced. Thereby, the yield of the strip can be significantly improved.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the accompanying drawings, with an embodiment of the present invention embodied in a lead frame for a semiconductor device as an example of an electronic component, for the understanding of the present invention. Here, FIG. 1 is an explanatory view showing an outline of a semiconductor device lead frame shaping apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an outline of a horizontal shaping station according to an embodiment of the present invention, FIG. 3 is a plan view illustrating an example of a lead frame for a semiconductor device, which is an example of an electronic component according to an embodiment of the present invention.

According to FIG. 1, a lead frame shape processing apparatus 10 for a semiconductor device is provided with a horizontal decoiler 12 which feeds a strip material vertically with its width direction being upstream, and outer leads 73 of the lead frame 70 (see FIG. 3). A first shape processing group 14 in which a plurality of horizontal shape processing stations 23 equipped with a shape processing mold device 44 for partially forming a part and the like, and an inner lead 72 of the lead frame 70 are provided.
(See FIG. 3) Forming die apparatus 4 for partially forming parts
A second shape processing group 16 in which a plurality of horizontal shape processing stations 23 equipped with a plurality 4 are mounted, and a shape processing mold device 44 for partially forming a correction (flattening), coining, depressing process and the like of terminal leads are mounted. Third shape processing group 18 in which a plurality of horizontal shape processing stations 23 are arranged.
And a horizontal loop forming device 13, 15, 19 having a loop control means for connecting them, and a horizontal coiler 20 for winding a required shaped strip of the lead frame.
1 having the configuration shown in FIG.

Next, the first, second, and third shape processing groups 14, 16, and 18 constituting the shape processing apparatus 10 will be described. First, according to FIG. 1, the first shape processing group 14 grips the thin sheet material on the upstream and downstream sides of the shape processing group 14 and intermittently conveys this at a predetermined pitch. A downstream conveying device 22, a thin sheet material supporting device 24 in the middle thereof that grips and supports the strip 11, and a required sequence arranged in an appropriate order between the upstream conveying device 21 and the downstream conveying device 22. A number of horizontal shape processing stations 23 are arranged.

The upstream transfer device 21, the downstream transfer device 22, the thin strip material support device 24, and each horizontal shape processing station 23 are mounted on the upper surface of a gantry 25.

In this manner, the drive shafts 26 are provided with spline grooves which are linked to the drive motor 29 so that they are linked with each other via the toothed belt 30 so as to operate synchronously.

Further, a clutch brake 27 is provided at one end of the drive shaft 26.

Here, the second and third shape processing groups 16, 18
Has the same configuration as that of the first shape processing group 14, and thus the description is omitted.

Next, the configuration of the shape processing station 23 will be described with reference to FIG.

As shown in FIG. 2, the shaping station 23 includes a first fixed frame 32, a second fixed frame 36,
A structure including a tie rod 35 for fixing the tie rod 35 apart, a pressure plate 37 slidably mounted in the tie rod 35 in a horizontal direction, and a horizontal pressing means 23a for driving the pressure plate 37 in a horizontal direction. Have been.

The horizontal pressing means 23a is linked with the drive shaft 26 via a toothed belt 30. One of the toothed belts 30 has a toothed pulley 31 slidably mounted in a spline groove of the drive shaft 26.
The other end is connected to an end of the camshaft 33 with an adjustable pulley 34 (for example, MechaLock, a product name of IJssel) that can adjust the mounting and fixing position. A clutch brake (not shown) is attached to the other end of the camshaft 33, and a terminal detection sensor S for the strip 11 is provided at the entrance of each of the horizontal shaping stations. Thereby, the terminal detection sensor S of the strip 11 detects the terminal of the strip 11, and sends a detection signal to the clutch brake via a control device (not shown).
By operating the clutch brake, each of the horizontal shape processing stations 23 can be individually driven sequentially and stopped. As a result, since the terminal is transported to the final horizontal shaping station, the length of the end strip remaining in the shaping apparatus is significantly reduced, and the yield rate of the strip 11 is improved.

The camshaft 33 is rotatably mounted on a bearing (not shown) of the first bearing holder 38 and is fixed to the first fixed frame 32. An eccentric cam 40 is mounted on the camshaft 33 via a key 39. The eccentric cam 40 is rotatably mounted on one end of a connecting rod 41 via a bearing (not shown) via an unillustrated bearing. The other end of the connecting rod 41 is rotatably connected to a connecting pin 42 via a bearing (not shown). This connecting pin 4
Both ends of 2 are fixed to a second bearing holder 43, which is fixed to the pressure plate 37. As a result, the pressure plate 37 is operated in the horizontal direction, and the shape processing die device 44 is opened and closed horizontally.

Next, the structure of the shape processing die device 44 will be described in detail with reference to FIG. According to FIG.
The shape processing die device 44 includes an upper die 46 and a lower die 45. The upper die 46 is provided with a guide lot 47, a punch for forming a part of a predetermined shape of the lead frame, a stripper 48 for guiding and supporting the punch, and for holding down the strip 11; The guide bush through which the guide lot 47 penetrates, the die corresponding to the punching punch, and the guide lifter pins for positioning and guiding both ends of the strip material 11 in the width direction and lifting and supporting the strip material 11 are at appropriate positions. Are provided at a distance from each other. The shaping mold apparatus 44 includes a second fixed frame 36 of the shaping station 23 and the pressing plate 3.
7 and the shape processing mold device 44.
The upper die 46 is fixedly mounted on the surface of the pressure plate 37, and the lower die 45 is fixedly mounted on the surface of the second fixed frame 36.

Further, an ejection nozzle for intermittently discharging air into a gap 55 between the upper mold 46 and the lower mold 45 of the shaping mold device 44 is provided on an upper side of each of the shaping stations 23. The nozzle is provided with a plurality of circular or slit-shaped discharge ports (not shown). This makes it possible to forcibly remove flakes, such as burrs and scraps, remaining and adhering in the shape processing mold device 44, facilitate the separation of the strip from the mold surface, and transport the strip in a non-contact manner. be able to.

Next, with reference to FIG. 1, a description will be given of a process of shaping a lead frame for a semiconductor device, which is an example of an electronic component using the above device. As shown in the figure, in the step of shaping a lead frame for a semiconductor device according to one embodiment of the present invention, a horizontal decoiler 12 capable of feeding out a very thin strip material 0.10 mm thick is provided upstream. Then, the strip material 11 is fed out from the uncoiler 12 in a vertical state with the widthwise end face of the strip material 11 up and down.

First, the ultra-thin strip material 11 fed out
Is suitable for a plurality of horizontal shape processing stations 23 for forming outer leads 73 (see FIG. 3) of a lead frame 70, which is an example of a shape processing group, via a first horizontal loop forming device 13 having a loop control means. Are transported to the first shape processing group 14 arranged (S1, S2,..., Sn) in an appropriate punching order.

Here, the thin strip material 11 conveyed to the first shape processing group 14 travels through the first shape processing group 14 of the lead frame, and unnecessary outer punches 73 of the strip material are punched out. A predetermined pattern such as (see FIG. 3) is sequentially formed.

Next, the thin strip material 11 having passed through the first shaping group 14 is passed through a second horizontal loop forming device 15 having loop control means, and is a lead frame as an example of a shaping group. 70 inner leads 72
(See FIG. 3) A plurality of horizontal shape processing stations 23 forming an array and the like are arranged in an appropriate punching order (S1, S2,...).
... (Sn) are transported to the second shape processing group 16.

Here, the thin strip material 11 conveyed to the second shape processing group 16 travels through the second shape processing group 16 of the lead frame while punching out unnecessary portions of the strip material to form an inner member. A predetermined pattern such as a lead 72 (see FIG. 3) is sequentially formed on the thin strip 11.

Next, the thin strip material 11 having passed through the second shaping group 16 is shown as an example of a shaping group via a third horizontal loop forming device 17 provided with loop control means. A plurality of horizontal shape processing stations 23 for forming flattening, coining, and depressing of the semiconductor element mounting pad 71 (see FIG. 3) at the tip of the inner lead of the lead frame 70 which are not formed are formed in an appropriate forming order. Array (S1, S2... S
The n) third shape processing group 18 is conveyed.

Here, the thin strip material 11 transported to the third shape processing group 18 is the third strip material of the lead frame.
While traveling in the shape processing group 18, flattening, coining, day pressing and the like are formed on a predetermined portion of the thin strip material 11 to form a predetermined forming pattern of the lead frame 72 (see FIG. 3). The final shape of the continuous strip of thin strips formed by sequentially adding the single lead frame shown in FIG.

Next, the continuous band formed by connecting a single lead frame is intermittently cut at a predetermined pitch by an intermittent cutting means (not shown) to form a strip having a required number of single lead frames connected as shown in FIG. It is formed on a frame, or wound around a coiler 20 via a fourth horizontal loop forming device 19 provided with a loop control means, and is completed.

Subsequently, it is provided on one or both of the upstream and / or downstream of the respective shape processing (S1, S2... Sn) groups 14, 16, 18 according to the first and second aspects (in this embodiment, provided on both). The intermittent transporting devices 21 and 22 and the thin strip supporting device 24 (which is provided at one location in the present embodiment) for synchronously transporting the intermittent transporting devices 21 and 22 will be described with reference to FIGS.

According to FIGS. 1 and 2, the horizontal decoiler 12
The thin strip material 11 in the vertical state drawn out of the above is transferred to the shape processing station 23 through the upstream transfer device 21.
It is placed at the predetermined position (S1), and the upstream transport device 21 grips the strip 11. The shape processing station 23 is closed via a drive shaft 25 interlocked with the drive motor of the first shape processing group 14 to form the shape of the shape processing station S1. Next, the shape processing station 23 is opened, and the upstream transfer device 21 gripping the strip 11 is transferred at a predetermined pitch. Then, the shape processing station 23 is closed, the grip of the strip 11 is released, and the upstream conveying device is returned to the initial position, and the strip 11 is gripped in a positioned state. This is repeated to form the shapes of S1, S2,..., The thin sheet material is grip-supported in the middle by the thin sheet material supporting device 24 provided in the middle, and is synchronously conveyed. And sent to the downstream transport device. After this, three of the upstream transport device 21, the support device 24 and the downstream transport device 22
The strip material 11 is conveyed in a state of being dimensioned while being gripped at a point, the required shape of the first shape processing group is repeatedly formed, and the second shape processing group and the The shapes are conveyed to the third shaping group and the shapes of the respective shaping groups are sequentially and continuously formed. Here, although the thin plate member supporting device is provided at one place, if a plurality of thin strip member supporting devices are provided by punching, more accurate conveyance can be performed. Further, each of the shape processing groups can apply a certain tension to the thin strip material by each horizontal loop forming apparatus having loop control means provided upstream and downstream thereof.

Next, an air discharging device provided on the upper side of each of the horizontal shape processing stations 23 (S1, S2... Sn) according to claim 3 will be described with reference to FIG. When each of the horizontal shape processing stations 23 is sequentially closed and the upper die 46 and the lower die 45 of the shape processing die device 44 abut on the thin plate material 11 and the shape processing is completed, the horizontal shape processing station 23 is closed. A gap 55 is formed between the upper mold 46 and the lower mold 45 by sequentially opening the mold apparatus 44 for shaping.
When the gap 55 is formed, the electromagnetic valve 54 operates, and the air filter 52 and the regulator 5
3 is introduced into the nozzle 50 and blows out from the nozzle hole (not shown) into the gap 55 so that the shape processing mold device 4 is formed.
In addition to forcibly removing the residue adhered to the inside of the mold 4, the thin strip 11 is separated from the lower mold surface, and the strip 11 is transported while keeping the non-contact with the mold surface.

Subsequently, the individual stop of each of the horizontal shape processing stations 23 according to the fourth aspect will be described. A terminal detection sensor 75 provided at the entrance side of the horizontal shape processing station 23 detects a terminal of the strip 11 and outputs a detection signal. The detection signal is input to a control device (not shown), and the camshaft 33 is transmitted from the control device. Is output to a clutch brake (not shown) provided at the other end of the workpiece, and the shape processing station 23 (S1) is stopped in an open state. In the meantime, the terminal of the strip 11 is unprocessed and conveyed to the next process. In the same manner, the end of the strip is detected, and the process is stopped with the shape processing station 23 (S2) opened. Article 1
One terminal is conveyed and stopped at each shape processing station, stops with all shape processing stations 23 opened, and the terminal passes through the final station without processing. As a result, the punch and die of the shaping mold apparatus are not damaged, and the terminal, which had been stopped at the first station in the past, can be transported to the last station. As a result, the material yield is improved.

Although the embodiment of the present invention has been described using a thin strip of 0.10 mm, the present invention can be applied to a strip of 0.10 mm or less. Also, as an embodiment of the present invention, the first, second, and third groups have been described as being divided into three groups. However, the horizontal shape processing station may be divided into more groups or may be reduced. Can also. Although the embodiment of the present invention has been described using the eccentric cam system for opening and closing the horizontal shape processing station, a knuckle mechanical drive mechanism may be used. Further, in the embodiment of the present invention, the drive system is interlocked with the drive shaft common to each group. However, a drive motor may be provided for each horizontal shape processing station and may be independently driven. Further, it is needless to say that hydraulic drive such as hydraulic pressure and pneumatic pressure can be used.

[0049]

According to the shape processing apparatus of the present invention, it is easy to remove punch burrs and punches which fall into the shape processing apparatus. There is no damage such as bending, and the quality is improved. Further, since the separation of the thin strip material and the shape mold device is facilitated, troubles of conveyance failure occurring at the time of conveyance are eliminated, and workability is improved. Furthermore, since the grip is conveyed at a plurality of locations while maintaining the dimensions, the positioning accuracy is improved. Furthermore, since the end of the thin strip material is transported to the final horizontal shape processing station, the unprocessed portion is reduced compared to the conventional technology, the material yield is significantly improved, and the damage and breakage of the blade are reduced, and the number of repairs is reduced. Is significantly reduced, productivity is increased, and manufacturing costs are reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an outline of a shape processing apparatus for a lead frame for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating an outline of a horizontal shape processing station according to an embodiment of the present invention.

FIG. 3 is a plan view showing an example of a lead frame for a semiconductor device which is an example of an electronic component according to an embodiment of the present invention.

FIG. 4 is an explanatory view showing an outline of an apparatus for processing the shape of a lead frame for a semiconductor device according to a conventional example.

FIG. 5 is a plan view showing an outline of a mold device for processing a lead frame for a semiconductor device according to a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 Lead frame shape processing device for semiconductor device 11 Thin strip material 12 Horizontal uncoiler 13 First horizontal loop forming device 14 First shape processing group 15 Second horizontal loop forming device 16 Second shape processing group 17 Third Horizontal loop forming device 18 Third shape processing group 19 Fourth horizontal loop forming device 20 Horizontal coiler 21 Upstream transfer device 22 Downstream transfer device 23 Horizontal shape processing station 24 Thin sheet material support device 25 Frame base 26 Drive shaft 27 Clutch Brake 28 Drive belt 29 Drive motor 30 Toothed belt 31 Toothed pulley 32 First fixed frame 33 Camshaft 34 Toothed pulley with position adjustment 35 Tie lot 36 Second fixed frame 37 Pressure plate 38 First bearing holder 39 Key 40 eccentric cam 41 connecting grotto 4 2 Connecting Pin 43 Second Bearing Holder 44 Shape Molding Device 45 Lower Mold 46 Upper Mold 47 Guide Rod 48 Stripper 49 Guide Lifter 50 Nozzle 51 Pipe 52 Air Filter 53 Regulator 54 Solenoid Valve 55 Gap 60 Shape Mold Apparatus 61a Shape processing station 61n Shape processing station 70 Lead frame for semiconductor device 71 Pad for mounting semiconductor element 72 Inner lead 73 Outer lead 74 Serport lead 75 Seroto lead 81 Uncoiler 82 Hoop controller 83 Strip material 84 Vertical shape processing device 85 Intermittent transfer device 86 Vertical shape processing station 87 Shape processing mold equipment

──────────────────────────────────────────────────続 き Continuing on the front page (72) Isao Yonenaga 2-10-1, Komine, Yawatanishi-ku, Kitakyushu Mitsui High-Tech Co., Ltd. (72) Inventor Muneya Shibata 2-10-1, Komine, Yawatanishi-ku, Kitakyushu (56) References JP-A-5-185153 (JP, A) JP-A-6-55234 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23 / 50

Claims (4)

(57) [Claims] A thin plate strip is constituted by arranging a required number of a plurality of horizontal shape processing stations provided with independent horizontal pressing means for driving a shape processing mold device divided and opened in a horizontal direction in each processing step. An electronic component shape processing device for sequentially forming a required shape of an electronic component such as a semiconductor device lead frame or a connector lead from a material using the shape processing mold device, wherein the shape processing device includes a plurality of the horizontal dies. An intermittent transfer device configured to divide a shape processing station into at least two shape processing groups separately for each processing shape, and to operate the upstream and / or downstream of each of the shape processing groups in synchronism with each other to convey the thin plate material. And an electronic unit, wherein a thin sheet material support device that performs synchronous transfer with the intermittent transfer device is provided at at least one position between each horizontal shape processing station. Shape processing device. 2. The shaping machine according to claim 1, wherein the shaping groups are connected to each other via a horizontal loop forming device for adjusting the tension of the thin strip material, thereby forming a one-step unit for shaping. Electronic parts shape processing equipment. 3. An air discharging device for discharging air for each processing cycle is provided in the upper part of each of the horizontal shape processing stations, in the shape processing die device. The electronic component shape processing device according to claim 2. 4. Each of the horizontal shaping stations includes a terminal detection sensor for detecting an end of the thin strip material, a clutch brake for individually stopping the shaping station according to a signal from the detection sensor, and controlling them. 4. The apparatus according to claim 1, further comprising: a controller configured to perform the processing.