JP3061735B2 - Lead frame shape processing equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for processing the shape of a lead frame for a semiconductor device, and more particularly, to forming a lead frame pattern from a nickel or copper-based thin plate material. The present invention relates to a semiconductor device lead frame shape processing device that processes a shape by a plurality of shape processing groups.

[0002]

2. Description of the Related Art In recent years, with the progress of semiconductor manufacturing technology,
As devices have become smaller, thinner, and more highly integrated, lead frames used for them have become smaller in lead width, lead spacing, and plate thickness, but similar types of leads differ in part depending on the application. The design of the frame has been made, and the era of so-called small-quantity multi-products has entered. FIG.
Shows a lead frame 70 used for mounting such a semiconductor device. Pressing (stamping) using a progressive die 71 shown schematically in FIG. The lead frame pattern is formed by the etching process described above.
In particular, the lead frame 70 formed by press working
About the inner lead portion 7 of the lead frame 70
2. Since it is difficult to form all of the shapes between the leads of the outer lead portion 73 and the suspension lead portion (support lead portion) 74 in a single punching process, the shape punching between the leads is performed in a plurality of processes ( That is, as shown in FIG.
In this example, the layout is designed to be formed by the progressive die 71 having a process divided into eight groups of stations. When such a fine lead frame 70 is formed by a progressive die 71 divided into a plurality of stations, the lead frame 70 is usually sent out from an uncoiler 76 provided upstream through a loop control means 77 as shown in FIG. The thin strip material 78 is intermittently fed into the progressive die 71 in the shape processing device 79 using a transfer device 80 disposed on the entrance side of the shape processing device 79 including a press device,
A lead frame shape processing line for a semiconductor device lead frame that winds up a punched strip 78a after processing is gradually formed into a lead frame shape by the N group of stations.

[0003]

However, although the conventional shape processing line has sufficient processing capability, it is necessary to prepare expensive dies for each shape of the lead frame. There was a problem that it was not suitable for the production of. That is, rearrangement of the stations in an order suitable for forming and forming a multi-pin fine lead frame, and formation of a lead frame of a similar type having a part of the same material width, the number of pins, and the shape are performed in the order described above. It cannot be easily performed by changing the station of the remittance die, and it is necessary to produce an expensive progressive die for each similar type. There was a problem. In recent years, as semiconductor devices have become extremely thin, ultra-thin thin plate members having a thickness of 0.15 mm or less have been used as the thin plate members forming a lead frame. In the device lead frame shape processing line, since the thin plate member 78 traveling in the progressive die 71 described above is long, the thin plate member 78 is loosened and deformed in the progressive die 71 to manufacture the device. Lead frame 70 shape
There is a problem in that processing accuracy such as dimensions is affected and quality and yield are reduced. The punching oil applied to the thin strip material 78 causes the thin strip material 78 to adhere to the surface of the progressive die 71, causing a transport trouble and reducing work efficiency. Furthermore, when the progressive die as described above is used, the design layout of the shape processing station is designed so as to prevent breakage of the punching blade due to an eccentric load caused by a different shear load for each shape processing station. However, there is a problem that the degree of freedom in the arrangement design of the shape processing stations is significantly limited. The present invention has been made in view of such circumstances, and it is possible to cope with low-cost and high-mix production at a low cost. Further, for example, even if the thickness of the thin plate material is 0.15 mm, it can be smoothly performed. It is an object of the present invention to provide a semiconductor device lead frame shape processing apparatus capable of manufacturing a semiconductor device lead frame with good yield.

[0004]

According to the present invention, there is provided a semiconductor device comprising:
The semiconductor device lead frame shape processing apparatus described in
From nickel or copper thin sheet material, inner lead part,
What is claimed is: 1. A semiconductor device lead frame shape processing apparatus for forming a semiconductor device lead frame having an outer lead portion and an element mounting portion by press working, comprising: a plurality of shape processing groups for sequentially performing the press working; The processing group includes a replaceable upper die and a lower die, and has a plurality of shape processing means capable of shifting the respective processing phases. Further, before and after the respective shape processing groups, the shape processing is performed. Driven in synchronism with the group, an upstream transport means and a downstream transport means for intermittently transporting the thin strip material at a predetermined pitch are arranged, and further, an entrance side of each shape processing means of each of the shape processing groups. A guide lifter that lifts the thin strip is provided on the outlet side. Here, the fact that the processing phase can be shifted means that the pressing time of each shape processing means can be freely changed within a certain range. According to a second aspect of the present invention, there is provided a semiconductor device lead frame shape processing apparatus.
The apparatus according to claim 1, wherein the plurality of shape processing groups include:
A first step of sequentially punching and forming a shape of the outer lead portion including an outer frame and an inner frame of the semiconductor device lead frame;
A second shape processing group for sequentially punching and forming the shape of the inner lead portion including the element mounting portion and its suspension lead, etc., and coining and bending and / or bending the tip of the inner lead portion. A third shape processing group for performing a separation forming process of the tip of the inner lead portion. According to a third aspect of the present invention, in the semiconductor device lead frame shape processing apparatus according to the first or second aspect, the thin plate member has a thickness of 0.1.
It is configured to be 5 mm or less.

[0005]

According to a first aspect of the present invention, there is provided an apparatus for processing a lead frame for a semiconductor device, comprising a plurality of shape processing groups for performing press working of a lead frame, wherein the shape processing groups are replaceable upper dies and Since there is a shape processing means having a lower die, when the lead frame has a partially different shape, it can be dealt with by exchanging the upper die and the lower die of the shape processing means. That is, there is no need to prepare a mold corresponding to the shape of the lead frame as in the related art. Further, before and after each shape processing group, there are an upstream conveying means and a downstream conveying means for intermittently feeding the thin strip material, so that the ultrathin sheet material having a thickness of 0.15 mm or less is temporarily provided. However, it is possible to convey the inside of the shape processing group while applying a certain tension. Further, since the shape processing means is configured to shift the processing phase, the pressing operation of the plurality of shape processing means can be sequentially performed, thereby reducing power and
The device can be made compact. Further, since the dies of the shape processing means constituting each shape processing group are independently separated, the layout of the dies becomes easy, and even if there is a change in the dies, only the layout of the dies in that portion is sufficient. Also, the design of the mold becomes easy. And since the guide lifter which lifts a thin strip material was provided in the entrance side and the outlet side of the shape processing means, except at the time of press working, the thin strip material to be conveyed can be raised to the upper part, In addition, it is possible to prevent a transportation trouble caused by punching oil sticking to the thin strip material. In particular, in the semiconductor device lead frame shape processing apparatus according to claim 2, the plurality of shape processing groups sequentially punch out the shape of the outer lead portion including the outer frame and the inner frame of the semiconductor device lead frame. A first shaping group to be formed, a second shaping group to sequentially punch and form the shape of the inner lead portion including an element mounting portion and its suspension lead, etc., and coining and bending of the tip of the inner lead portion. And / or a third shape processing group for performing separation forming processing of the tip of the inner lead portion, so that the lead frame can be processed in accordance with these orders. In this case, for example, when there is a change in the outer lead portion, a mold (upper die and lower die) required for each shape processing means constituting the first shape processing group for processing the outer lead portion.
Can be done by replacing In the apparatus for processing a lead frame for a semiconductor device according to the third aspect, an ultra-thin plate having a thickness of 0.15 mm or less is used as the thin plate member. Since it has the upstream-side conveying means and the downstream-side conveying means for intermittent feeding, it can carry smoothly.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will now be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is a schematic explanatory view of a semiconductor device lead frame shape processing apparatus according to one embodiment of the present invention, FIG. 2 is a front view of a shape processing means used in the semiconductor device lead frame shape processing apparatus, FIG. 3 is a view showing a guide lifter of a shape processing means used in the semiconductor device lead frame shape processing apparatus, and FIG. 4 is a schematic sectional view showing an attached state of the guide lifter.

As shown in FIG. 1, a lead frame shape processing apparatus 10 for a semiconductor device according to one embodiment of the present invention comprises:
An uncoiler 12 that is arranged on the upstream side and winds the thin plate member 11 and gradually unwinds the same, and first to third shape processing groups 13 to 15 that shape the thin plate member unwound from the uncoiler 12 are formed. And a coiler 16 for winding the processed lead frame. Then, the uncoiler 12 and the first to third shape processing groups 1
Loop control means 17 to 20 between 3 and 15
Is provided. Hereinafter, these will be described.

The first to third shape processing groups 13 to
15 is provided with an upstream conveying means 21 and a downstream conveying means 22, respectively, for smoothly conveying the thin plate material 11. Then, the first to third shape processing groups 13 to 15
Are a plurality of shape processing means 23 (S1 to Sn, 2S1 to 2Sn, 3S1 to 3S
n), each of which is mounted on a single gantry 24. The shape processing means 23 is constituted by a single press device.

First to third shape processing groups 13 to 15
Is a drive shaft 25 as shown in FIGS.
The drive shaft 25 has a clutch brake 26
And a toothed pulley and a toothed belt 27 (not shown), and can be rotationally driven by a drive motor 28. A plurality of toothed pulleys 30 are fixedly attached to the drive shaft 25, and toothed belts 29 that engage with the toothed pulleys 30 are hung, and bolsters (mounting stands) 32 of the respective shape processing means 23. The rotational power is transmitted to a toothed pulley 33 attached to an end of a crankshaft 31 disposed at a lower position of the crankshaft 31. As shown in FIG. 2, the toothed pulley 33 has a mechanism for changing a mounting phase with respect to the crankshaft 31 (for example, a product name “Mecha Lock”: ISEL Corporation)
Is provided, and the toothed pulley 3 is adjusted at an arbitrary angle by adjustment.
3 can be attached to the crankshaft 31. Thereby, simultaneous punching of the respective shape processing means 23 is prevented, and the driving motor 2 with a small capacity is used.
8 enables the entire operation.

[0010] Four linear shafts 34 are vertically movably fitted in the bolster 32, and a pressure plate 35 is fixed to an upper portion of the linear shaft 34, and a pressure transmission plate 36 is fixed to a lower portion thereof. Have been. In the middle of the crankshaft 31, a first bearing 37 is provided.
The eccentric cam 38 is attached to the crankshaft 31 adjacent to the first bearing 37, and a key 39 is fitted and fixed between the crankshaft 31 and the eccentric cam 38. A second bearing 40 is attached to the outside of the eccentric cam 38, and the second bearing 40 is fitted on an upper portion of the connecting rod 41. The other of the crankshaft 31 is supported by a bearing 42 fixed to the bolster 32. The connecting rod 41
A pin 43 is provided at a lower portion of the bearing housing 45, and both sides of the pin 43 are supported by bearings 44. The bearings 44 are provided in bearing housings 45 and 46 mounted on a lower pressure transmitting plate 36 via a base plate 47. Are located in

A lower die 48 is fixed to the bolster 32, and a guide rod 49 is fitted therein. A stripper 50 is fitted and mounted on the guide rod 49.
An upper die 51 is fixed to the pressing plate 35, and an upper adjusting plate 52 is mounted between the upper die 51 and the pressing plate 35. The shape processing means 2
The guide lifters 53 are attached to both sides of the bolster 32, as shown in FIGS. 3 and 4.
4 is vertically movably fixed, and a spring 55 is mounted in the middle. In the head of the guide lifter 53, a strip positioning groove 56 is provided. With such a configuration, the thin plate member 11 is urged upward by the spring 55 of the guide lifter 53 except during punching, thereby preventing the sticking of punching oil and preventing a trouble in transport of the thin plate member 11. ing. Then, at the time of punching, the upper die 51 is pressed by the lowering of the upper die 51 and descends, and abuts on the lower die 48 to perform punching.

A material guide 58 is provided between the adjacent shape processing means 23 as shown in FIG. The material guide 58 has a groove-shaped guide 59 disposed on both sides of the thin strip 11, a pin 53a and a spring 55a for elastically supporting these at predetermined positions, and the passing thin strip 11 is bent. Not to be. The second shape processing group 14 and the third shape processing group 15 also have shape processing means (2S1-2) having the same structure as the plurality of shape processing means 23 included in the first shape processing group 13.
Sn) and (3S1-3Sn) are provided, and their configurations and operations are the same.

The upstream transport means 21 and the downstream transport means 22 are driven via the drive shaft 25 and move in synchronization with the shape processing means 23. The upstream conveying means 21 and the downstream conveying means 22 have a well-known structure, and simultaneously grasp the thin strip 11 by the rotation of the drive shaft 25 and open the thin strip 11 after moving forward by a predetermined distance. It returns to its original position (not shown) to prevent deformation of the thin strip material 11 due to only pushing and pulling conveyance. The thin strip material 11 conveyed by the upstream conveying means 21 and the downstream conveying means 22 is fed out from the uncoiler 12, is provided with bending by the first to fourth loop control means 17 to 20, and is provided with the first to fourth loop control means. The tension of the thin sheet material 11 conveyed to the third shape processing groups 13 to 15 is always kept constant.
By applying a constant tension to the thin strip 11 in this way, the thin strip 11 can be smoothly transported and the pattern of the lead frame can be smoothly formed, thereby increasing the yield.

As described above, the apparatus for processing a lead frame for a semiconductor device according to one embodiment of the present invention comprises
Since the shape processing groups 13 to 15 are provided, the first
In the shape processing group, the shape of the outer lead portion including the outer frame and the inner frame constituting the lead frame is sequentially processed,
In the second shape processing group, the shape of the inner lead portion including the element mounting portion and the suspension lead is sequentially processed,
In the third shape processing group, finishing is performed by coining or bending the tip of the inner lead portion, forming the tip separately, and the like, and is wound up by the coiler 16. If a part or all of the design of the lead frame pattern formed on the thin strip material 11 is changed, the first
This can be easily performed by changing part or all of the molds (referring to the upper mold and the lower mold) of the shape processing means 23 in any one of the shape processing groups 13 to 15.

In terms of maintenance, maintenance can be performed for each of the shape processing means 23 of each of the shape processing groups 13 to 15, so that the maintenance can be performed quickly and easily. Further, if necessary, the first to third shape processing groups 13 to 15 can be easily arranged in an order suitable for the punched shape of the lead frame.
Alternatively, the arrangement of the shape processing means 23 can be rearranged (actually, only a mold is required). In the embodiment of the present invention, the thin strip material 11 is 0.15 mm, but a thin material less than 0.15 mm can be used, and further, a thick material larger than 0.15 mm is used. It is also possible. Although the semiconductor device lead frame shape processing apparatus 10 uses the first to third shape processing groups 13 to 15, the shape processing groups may be increased or decreased.

[0016]

According to a first aspect of the present invention, there is provided an apparatus for processing a lead frame for a semiconductor device, wherein a plurality of shape processing groups perform press working, and each shape processing group has a plurality of shape processing means. Therefore, a design change of a lead frame of a similar kind having a part of the same processing can be performed by exchanging a part of the mold. Therefore, it is possible to easily manufacture a small amount of various types of lead frames at a low cost, with a short production period, and easily. Further, since upstream and downstream conveying means are provided before and after the shaping group, even when the thickness of the strip is thin, the material can be smoothly conveyed into the shaping group. Since the shape processing means can shift the processing phase, it is possible to realize a power-saving and compact apparatus by setting the shape processing means to perform the press working in order. Further, in this semiconductor device lead frame shape processing apparatus, since the guide lifter is provided, it is possible to prevent the punching oil from adhering to the thin strip material, thereby preventing the occurrence of transport trouble. Further, even a thin strip material can be smoothly pressed.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of an apparatus for processing a shape of a lead frame for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a front view of a shape processing means used in the semiconductor device lead frame shape processing apparatus.

FIG. 3 is a view showing a guide lifter of a shape processing means used in the semiconductor device lead frame shape processing apparatus.

FIG. 4 is a schematic sectional view showing an attached state of the guide lifter.

FIG. 5 is a plan view of a lead frame for a semiconductor device.

FIG. 6 is a schematic plan view of a lower mold of a mold apparatus used for conventional shape processing.

FIG. 7 is a schematic explanatory view of a conventional shape processing device.

[Explanation of symbols]

10: Shape processing device for semiconductor device lead frame, 1
1: thin strip material, 12: uncoiler, 13: first shape processing group, 14: second shape processing group, 15:
Third shape processing group, 16: coiler, 17: loop control means, 18: loop control means,
19: loop control means, 20: loop control means, 21: upstream transfer means, 22: downstream transfer means, 23: shape processing means, 24: gantry, 25: drive shaft, 26: clutch brake, 27: toothed belt,
28: drive motor, 29: toothed belt, 30: toothed pulley, 31: crankshaft, 32: bolster,
33: toothed pulley, 34: linear shaft, 35: pressure plate, 36: pressure transmission plate, 37: first bearing, 38: eccentric cam, 39: key, 40: second bearing, 41: connecting rod , 42: bearing, 43: pin, 44: bearing, 45: bearing housing, 46:
Bearing housing, 47: base plate, 48: lower mold,
49: guide rod, 50: stripper, 51: upper die, 52: upper adjust plate, 53: guide lifter, 53a: pin, 54: die plate, 55: spring, 55a: spring, 56: strip positioning groove, 5
8: Material guide, 59: Groove guide

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Muneya Shibata 2- 10-1 Komine, Yawatanishi-ku, Kitakyushu-shi, Fukuoka Prefecture Mitsui High-Tech Co., Ltd. Hei 5-275591 (JP, A) JP-A-62-124033 (JP, A) Japanese Utility Model Application Hei 5-39718 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23 / 50 B21D 28/00

Claims (3)

(57) [Claims] An apparatus for processing a lead frame for a semiconductor device, comprising: forming a lead frame for a semiconductor device having an inner lead portion, an outer lead portion, and an element mounting portion from a nickel or copper-based thin plate material by press working. A plurality of shape processing groups for sequentially performing the press working, the shape processing group including a replaceable upper die and a lower die, and a plurality of shape processing means capable of shifting respective processing phases. Further, before and after each of the shape processing groups, upstream and downstream conveyance means which are driven in synchronization with the shape processing group and intermittently convey the thin strip material at a predetermined pitch are arranged. Further, a guide lifter for lifting the thin strip material is provided on an inlet side and an outlet side of each of the shape processing means in each of the shape processing groups. Shaping device of a lead frame for a semiconductor device, characterized in that provided. 2. The semiconductor device lead frame shape processing device according to claim 1, wherein said plurality of shape processing groups include a shape of said outer lead portion including an outer frame and an inner frame of said semiconductor device lead frame. A first shape processing group for sequentially punching and forming, a second shape processing group for sequentially punching and forming the shape of the inner lead portion including the element mounting portion and its suspension lead, and the like. A third shape processing group for performing coining, bending, and / or separation forming of the tip of the inner lead portion. 3. The shape processing apparatus for a lead frame for a semiconductor device according to claim 1, wherein the thickness of the thin strip material is 0.15 mm or less. apparatus.