JPS6381963A - Pressing machine - Google Patents

Abstract

PURPOSE:To manufacture a mold for molding a lead frame efficiently at low cost by dividing a mold for a pressing machine into a general purpose block and a discrete block and forming only the discrete block in structure in which the discrete block can be exchanged with other kinds. CONSTITUTION:When manufacturing products in which the final appearance of packages are equalized and only the structure of inner lead regions I differs, only discrete block 3b, 6b is removed from platens and exchanged with discrete blocks in products of other kinds in each mold 3 and 6. Molds (the bottom force 3 and the top force 6) are shaped in structure in which they can be divided into general purpose blocks 3a, 6a forming an outer lead region 0 and the discrete block 3b, 6b shaping the inner lead region I, and the discrete block 3b, 6b can be exchanged with blocks having different standard structure, thus allowing the manufacture only of molds for discrete block 3b, 6b section when developing products of other kinds, then realizing the improvement of the efficiency of the manufacture of the molds and the reduction of cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to a press molding machine for lead frames, and is applicable, for example, to a press molding machine for lead frames used in the manufacture of semiconductor devices. It is about effective techniques.

[Conventional technology]

Regarding lead frames, for example, Kogyo Kenkyukai Co., Ltd., published January 10, 1980, RLC Mounting Technology.
(edited by Japan Microelectronics Association) P137-P
141. Here, various lead frames used in so-called resin-sealed semiconductor devices are introduced through diagrams and photographs.

The inventor studied the manufacturing technology of the lead frame as described above. The following is a technology considered by the present inventor, and its outline is as follows: In the manufacturing process of a semiconductor device, a lead frame made of conductive gold @ slope is processed into a predetermined shape. It is known that a package can be formed as a component.

As an example of such a lead frame structure, taking a dual in-line (DIL) package as an example, a rod-shaped frame part is used as a starting member, and a semiconductor pellet is attached to the center part of this frame part. A tab is provided in a state where it is supported by a tab suspension lead, and around this tab, a lead whose starting member is the frame portion is extended to the vicinity of the tab. As a means for forming a lead frame having such a structure, a press forming machine using a punching die having a predetermined shape is generally known.

By the way, even if the package appearance of the final semiconductor device is the same, the shape of the inner lead region of the lead frame must be changed depending on the size of the semiconductor pellet to be mounted or the weight-bearing shape of the pad. In most cases. Therefore, when molding the lead frame 4, it is necessary to newly manufacture a press mold corresponding to the lead frame standard for each product type from the beginning.

[Problem that the invention seeks to solve]

However, as mentioned above, since a new press mold is manufactured from scratch for each product type, it takes a long time to complete the semiconductor device, which makes it difficult to efficiently provide finished products for new product types. In addition, the inventor has discovered that since a new mold is manufactured from the beginning, the manufacturing cost of the mold becomes high.

The present invention has been made focusing on the above problems,
The purpose is to provide a technology that allows the production of molds for molding lead frames efficiently; and at low cost.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief summary of typical inventions disclosed in this application is as follows.

That is, the mold of the press molding machine is divided into a general-purpose block and an individual block, so that only the individual blocks can be exchanged with those of other types.

[Operation] According to the above-mentioned means, for example, by making the outer lead area a general-purpose flock and the inner lead area a specific part, for products of other types having the same package appearance, individual blocks with different molded shapes in the inner lead area can be used. This makes it possible to replace molds by simply replacing them, allowing press molds to be manufactured efficiently and at low cost. As a result, it becomes possible to quickly provide products that meet the new standards.

〔Example〕

FIG. 1 is an explanatory diagram showing a lead frame press molding machine according to an embodiment of the present invention, and FIG. 2 is a plan view showing a lead frame molded by the lead frame press molding machine according to the present embodiment. be.

The lead frame press molding machine 1 of this embodiment includes a lower die 3 mounted on a fixed platen 2 and an upper die 6 suspended from a movable platen 5 that can be moved up and down by a drive mechanism such as a cylinder mechanism 4. As the upper die 6 moves downward, the frame substrate 7 placed on the lower die 3 is punched out into a predetermined shape, resulting in a lead frame 8 as shown in FIG.
The molding is performed.

The lower mold 3 and the upper mold 6 are general-purpose blocks 3a and 6, respectively.
It is divided into a block a and individual blocks 3b and 6b.

These individual blocks 3b, 6b are connected to each platen 2 and 5.
It is easily attached and detached by means such as bolts.

Such individual blocks 3b, 6b constitute, for example, one inner lead region (2), that is, the portion surrounded by the two-dot chain line of the lead frame 8 in FIG. This forms a lead region 01, that is, a portion surrounded by a dashed line in FIG.

Here, such individual blocks 3b and 6b can be replaced depending on the type of semiconductor device to be manufactured, and it is desirable to have a large number of types that can form various inner lead shapes and tab sizes. .

The lead frame 8 molded by the lead frame molding machine 1 of this example is as shown in FIG.
This is used in a dual in-line (DIL) type resin molded semiconductor device.

The lead frame 8 is formed by horizontally connecting a large number of lead frames 8 as shown in FIG. 2, each unit being a portion surrounded by a rectangular frame portion 8a. A tab 9 to which a semiconductor pellet (not shown) is mounted is formed in the central portion surrounded by the frame portion 8a, and is supported from two directions by a tab suspension lead IO extending from the frame portion 8a. There is. Around this tab 9, leads 11 having the frame portion 8a as a starting member are extended to the vicinity of the tab, and each lead 11 is connected to each other by a tie bar 12 at an intermediate portion thereof. The lead 11 portion inside this tie bar 12 forms an inner lead lla. Here, the outer part of the tie bar 12 is the outer lead area O.
, and a portion on one side forms an inner lead region I. The inner lead region I is a part sealed in resin during resin molding, while the outer lead region O is exposed to the outside after sealing.
It essentially becomes a part of the lead bin.

Next, the operation of this embodiment will be explained.

First, when the frame substrate 7 made of copper alloy or 4270I is placed in a predetermined position on the lower mold 3, the movable platen 5 is lowered in conjunction with the upper mold 6 by the operation of the cylinder mechanism 4, and the lower mold The frame substrate 7 on 3 is pressed to perform a predetermined punching. In such a press step, for example, all the processing may be performed in one press operation, or the processing may be performed in multiple press steps. In this case, for example, although not shown, a plurality of upper molds 6 and lower molds 3 as shown in FIG. It has a divisible structure. In this case, only a predetermined set of a plurality of sets of upper molds and lower molds constitutes an individual block, and may be interchangeable with those of other types. .

In such a lead frame press molding machine 1, the final package appearance is the same, and the inner lead area
When manufacturing products that differ only in structure, only the individual blocks 3b and 6b of each mold 3 and 6 are removed from the platen and replaced with individual blocks of other product types.

In this way, the molds (lower mold 3 and upper mold 6) are divided into general-purpose blocks 3a, 5a that form the outer lead area O and individual blocks 3b, 6b that form the inner lead area (2).
These individual blocks 3b and 6 have a structure that can be divided into
By making it possible to replace b with one with a different standard structure, individual blocks 3b and 6b can be used when developing other product types.
It is only necessary to manufacture the mold for that part, making it possible to improve the efficiency and reduce the cost of mold manufacturing.

As described above, according to this embodiment, the following effects can be obtained.

(1) The mold for IJ-frame press molding (lower mold 3 and upper mold 6) is divided into general-purpose blocks 3a, 5a and individual blocks 3b, 6b.
By making b and 6b replaceable, it is possible to improve efficiency and reduce costs in mold manufacturing.

(2) Due to (1) above, it is possible to quickly provide finished products when developing new varieties.

(3) The outer lead area O is a general-purpose block 3a.

6a, and the inner lead area I is an individual block 3b,
6b, it is possible to efficiently manufacture a wide variety of products in small quantities with the same pancake appearance.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, as for the lead frame 8 manufactured by the lead frame press molding machine 1, only a so-called dual-in-line (DIL) shaped product has been described, but it can also be used in a package structure such as a flat package or a plastic leaded chip carrier package. It may be something that is done.

In the above explanation, the invention made by the present inventor was mainly applied to the field of application, which is a lead frame press molding machine used for manufacturing so-called semiconductor devices, but the present invention is not limited to this. , it can also be applied to lead frame press molding machines used for other electronic parts manufactured using the lead frame method.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In other words, it is a press molding machine that punches out a frame substrate provided in the form of a plate and forms it into a predetermined shape, with a general-purpose block that molds a general-purpose shape part, and a general-purpose block that can be exchanged for each product type and molds a specific shape for each product type. By adopting a press molding machine structure with a mold divided into individual blocks,
It is now possible to easily mold lead frames for a wide variety of products by simply replacing the individual blocks of the mold, improving mold manufacturing efficiency and reducing mold manufacturing costs.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a lead frame press molding machine according to an embodiment of the present invention, and FIG. 2 is a plan view showing an example of a lead frame molded by the lead frame press molding machine according to this embodiment. be.

Claims (1)

[Scope of Claims] 1. A press molding machine that punches out a frame substrate provided in the form of a plate and forms it into a predetermined shape, which includes a general-purpose block that molds a general-purpose shape part, and a press molding machine that is replaceable for each product type and that can be replaced for each product type. A press molding machine equipped with a mold that is divided into individual blocks and molds that mold specific shapes. 2. Press molding according to claim 1, wherein the general-purpose block of the mold forms an outer lead region of the lead frame, and the individual blocks form an inner lead region. Machine.