JPS61102505A - Lighting device - Google Patents

Lighting device

Info

Publication number
JPS61102505A
JPS61102505A JP22396884A JP22396884A JPS61102505A JP S61102505 A JPS61102505 A JP S61102505A JP 22396884 A JP22396884 A JP 22396884A JP 22396884 A JP22396884 A JP 22396884A JP S61102505 A JPS61102505 A JP S61102505A
Authority
JP
Japan
Prior art keywords
objective lens
light
light source
parabolic mirror
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22396884A
Other languages
Japanese (ja)
Inventor
Mineo Nomoto
峰生 野本
Hitoshi Kubota
仁志 窪田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP22396884A priority Critical patent/JPS61102505A/en
Publication of JPS61102505A publication Critical patent/JPS61102505A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To perform efficiently the lightings of a bright visual field and dark visual field of the light emitted from a light source by using the first parabolic mirror having the light source being arranged around a collector lens as a focus and by the second parabolic mirror having the visual field of a objective lens as a focus. CONSTITUTION:One part of the radiant light from the lamp 8 of a light source is led to an objective lens 4 via a half-mirror 10 by a collector lens 14. The first parabolic mirror 15 is arranged around the collector lens 14 and installed at the position making the lighting point of the lamp 8 as a focus. The second parabolic mirror 16 is arranged around the objective lens 4 and installed at the position making the visual field of the objective lens 4 as a focus. The pattern of a wafer 1 being thus lighted is enlarged with projection by the objective lens 4 and imaged on a pattern sensor 5. In this constitution, the radiant light from the light source can be utilized effectively due to the radiant light in the optical axis direction being used for the bright visual field lighting of the radiant lights from the lamp 8 and the radiant light in vertical direction to the optical axis being used for the dark visual field lighting.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、光電顕微鏡などに併設して、被検食物体を高
照度で明視野あるは暗視野照明する装置に係るもので、
特にパターン検査装置や、寸法副長装置等の照明に好適
な照明装置に関する・ 〔発明の背景〕 この糧の照明装置は、例えばIC,LSI等の外観検査
装置や、パターン検出装置等に併設されて被検物体を照
明する。上記の照明装置においては、一般に高い照度で
被検物を照明する機能が要求される。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a device that is attached to a photoelectron microscope or the like and illuminates a test food object with bright field or dark field at high illuminance.
In particular, the present invention relates to a lighting device suitable for illuminating a pattern inspection device, a dimension sub-length device, etc. [Background of the Invention] This lighting device is installed in, for example, an external appearance inspection device such as an IC or LSI, a pattern detection device, etc. Illuminate the object under test. The above-mentioned illumination device is generally required to have a function of illuminating a test object with high illuminance.

第1図を参照しつつ従来技佑における問題点について述
べる。第1図は従来の照明装置を備えたLSI検査装置
の1例を示す概略的な光路図である。
The problems with the conventional technique will be described with reference to FIG. FIG. 1 is a schematic optical path diagram showing an example of an LSI inspection device equipped with a conventional illumination device.

被検査物体であるウニ/N 1は、ペース2に固定され
ているX−Yステージ3上に載置されている。ウェハ1
の上方には、対物レンズ4が配され、ウェハ1のパター
ンは拡大投影され、対物レンズ4の上方に設置したパタ
ーンセンサ5に結像する。一方つエバ1の回路パターン
の設計データを画像信号として記憶しである磁気テープ
6と、上記パター゛ンセンサ5の出力信号とは、欠陥判
定部7に入力されるよう、電気的に連結されている。照
明は、光源のランプ8から出た光をコーリメータレンズ
9で平行光にする。
A sea urchin/N 1, which is an object to be inspected, is placed on an XY stage 3 fixed to a pace 2. Wafer 1
An objective lens 4 is disposed above, and the pattern on the wafer 1 is enlarged and projected, and an image is formed on a pattern sensor 5 disposed above the objective lens 4. On the other hand, the magnetic tape 6 that stores the design data of the circuit pattern of the Eva 1 as an image signal and the output signal of the pattern sensor 5 are electrically connected to be input to the defect determination section 7. There is. For illumination, light emitted from a lamp 8 as a light source is converted into parallel light by a collimator lens 9.

この光路は、ハーフミラ−10によシ90°に曲げられ
て、その光軸中心近傍の光11は、対物レンズ4を通過
して、被検物ウェハ1を明視野照明する。一方光軸の外
縁部の光12は、対物レンズ4の外側を通シ、さらに反
射@!13によシ対物レンズ4の視野内を暗視野照明す
る。
This optical path is bent by a half mirror 10 at 90 degrees, and the light 11 near the center of the optical axis passes through the objective lens 4 and bright-field illuminates the wafer 1 to be inspected. On the other hand, the light 12 at the outer edge of the optical axis passes through the outside of the objective lens 4 and is further reflected @! 13, the field of view of the objective lens 4 is dark-field illuminated.

上記の明視野および暗視野照明は、ウェハの工程により
、パターン形状や表面反射率が異なるため適宜選択、あ
るいは併用して使用している。
The above-mentioned bright field and dark field illumination are selected or used in combination as the pattern shape and surface reflectance differ depending on the wafer process.

ウェハ1の検査は第2図の連続矢印Sの順序でウェハ全
面を検査する。検査のためX−Yステージ3を走査中、
パターンセンサ5と磁気テープ乙の出力信号とを欠陥判
定部7で比較し、差違が検出されれば異常部と判定する
。この検査装置は、LSIパターンの微細化に伴ない1
μm以下の欠陥を検出する必要が生じている。
The entire surface of the wafer 1 is inspected in the order of continuous arrows S in FIG. While scanning X-Y stage 3 for inspection,
The pattern sensor 5 and the output signal of the magnetic tape B are compared in the defect determination section 7, and if a difference is detected, it is determined that it is an abnormal part. This inspection equipment has been developed as
There is a growing need to detect defects smaller than μm.

このため対物レンズ4も高い解像力を持つ【/ンズ(例
えばN、Ao、8.焦点深度o、sitm、視野範囲4
00μ77りが必要であシ、上記のような対物ルンズを
用いてウェハのパターンをパターンセンサで検出するた
めには、明るい照明が必要となる。又検査を高速化する
には、パターンセンナで充電変換したパターン像の電荷
信号を高速で転送する必要があり、パターンセ/すの受
光部での蓄積時間を短かくするためにも明るい照明が必
要となる。特に第1図で示した照明方法では、明視野照
明に比べ暗視野照明の照度が低くなる欠点がある。図1
に示した暗視野照明法では、ウェハ1上に微小なパター
ン(凸起)があると、光はパターンに当って散乱し、そ
の散乱光が対物レンズに入射してパターンを検出する。
Therefore, the objective lens 4 also has a high resolving power (for example, N, Ao, 8. Depth of focus o, sitm, field of view 4
00μ77 is required, and bright illumination is required in order to detect the pattern on the wafer with a pattern sensor using the objective lens as described above. In order to speed up the inspection, it is necessary to transfer the charge signal of the pattern image charged and converted by the pattern sensor at high speed, and bright illumination is necessary to shorten the accumulation time in the light receiving section of the pattern sensor. becomes. In particular, the illumination method shown in FIG. 1 has the disadvantage that the illuminance of dark-field illumination is lower than that of bright-field illumination. Figure 1
In the dark field illumination method shown in 1, when there is a minute pattern (convexity) on the wafer 1, light hits the pattern and is scattered, and the scattered light enters the objective lens to detect the pattern.

しかしこの散乱光の光量が明視野照明に比べると極めて
少なくなるため、暗視野照明は暗くなるという問題があ
る。そこで暗視野照明輝度を極力高くしなければならな
い。
However, since the amount of this scattered light is extremely small compared to bright-field illumination, dark-field illumination has the problem of being dark. Therefore, the brightness of the dark field illumination must be made as high as possible.

さらに、対物レンズ4が照明光にさらされるため、対物
レンズ4の指示部材(図示せず)等の温度が上昇し、対
物レンズ4が熱変形を起こして、検査箇所が除々にずれ
てきたシ、倍率が変化する等の問題が生じ、検査精度を
低下させる致命的欠点もあった。
Furthermore, since the objective lens 4 is exposed to illumination light, the temperature of the indicator member (not shown) of the objective lens 4 increases, causing thermal deformation of the objective lens 4, causing the inspection point to gradually shift. , problems such as changes in magnification occurred, and there was also a fatal drawback of reducing inspection accuracy.

同、この種の装置として関連するものには、特開昭55
−85446号が拳けられるが、本発明は、ウェハ等の
試料面上に存在する微小粒子、例えば異物等の存在を顕
在化する照明方法としては有効であるが、パターンの段
差部や、パターン形状を顕在化できないという問題があ
りだ。
Related devices of this type include Japanese Patent Application Laid-open No. 55
Although the present invention is effective as an illumination method for revealing the presence of microparticles, such as foreign matter, on the surface of a sample such as a wafer, The problem is that the shape cannot be made manifest.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、従来技術の欠点をなくし、検査装置や
測長装置等の被検査、あるいは測長部を高輝度で照明し
、しかも発熱による位置ずれや、精度劣化を少なく出来
る、明暗視野照明装置を提供することにある。
The purpose of the present invention is to eliminate the drawbacks of the conventional technology, and to provide a bright and dark field of view that can illuminate the inspected object or length measuring section of an inspection device or length measuring device with high brightness, and reduce positional deviation and accuracy deterioration due to heat generation. The purpose of the present invention is to provide lighting devices.

〔発明の概要〕   ・ 本発明は上記の目的を達成するだめ、光源から放射する
光を対物レンズに尋くコレクタレンズを設けると共に、
上記光源を焦点とする第1の放物面鏡をコレクタレンズ
の周囲に配し、対物レンズの視野を焦点とする第2の放
物面鏡により、光源から発光する光を効率良く明視野お
よび暗視野照明するようにしたものであるー〔発明の実
施例〕 以下、本発明の実施例を第3図、第4図、第5図、第6
図を用いて説明する。
[Summary of the Invention] - In order to achieve the above object, the present invention includes a collector lens that directs light emitted from a light source to an objective lens, and
A first parabolic mirror with the light source as its focal point is arranged around the collector lens, and a second parabolic mirror with the field of view of the objective lens as its focal point efficiently converts the light emitted from the light source into bright field and [Embodiments of the Invention] Hereinafter, embodiments of the present invention are shown in Figs. 3, 4, 5, and 6.
This will be explained using figures.

桓3図は本発明の基本原理の説明図である。Figure 3 is an explanatory diagram of the basic principle of the present invention.

光源のランプ8から放射する光の一部をコレクタレンズ
14によシハーフミラー10を介して対物レンズ4に導
く、図中の光路では平行光で示しているが、コレクタレ
ンズ14を照明光軸方向に移動することにより、光源像
を物体面(ウェハ1の表面)に結像させるクリティカル
照明又は、光源像を対物レンズ4の後焦点に結像させる
ケーラー照明にすることもできる。
A part of the light emitted from the lamp 8 of the light source is guided to the objective lens 4 via the collector lens 14 and the half mirror 10. Although the optical path in the figure is shown as parallel light, the collector lens 14 is connected to the illumination optical axis. By moving in the direction, critical illumination in which the light source image is formed on the object plane (the surface of the wafer 1), or Kohler illumination in which the light source image is formed in the back focus of the objective lens 4, can be achieved.

又ランプ80発光点を焦点として給1の放物面鏡15を
、コレクタレンズ14の周囲に配し、さらに第2の放物
面鏡16を、対物レンズ4の周囲に配し、ウェハ1の対
物レンズ4の視野を焦点とする位置に設置する。照明さ
れたウェハ1のパターンは、対物レンズ4によって投影
拡大され、パターンセンサ5に結像する。上記構成にお
いて、ランプ8から放射する光のうち、光軸方向に放射
する光を明視野照明に用い、又光軸に垂直方向に放射す
る光を暗視野照明に用いているため、従来の装置(第1
1図)に比べ、光源からの放射光を有効に利用すること
ができる。
Further, a first parabolic mirror 15 is arranged around the collector lens 14 with the light emitting point of the lamp 80 as the focal point, and a second parabolic mirror 16 is arranged around the objective lens 4 to focus on the wafer 1. It is installed at a position where the field of view of the objective lens 4 is the focal point. The illuminated pattern on the wafer 1 is projected and magnified by the objective lens 4 and is imaged on the pattern sensor 5 . In the above configuration, among the light emitted from the lamp 8, the light emitted in the optical axis direction is used for bright field illumination, and the light emitted in the direction perpendicular to the optical axis is used for dark field illumination, so that the conventional device (1st
Compared to Figure 1), the emitted light from the light source can be used more effectively.

明視野照明については、明視野照明に利用出来る有効な
光束のみを利用しているため(第1図の従来の方法では
、コリメータレンズ9に入射する光のうち、中央部だけ
を利用している。)従来の照明法に比べてもコレクタレ
ンズのNAは同等以上となる。又暗視野照明法について
は光源の周囲から放射する光を有効に取込んで、しかも
2つの放物面鏡による照明であるため損失が少ない極め
て明るい照明となった。第1図の方法に比べると、照明
のNAで10倍以上の光を取込むことが出来た。
Regarding bright field illumination, only the effective light flux that can be used for bright field illumination is used (in the conventional method shown in Fig. 1, only the central part of the light incident on the collimator lens 9 is used. ) The NA of the collector lens is the same or higher than that of the conventional illumination method. Furthermore, the dark-field illumination method effectively captures the light emitted from the surroundings of the light source, and since the illumination is performed using two parabolic mirrors, the illumination is extremely bright with little loss. Compared to the method shown in Figure 1, we were able to capture more than 10 times as much light with the illumination NA.

第4図は光源に輝度の高いアーク灯を用いた場合の、本
発明の応用例を示したもの、である・アーク灯17の光
源を焦点として第1の放物面鏡15をアーク灯17の周
囲に配し、さらに第2の放物面鏡16を、対物レンズ4
の周囲に配し、ウェハ1の対物レンズ4の視野を焦点と
する位置に設置する。又アーク灯17の下方にはコリメ
ータレンズ17を配する。上記コリメータレンズ18の
口径は上記放物面鏡15によシ導きかれるリング状の光
束の内径よシは大きく、外径よりは小さくしておく。コ
リメータレンズ1日は、対物レンズ4の後焦点位置に上
記リング状の光が集光する様配する。上記光路の途中に
は、コリメータレンズ18により果められた光の輝度を
一様にする光学部材19(インテグレータ、拡散板、フ
ァイバ等)を配しても良い、対物レンズ4の上方にはハ
ーフミラ−20を配して、照明されたウェハ1のパター
ンをパターンセンサ5に導く。上記構成においては、高
4[のアークランプから放射する光を最大限に利用し、
ハーフミラ−20による暗視野照明の損失も除いている
ため、第3図にも増して明るい暗視野照明が出来る。一
方間視野照明についても、放物面鏡15に取込まれる取
込角の1/3を利用しているが、コリメータレンズに取
込まれる取込角はラングの垂直方向について300.水
平方向について360°となる。従来の装置(第1図)
におけるラング放射光の取込用が垂直方向60°、水平
方向60°程度であったのに比して、本実施例の取込角
は3倍である。しかも輝度の高いアーク灯を光源にして
いるため、光路の途中に輝度を一様にする光学部材19
や、ハーフミラ−20を配しても従来より極めて明るい
照明が出来る・第5図は上記の原理にもとづき、実施し
た照明装置の一例である。
FIG. 4 shows an example of application of the present invention when a high-brightness arc lamp is used as a light source.The first parabolic mirror 15 is connected to the arc lamp 17 with the light source of the arc lamp 17 as the focal point. A second parabolic mirror 16 is placed around the objective lens 4.
around the wafer 1 and set at a position where the field of view of the objective lens 4 of the wafer 1 is the focal point. Further, a collimator lens 17 is arranged below the arc lamp 17. The aperture of the collimator lens 18 is larger than the inner diameter of the ring-shaped light beam guided by the parabolic mirror 15 and smaller than the outer diameter. The collimator lens is arranged so that the ring-shaped light is focused on the back focal position of the objective lens 4. In the middle of the optical path, an optical member 19 (integrator, diffuser, fiber, etc.) may be disposed to make the brightness of the light uniformed by the collimator lens 18. Above the objective lens 4, there is a half mirror. -20 is placed to guide the illuminated pattern of the wafer 1 to the pattern sensor 5. In the above configuration, the light emitted from the high 4[ arc lamp is utilized to the maximum,
Since the loss of dark field illumination due to the half mirror 20 is also removed, brighter dark field illumination can be achieved than in FIG. On the other hand, for inter-field illumination, 1/3 of the angle of capture taken into the parabolic mirror 15 is used, but the angle of intake taken into the collimator lens is 300. It is 360° in the horizontal direction. Conventional device (Figure 1)
The angle of capture of the Lang radiation in this embodiment was about 60 degrees in the vertical direction and 60 degrees in the horizontal direction, but the angle of capture in this embodiment is three times as large. Moreover, since a high-brightness arc lamp is used as the light source, the optical member 19 that makes the brightness uniform in the middle of the optical path
Also, even if a half mirror 20 is arranged, it is possible to provide much brighter illumination than before. Fig. 5 is an example of an illumination device implemented based on the above-mentioned principle.

アーク灯17はランプホルダ21に支持されていて、放
物面鏡15は上記説明と同様に、アーク灯17の光源を
焦点としてアーク灯17の周囲に配されている。第1の
放物面鏡15で反射された光路の途中に、熱線を反射す
る(一般に600〜700nm以上の波長の光)コール
ドフィルタ22を配しである。上記の放物面鏡15、ラ
ンプホルダ21、コールドフィルタ22は、上支持枠2
3に保持されている。又コリメータレンズ18および光
学部材19は、レンズホルダ24に保持されている。さ
らに対物レンズ4、ハーフミラ−20は対物レンズホル
ダ25に保持され、上記レンズホルダ24の下方に配す
、第2の放物面鏡16は対物レンズ40周凹に配し、対
物レンズ4の視野を焦点とする位置に配しである。
The arc lamp 17 is supported by the lamp holder 21, and the parabolic mirror 15 is arranged around the arc lamp 17 with the light source of the arc lamp 17 as the focal point, as described above. In the middle of the optical path reflected by the first parabolic mirror 15, a cold filter 22 is arranged to reflect heat rays (generally light with a wavelength of 600 to 700 nm or more). The above parabolic mirror 15, lamp holder 21, and cold filter 22 are connected to the upper support frame 2.
It is held at 3. Further, the collimator lens 18 and the optical member 19 are held in a lens holder 24. Further, the objective lens 4 and the half mirror 20 are held in an objective lens holder 25, and a second parabolic mirror 16 disposed below the lens holder 24 is disposed concave around the objective lens 40, and the field of view of the objective lens 4 is It is placed at the focal point.

上記対物レンズホルダ25、放物面鏡16は下支持枠2
6に保持され、しかも上支持枠23、レンズホルダ25
、下支持枠26は互いに支持されている。対物レンズホ
ルダ25と下支持枠26には対物レンズ4で検出した反
射光をハーフミラ−20で反射してパターンセンサ5に
導くための穴20αおよび26αが設けられている・又
レンズホルダ24および対物レンズホルダ25は第6図
に示すように3ケ所で支持されていて、リング状平行光
の内、外周と同等の大きさの穴24A 、 25hが設
けられていて、放物図説15のすング状平行光を遮光し
ない様工夫しである。
The objective lens holder 25 and the parabolic mirror 16 are mounted on the lower support frame 2.
6, and the upper support frame 23 and lens holder 25
, the lower support frame 26 are mutually supported. The objective lens holder 25 and the lower support frame 26 are provided with holes 20α and 26α for reflecting the reflected light detected by the objective lens 4 on the half mirror 20 and guiding it to the pattern sensor 5. Also, the lens holder 24 and the objective As shown in FIG. 6, the lens holder 25 is supported at three places, and has holes 24A and 25h of the same size as the inner and outer peripheries of the ring-shaped parallel light, and the holes 24A and 25H are provided with holes 24A and 25H of the same size as the inner and outer peripheries of the ring-shaped parallel light. It is designed to avoid blocking parallel light.

上記構成において、アーク灯17にi 100 WH?
ランプを使用し、この輝点がら出た光は第1の放物面鏡
15によりリング状平行光となり、第2放物面鏡16で
、上記平行光を対物レンズ4の視野に集光させる。又コ
リメータレンズ18に入光した平行光は、輝度を一様に
する光学部材19を経て、対物レジ・ズの後焦点位喧に
結像して、対物レンズ4の視野を照明する。−上記の第
1の放物面鏡15で導かれたリング状の平行光の熱線は
、コールドフィルタ22で取除くことが出来る。
In the above configuration, the arc lamp 17 has i 100 WH?
Using a lamp, the light emitted from this bright spot becomes ring-shaped parallel light by a first parabolic mirror 15, and the second parabolic mirror 16 focuses the parallel light onto the field of view of the objective lens 4. . The parallel light incident on the collimator lens 18 passes through an optical member 19 that makes the brightness uniform, and forms an image at the back focal point of the objective lens, thereby illuminating the field of view of the objective lens 4. - The heat rays of the ring-shaped parallel light guided by the first parabolic mirror 15 can be removed by the cold filter 22.

リング状平行光は穴24bを通過した後、穴25bを通
過する。このため第6図に示す対物レンズホルダ250
3ケ所の支持部には、レンズホルダ2403ケ所の支持
部の影が投影されるため元は一切対部レンズホルダ25
に当らず、放物面鏡16に到達する。さらに第5図に示
した照明装置を定温化するためには、上支持枠、下支持
枠に水あるいは空気等の冷却流体を循環させる通路等を
形成して、照明装置そのものを冷却しても良い。
The ring-shaped parallel light passes through hole 24b and then through hole 25b. For this purpose, the objective lens holder 250 shown in FIG.
Since the shadows of the three supporting parts of the lens holder 240 are projected on the three supporting parts, all of the supporting parts of the lens holder 25 are originally
It does not hit the parabolic mirror 16, but reaches the parabolic mirror 16. Furthermore, in order to keep the temperature of the lighting device shown in Figure 5 constant, passages for circulating cooling fluid such as water or air may be formed in the upper and lower support frames to cool the lighting device itself. good.

又明視野および暗視野照明のいずれかだけを用いたい時
は、コールドフィルタ22の下部にシャッタを押入する
ことによシ容易に使い分けも可能である・ 〔発明の効果〕 以上詳述したように、本発明の照明装置は、検査装置や
測長装置などの照明装置として用いると、被検査部を高
照度で照明することが出来、しかも熱影響等による精度
の低下を防ぐという優れた実用効果がある・ このため上記照明装置を半導体LSI検査装置等に用い
ると、高速で信頼性の高い検査も可能となυ、LSIの
歩留シを向上出来る波及効果もある。
In addition, when it is desired to use only bright field illumination or dark field illumination, it is possible to easily switch between them by inserting a shutter into the lower part of the cold filter 22. [Effects of the Invention] As detailed above. When the lighting device of the present invention is used as a lighting device for an inspection device, a length measuring device, etc., it can illuminate the part to be inspected with high illuminance, and has an excellent practical effect of preventing a decrease in accuracy due to thermal effects, etc. Therefore, if the above-mentioned illumination device is used in a semiconductor LSI inspection device or the like, high-speed and highly reliable inspection is possible, and there is also the ripple effect of improving the yield of LSI.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の照明装置を供えた、LSI検査装置の概
略図、第2図はウェハの検査手順の説明図、第3図は本
発明の照明方法を示す基本原理の説明図、第4図は本発
明の照明方法の応用を示した構成図、第5図は本発明の
一実施例の照明装置を示す断面図、第6図は同じく光透
過部の平面図である。 1・・・・・・ウェハ 4・・・・・・対物レンズ 8・・・・・・光源 14・・・・・・コレクタレンズ 15・・・・・・放物面鏡 16・・・・・・放物面鏡 17・・・・・・アーク灯 18・・・・・・コリメータレンズ 19・・・・・・光学部材 20・・・・・・ハーフミラ− 22・・・・・・コールドフィルタ 24・・・・・・レンズホルダ 25・・・・・・対物レンズホルダ 第 3 図 第 5 図
FIG. 1 is a schematic diagram of an LSI inspection device equipped with a conventional illumination device, FIG. 2 is an explanatory diagram of a wafer inspection procedure, FIG. 3 is an explanatory diagram of the basic principle of the illumination method of the present invention, and FIG. 5 is a block diagram showing an application of the illumination method of the present invention, FIG. 5 is a sectional view showing an illumination device according to an embodiment of the present invention, and FIG. 6 is a plan view of the light transmitting section. 1... Wafer 4... Objective lens 8... Light source 14... Collector lens 15... Parabolic mirror 16... ... Parabolic mirror 17 ... Arc lamp 18 ... Collimator lens 19 ... Optical member 20 ... Half mirror 22 ... Cold Filter 24...Lens holder 25...Objective lens holder Fig. 3 Fig. 5

Claims (1)

【特許請求の範囲】[Claims] 1、レンズによる結像光学係を用いて被検物体の像を作
り、この像を光電的手段によって検知し、この検知信号
に基ずいて被検物体の位置、形状を認識する装置に併設
する照明装置において、前記被検物体を照明するための
光源と、光源から放射する光を、上記被検物体を投影す
るレンズに導くコレクタレンズと、上記光源に焦点を合
わせて、コレクタレンズの周囲に設置した第1の放物面
鏡と、上記第1の放物面鏡からのリング状平行光を受け
、上記対物レンズの視野に集光する第2の放物面鏡とか
ら成ることを特徴とした照明装置。
1. Create an image of the object to be examined using an imaging optical system using a lens, detect this image by photoelectric means, and install it in a device that recognizes the position and shape of the object based on this detection signal. The illumination device includes a light source for illuminating the test object, a collector lens that guides light emitted from the light source to a lens that projects the test object, and a light source that focuses the light source and projects the light around the collector lens. It is characterized by comprising a first installed parabolic mirror and a second parabolic mirror that receives the ring-shaped parallel light from the first parabolic mirror and focuses it on the field of view of the objective lens. lighting equipment.
JP22396884A 1984-10-26 1984-10-26 Lighting device Pending JPS61102505A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22396884A JPS61102505A (en) 1984-10-26 1984-10-26 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22396884A JPS61102505A (en) 1984-10-26 1984-10-26 Lighting device

Publications (1)

Publication Number Publication Date
JPS61102505A true JPS61102505A (en) 1986-05-21

Family

ID=16806502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22396884A Pending JPS61102505A (en) 1984-10-26 1984-10-26 Lighting device

Country Status (1)

Country Link
JP (1) JPS61102505A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106506A (en) * 1986-06-12 1988-05-11 Matsushita Electric Ind Co Ltd Method and apparatus for illuminating parts for recognition
JPS6384556U (en) * 1986-11-25 1988-06-02
JPH01116437A (en) * 1987-10-01 1989-05-09 Gretag Ag Measuring head for photoelectric measuring apparatus
JPH03235010A (en) * 1990-02-13 1991-10-21 Iwaki Denshi Kk Visually inspecting instrument and illuminator for use in the same
EP0989911A1 (en) * 1997-06-18 2000-04-05 The Regents Of The University Of California Specimen illumination apparatus with optical cavity for dark field illumination and methods of use
DE10064233C1 (en) * 2000-12-22 2002-05-29 Xetos Ag Optical system consists of a reflector with a parabolic surface, a collector lens, and primary and secondary openings
USRE37740E1 (en) 1988-02-19 2002-06-11 Kla-Tencor Corporation Method and apparatus for optical inspection of substrates
JP2006029955A (en) * 2004-07-15 2006-02-02 Hitachi High-Technologies Corp Visual examination method and visual examination device
JP2012251853A (en) * 2011-06-02 2012-12-20 V Technology Co Ltd Dimension measuring instrument
JP2016133473A (en) * 2015-01-22 2016-07-25 株式会社トプコン Optical analysis device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106506A (en) * 1986-06-12 1988-05-11 Matsushita Electric Ind Co Ltd Method and apparatus for illuminating parts for recognition
JPS6384556U (en) * 1986-11-25 1988-06-02
JPH0531560Y2 (en) * 1986-11-25 1993-08-13
JPH01116437A (en) * 1987-10-01 1989-05-09 Gretag Ag Measuring head for photoelectric measuring apparatus
USRE37740E1 (en) 1988-02-19 2002-06-11 Kla-Tencor Corporation Method and apparatus for optical inspection of substrates
JPH03235010A (en) * 1990-02-13 1991-10-21 Iwaki Denshi Kk Visually inspecting instrument and illuminator for use in the same
EP0989911A4 (en) * 1997-06-18 2006-03-01 Univ California Specimen illumination apparatus with optical cavity for dark field illumination and methods of use
EP0989911A1 (en) * 1997-06-18 2000-04-05 The Regents Of The University Of California Specimen illumination apparatus with optical cavity for dark field illumination and methods of use
DE10064233C1 (en) * 2000-12-22 2002-05-29 Xetos Ag Optical system consists of a reflector with a parabolic surface, a collector lens, and primary and secondary openings
JP2006029955A (en) * 2004-07-15 2006-02-02 Hitachi High-Technologies Corp Visual examination method and visual examination device
JP2012251853A (en) * 2011-06-02 2012-12-20 V Technology Co Ltd Dimension measuring instrument
JP2016133473A (en) * 2015-01-22 2016-07-25 株式会社トプコン Optical analysis device
US10557791B2 (en) 2015-01-22 2020-02-11 Topcon Corporation Optical Analyzer

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