JPS61102049U - - Google Patents

Info

Publication number
JPS61102049U
JPS61102049U JP1984187855U JP18785584U JPS61102049U JP S61102049 U JPS61102049 U JP S61102049U JP 1984187855 U JP1984187855 U JP 1984187855U JP 18785584 U JP18785584 U JP 18785584U JP S61102049 U JPS61102049 U JP S61102049U
Authority
JP
Japan
Prior art keywords
mounting board
semiconductor
shape
semiconductor devices
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984187855U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0311891Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984187855U priority Critical patent/JPH0311891Y2/ja
Publication of JPS61102049U publication Critical patent/JPS61102049U/ja
Application granted granted Critical
Publication of JPH0311891Y2 publication Critical patent/JPH0311891Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1984187855U 1984-12-11 1984-12-11 Expired JPH0311891Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984187855U JPH0311891Y2 (cg-RX-API-DMAC7.html) 1984-12-11 1984-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984187855U JPH0311891Y2 (cg-RX-API-DMAC7.html) 1984-12-11 1984-12-11

Publications (2)

Publication Number Publication Date
JPS61102049U true JPS61102049U (cg-RX-API-DMAC7.html) 1986-06-28
JPH0311891Y2 JPH0311891Y2 (cg-RX-API-DMAC7.html) 1991-03-20

Family

ID=30745325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984187855U Expired JPH0311891Y2 (cg-RX-API-DMAC7.html) 1984-12-11 1984-12-11

Country Status (1)

Country Link
JP (1) JPH0311891Y2 (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPH0311891Y2 (cg-RX-API-DMAC7.html) 1991-03-20

Similar Documents

Publication Publication Date Title
JPS60118252U (ja) 樹脂封止半導体装置用リ−ドフレ−ム
JPS61102049U (cg-RX-API-DMAC7.html)
JPS61102050U (cg-RX-API-DMAC7.html)
JPS6413144U (cg-RX-API-DMAC7.html)
JPS62134254U (cg-RX-API-DMAC7.html)
JPH0353853U (cg-RX-API-DMAC7.html)
JPS6192064U (cg-RX-API-DMAC7.html)
JPH0268452U (cg-RX-API-DMAC7.html)
JPS61182036U (cg-RX-API-DMAC7.html)
JPS6166955U (cg-RX-API-DMAC7.html)
JPS61111160U (cg-RX-API-DMAC7.html)
JPS6170938U (cg-RX-API-DMAC7.html)
JPS6247171U (cg-RX-API-DMAC7.html)
JPS6127337U (ja) 半導体装置用ヘツダ
JPS6382948U (cg-RX-API-DMAC7.html)
JPS5889946U (ja) 半導体装置
JPS6274336U (cg-RX-API-DMAC7.html)
JPS6073235U (ja) 半導体装置
JPS60137435U (ja) 半導体装置
JPS6289157U (cg-RX-API-DMAC7.html)
JPH0330437U (cg-RX-API-DMAC7.html)
JPS61114842U (cg-RX-API-DMAC7.html)
JPS6413145U (cg-RX-API-DMAC7.html)
JPH01104720U (cg-RX-API-DMAC7.html)
JPH044767U (cg-RX-API-DMAC7.html)