JPS61100167U - - Google Patents
Info
- Publication number
- JPS61100167U JPS61100167U JP18571084U JP18571084U JPS61100167U JP S61100167 U JPS61100167 U JP S61100167U JP 18571084 U JP18571084 U JP 18571084U JP 18571084 U JP18571084 U JP 18571084U JP S61100167 U JPS61100167 U JP S61100167U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- wiring board
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１の実施例の混成集積回路
装置を示す斜視図、第２図は本考案の第２の実施
例の混成集積回路装置を示す平面図、第３図は第
２図のＡ―Ａ′線に沿つて切断しその断面を見た
断面図である。
尚図において、１，１′，４……セラミツク配
線基板、２，２′……厚膜配線パターン、３′３
″，３……溝部、５……搭載部品、６……外装
樹脂。
FIG. 1 is a perspective view showing a hybrid integrated circuit device according to a first embodiment of the present invention, FIG. 2 is a plan view showing a hybrid integrated circuit device according to a second embodiment of the present invention, and FIG. FIG. 3 is a cross-sectional view taken along the line AA' in the figure. In the figure, 1, 1', 4...ceramic wiring board, 2, 2'...thick film wiring pattern, 3'3
″, 3...Groove portion, 5...Mounted parts, 6...Exterior resin.
Claims (1)
ラミツク配線基板に、溝を設けたことを特徴とす
る混成集積回路装置。 A hybrid integrated circuit device characterized in that a groove is provided in a ceramic wiring board on which semiconductor elements, passive elements, wiring, etc. are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18571084U JPS61100167U (en) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18571084U JPS61100167U (en) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100167U true JPS61100167U (en) | 1986-06-26 |
Family
ID=30743176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18571084U Pending JPS61100167U (en) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100167U (en) |
-
1984
- 1984-12-07 JP JP18571084U patent/JPS61100167U/ja active Pending