JPS61100136U - - Google Patents

Info

Publication number
JPS61100136U
JPS61100136U JP1984185694U JP18569484U JPS61100136U JP S61100136 U JPS61100136 U JP S61100136U JP 1984185694 U JP1984185694 U JP 1984185694U JP 18569484 U JP18569484 U JP 18569484U JP S61100136 U JPS61100136 U JP S61100136U
Authority
JP
Japan
Prior art keywords
bonding
lead frame
mounting table
elastic material
frame mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984185694U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025536Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185694U priority Critical patent/JPH025536Y2/ja
Publication of JPS61100136U publication Critical patent/JPS61100136U/ja
Application granted granted Critical
Publication of JPH025536Y2 publication Critical patent/JPH025536Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP1984185694U 1984-12-07 1984-12-07 Expired JPH025536Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (en:Method) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (en:Method) 1984-12-07 1984-12-07

Publications (2)

Publication Number Publication Date
JPS61100136U true JPS61100136U (en:Method) 1986-06-26
JPH025536Y2 JPH025536Y2 (en:Method) 1990-02-09

Family

ID=30743159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185694U Expired JPH025536Y2 (en:Method) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPH025536Y2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313834A (ja) * 2001-04-16 2002-10-25 Sanken Electric Co Ltd ボンディングステージ、ワイヤボンダ及び回路基板実装体の実装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53159271U (en:Method) * 1977-05-20 1978-12-13
JPS542370U (en:Method) * 1977-06-08 1979-01-09
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53159271U (en:Method) * 1977-05-20 1978-12-13
JPS542370U (en:Method) * 1977-06-08 1979-01-09
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313834A (ja) * 2001-04-16 2002-10-25 Sanken Electric Co Ltd ボンディングステージ、ワイヤボンダ及び回路基板実装体の実装方法

Also Published As

Publication number Publication date
JPH025536Y2 (en:Method) 1990-02-09

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